Fuji Corporation

Fuji Machine Mfg. Co., Ltd.

Katsunori Tanaka

Tsuyoshi Hamane

Nobuyuki Ishikawa

Noriaki Iwaki

Kazuya Degura

Mitsuhiro Nishibori

In a component mounter provided with a holding tool configured to hold leaded component, a moving device configured to move the holding tool, and an imaging device configured to image a leaded component held by the holding tool, the lengths of the pair of leads of leaded component are different. With respect to this, operation of the moving devices is controlled based on imaging data of the leaded component captured by the imaging device, and the tip section of long lead of the pair of leads of the leaded component held by the holding tool is inserted in a through-hole. Next, leaded component is moved such that short lead is positioned above a through-hole, and the short lead is inserted into the through-hole. That is, the pair of leads are inserted into the through-holes in order of proximity of the tips to circuit board, closer leads being inserted earlier.

Board work machine and insertion method

In a component mounter including a component holding tool configured to hold lead of a lead component, a position of mark given to the component holding tool and a position of a distal end of the lead are calculated based on captured image data, and when a distance between the position of the mark and the position of the distal end of the lead is smaller than a threshold, mounting work is performed, whereas when the distance is equal to or greater than the threshold, the mounting work is not performed. As a result, for example, mounting work on a lead component having a lead which is greatly bent can be avoided, thereby ensuring proper mounting work.

Operation machine to control holding head

A component determination device and a component determination method for an electronic component, the component including a reference section formed as a different member to the multiple electrodes. The component determination device includes: a measuring device configured to measure positions of multiple reference points set on the reference section and a position of a measurement point set on each of the multiple electrodes; a plane calculating section configured to calculate a reference plane representing a position of the upper surface of the circuit board with respect to the component main body when the electronic component is mounted on the circuit board based on the positions of the multiple reference points; and a suitability determining section configured to determine whether the electronic component is suitable based on a distance between the reference plane and the multiple measurement points.

Component determination device and component determination method

The movement time of a board is shortened in an electronic component mounting device that performs heating and component mounting. Heating and component mounting are performed as a board is moved in the direction of arrow A; the board is moved by an in-conveyor device in the heating region, and by a shuttle device on rails in the component mounting region. When comparing chains with rails, the friction generated between the board is smaller with chains, thus the movement speed of the in-conveyor is faster. This means, compared to a case in which the board is moved by the rails and shuttle device in both the heating region and the component mounting region, the movement time of the board is shorter. Also, because there are no chains below the rails, the movable range of a flow tank is larger, and the component mountable region is larger.

Electronic component mounting device

Maintenance of a flow tank is facilitated. A sub-module is provided adjacent to a main module. A board is introduced in the sub-module, and is heated by a heater that is at a heating position, is moved to the main module, solder is applied by a flow tank in parallel with insertion of a component by a component insertion device, and thereby the component is mounted. If a maintenance condition is established, introduction of boards is stopped, the heater is moved to a standby position, and the flow tank is moved to a maintenance position of the sub-module. Maintenance is performed on the flow tank and since the component insertion device is not present above the flow tank, it is possible to facilitate inspection, removal, and the like of the flow tank.

Solder housed in flow tankis ejected from nozzleby a pump provided inside flow tank. Jet motorthat drives the pump is provided outside flow tank, and cooling deviceis provided between flow tankand jet motor. Cooling deviceincludes cooling pipethat is formed folded back on itself. Nitrogen gas is supplied from an upper end of cooling pipe, flows along cooling pipe, and flows out of a lower end of cooling pipeso as to be supplied to flow tank. The temperature of the nitrogen gas increases due to heat dissipated from jet motor, thus lowering the temperature of jet motor. Heat is transferred from jet motorto the nitrogen gas, and jet motoris cooled satisfactorily.

Growing community of inventors

Kasugai, Japan

Katsunori Tanaka