Screen Holdings Co., Ltd.

Katsunori Tanaka

Kazuki Nakamura

Takashi Shinohara

Nobuyasu Hiraoka

Masahiro Nonomura

Wataru Yano

A control device is provided which, at a time of upper surface treatment for treating an upper surface of a substrate with a treating device, supplies a treating liquid from a treating liquid supply source and operates a first control valve to supply a gas at a first flow rate from a gas nozzle, while operating a rotary drive device to spin the substrate at a first rotational frequency, and at a time of drying treatment, after completion of the upper surface treatment, for drying the substrate by increasing the rotational frequency of the rotary drive device to spin the substrate at a second rotational frequency, operates the first control valve and second control valve to supply the gas at a higher flow rate than the first flow rate from the gas nozzle.

Substrate treating apparatus and substrate treating method

A substrate cleaning brush for cleaning a wafer includes a brush main body, a brush holding unit, and a main flow path forming body. The brush main body has a liquid permeable structure and includes a lower surface that comes into contact with a substrate. The brush holding unit holds the brush main body while exposing a distal end portion in a vertical direction of the brush main body to the outside. The main flow path forming body includes a main flow path and a plurality of sub flow paths. The main flow path is formed to allow a processing liquid supplied from the outside to pass therethrough. The plurality of sub flow paths branch off from the main flow path, extend outward in a width direction perpendicular to the vertical direction of the brush main body, and are connected to an upper surface of the brush main body.

Growing community of inventors

Kyoto, Japan

Katsunori Tanaka