Fujitsu Corporation

Fujitsu Kasei Limited

Katsura Adachi

Kota Nishii

Kouichi Kimura

Makoto Usui

Junichi Sato

Toshihiro Kobayashi

Masanobu Ishizuka

Kazuyuki Tamura

Takashi Muraya

Norio Sawatari

Hiroki Uchida

Isao Watanabe

Kazumasa Saito

Masanobu Ishizuki

A box-shaped plastic housing of integrally molded resin comprises a flat-shaped bottom wall having a peripheral edge and an upright wall extending upwardly from the peripheral edge of the bottom wall. The bottom wall and the upright wall cooperatively define an integral box-shaped molded product. The thickness of the bottom wall is in the range of two-thirds to one-third with respect to the thickness of the upright wall. The bottom wall is provided with at least one rib on its inner surface. The housing is produced by an injection molding process using a mold having a mold cavity which is provided with a groove on the inner surface of the cavity corresponding to each rib.

Box-shaped plastic housing of integrally molded resin

An electronic apparatus comprising a housing, and an electronic part accommodated in the housing, wherein the housing includes a metallic member and a resin member molded integrally with the metallic member, the metallic member forming an outside part of the housing and being treated on its outer surface for enhancing a coefficient of heat radiation.

Electronic apparatus, housing for electronic apparatus and housing

A polyamide resin composition including 100 parts by weight of a resin composition containing of 20 to 80% by weight of an aromatic polyamide resin and 80 to 20% by weight of a modified polyphenylene ether resin (the total amount in% by weight of the aromatic polyamide resin and the modified polyphenylene ether resin being 100% by weight) and, incorporated in the resin composition, 0.5 to 30 parts by weight of a liquid-crystalline polymer, 0.01 to 3 parts by weight of a compatibilizing agent and 2 to 40 parts by weight of an inorganic filler and optionally a rubber component. The plate thickness of the resin molded articles may be reduced to 2 mm or less, and even further to 1 mm or less without deterioration of the properties thereof.

Polyamide resin composition and housing for electronic equipment

A polyamide resin composition including 100 parts by weight of a resin composition containing of 20 to 80% by weight of an aromatic polyamide resin and 80 to 20% by weight of a modified polyphenylene ether resin (the total amount in % by weight of the aromatic polyamide resin and the modified polyphenylene ether resin being 100% by weight) and, incorporated in the resin composition, 0.5 to 30 parts by weight of a liquid-crystalline polymer, 0.01 to 3 parts by weight of a compatibilizing agent and 2 to 40 parts by weight of an inorganic filler and optionally a rubber component. The plate thickness of the resin molded articles may be reduced to 2 mm or less, and even further to 1 mm or less without deterioration of the properties thereof.

An injection molding process for producing an integrally molded box-shaped plastic housing of a resin material. The housing includes integral portions of a bottom wall of a first thickness and an upright wall of a second thickness, the first thickness being in the range of from one-third to two-thirds of the second thickness and the bottom wall portion including at least one integral rib structure. A cavity is formed in a mold having cavity portions, respectively corresponding to the bottom and upright wall portions and the rib structure, in fluid communication. Fluid resin is injected through respective injection gates directly communicating with the rib structure cavity portion and the upright wall cavity portion, which provide passageways for flow of the liquid resin therethrough, thereby completely filling all cavity portions. Cavity portions corresponding to cylindrical bosses formed on the rib structures further are provided and knockout pins extend through the mold in alignment with the cylindrical bosses to release the secured housing from the mold. Porous knockout pins extend through the mold and communicate with bounded regions of the bottom wall cavity portion for selective release of gas therefrom, to assure complete filling thereof with liquid resin; the pins are actualable as ejector pins for releasing the cured housing from the mold.

Injection molding process for producing a box-shaped plastic housing

Flame retardation of 1,2-polybutadiene based upon the use of halogenated bisphenol bisacrylate reactive flame retardants, for example, 2,2-bis(4-methacryloyl-3,5-dibromophenyl)-propane. Flame retardancy performance of UL 94 V-0 or V-1 has been achieved without impairing desirable dielectric properties and heat resistance inherently possessed by 1,2-polybutadiene. If an aromatic bismaleimide modifier, for example, N,N'-4,4'-diphenylmethane bismaleimide, is jointly used, a thermal expansion coefficient less than a half of the thermal expansion coefficient of cured 1,2-polybutadiene can be achieved.

Growing community of inventors

Sagamihara, Japan

Katsura Adachi