Mitsubishi Denki Kabushiki Kaisha

Katsunori Ochi

Syojiro Kodai

Tetsuro Washida

Osamu Murakami

Shigeo Onoda

Jun Ohbuchi

Makoto Kobayashi

Tuguo Kurisu

Fumiaki Baba

Makoto Omori

Shojiro Kodai

Seiji Takemura

Kenji Kimura

Kazuhiko Kurafuchi

Yasuhiro Murasawa

Kiyotaka Nishino

Yoshiyuki Ishimaru

An IC card, and manufacturing method thereof, are provided in which a pair of upper and lower metal panels are fixed to the top and bottom surfaces of a resin frame. Projections projecting upward or downward and having a given height are formed at a given distance from the outside edges of the frame. Cut-outs capable of fitting on the projections are provided on the metal panels, and the metal panels are assembled on the top and bottom surfaces of the frame with the cut-outs fitted on the corresponding projections. A portion of each projection is then deformed by pressing on the metal panels from above or below under a predetermined condition so that the metal panels are riveted to the frame.

IC card and manufacturing method thereof

A module mounted in relative high density with semiconductor devices is disclosed. The module includes a mounting substrate which has a hole section; a first semiconductor device having bump electrodes which protrude from one principal surface of a package and lead terminals electrically connected to the bump electrodes; a second semiconductor device which also has bump electrodes that can be structurally and electrically coupled with the bump electrodes of the first semiconductor device and where this second semiconductor device is able to be located in the hole section of the mounting substrate, and where the first semiconductor device is able to be supported on the mounting substrate through the lead terminals; and where the bump electrodes of both semiconductor devices are electrically connected to each other.

Module mounted with semiconductor device

An IC card (1) has a shape of a substantially flat rectangular parallelepiped. The IC card (1) has electronic devices (2) including integrated circuits, a substrate (3) and a frame (5) for supporting the electronic devices (2), a first panel (6c) covering the upper surface of the frame (5), and a second panel (6d) covering the lower surface of the frame (5). Hereupon, the first panel (6c) is directly mounted to the frame (5) in such a manner that each of the left and right end portions (15) of the first panel (6c) is bent twice in accordance with the outer surface of the frame (5) and further each of edges of the left and right end portions (15) is fastened to the lower surface of the frame (5).

IC card of simple structure

A semiconductor device is formed of stacked first and second semiconductor substrates each having internal circuits which are packaged within a package having a plurality of bump electrodes on the top and bottom principal planes. The bump electrodes on the top principal plane of the package are electrically connected to the internal circuits of the first semiconductor substrate and the bump electrodes on the bottom plane of the semiconductor substrate are electrically connected to the internal circuit of the second semiconductor substrate with the first and second semiconductor substrates arranged in mirror symmetry both physically with respect to each other and with respect to signals to be input into or output from the internal circuits. Module structures using a plurality of the semiconductor devices mentioned above are also described.

Semiconductor device with a package having a plurality of bump

IC card of the present invention consists of a frame including a rectangular bottom plate and a U-shaped side wall along the three edges of the bottom plate; a connector fixed to the open side of the frame with the U-shaped side wall; a board module at least one including printed-circuit boards with electronic components mounted thereon, combined with the connector, and inserted in the frame; and a metal panel for sealing off the board module inside the frame with the connector fixed thereto.

IC card

A semiconductor integrated circuit device includes a semiconductor integrated circuit chip, a IC package enclosing the semiconductor integrated circuit chip, lead terminals, and dummy terminals. The lead terminals are partly embedded in the IC package side by side along its opposed sides, and the dummy terminals are partly embedded in the IC package at both ends of a line of the lead terminals. These terminals are electrically connected with the circuit formed in the chip. One end of each terminal protrudes from either of the opposed sides of the IC package and has a connection to be connected with terminal electrodes of a packaging substrate. The dummy terminals are made wider and/or longer than the lead terminals so as to make their connections larger than those of the lead terminals, thereby enhancing their reliability in point of machine-resistance and heat-resistance.

Terminal configuration in semiconductor IC device

A method of producing a thin IC card having a built-in battery includes forming a through-hole including an edge in a circuit board having obverse and reverse main surfaces, a circuit pattern being present on a first of the main surfaces of the circuit board; mounting a functional part on the first of the main surfaces of the circuit board; molding said circuit board and said functional part in a resin with a second main surface of said circuit exposed and forming a battery lodging section in the resin molding defined by the through-hole; and mounting a battery in said battery lodging section and electrically connecting the circuit pattern to the battery.

Method of making IC card

An IC card comprises a module with an electric circuit and two panels adhered to each other to cover the module between them. The two panels are adhered with an adhesive with a sufficient adhesion strength and seals the module with no path of air to the outside of the IC card. Airtight sealing of the IC card in realized in various ways. For example, a groove having a varying width is provided in one of the panels for applying an adhesive, while a groove engaging to the groove is provided in the other of the panels. When the two panels are adhered to each other, gas channels may be formed in the groove at portions with narrower widths, while an adhesive in the groove at portions with wider widths fills the gas channels due to viscosity. In another way, a protrusion provided in one of the panels has an edge opposite to a groove provided in the other of the panels. Thus, the groove is kept air-tight. In a different way, an adhesive having a high viscosity at curing temperature is used. In a still different way, all the space inside the IC card is filled, or a sufficient amount of an adhesive is filled in a space between the two panels around a peripheral thereof. In a further way, the panels are adhered in a thermostat. In a still further way, the panels are adhered with melting at a peripheral thereof.

A thin IC card includes a circuit board on which functional parts are mounted and a through-hole defining an edge of a battery lodging section in which a battery is disposed, the circuit board being embedded in a molding-resin section with the reverse surface of the board exposed. The battery lodging section is aligned with the through-hole of the circuit board. Electrical connections between the circuit board and the battery are effected in a recess or cutouts in the circuit board. The battery is embedded in the lodging section using an expandable resin to make the card surface flat.

Thin IC card

An IC card including an electric circuit board and have face and back metallic panels that include a housing and are attached to a resin frame. The IC card has a discharge pattern formed on the electric circuit board for discharging static electricity applied to the metallic panels, a conductor elastically disposed between one of the metallic panels and the discharge pattern for electrically coupling one of the metallic panels with the discharge pattern, and a ground pattern formed on the electric circuit board with the ground pattern separated by a given distance A from the discharge pattern for routing the static electricity to a card connector. The given distance A is a distance necessary for the static electricity to start discharging at a given voltage. A given distance needed for discharge can be maintained precisely through a simple manufacturing process. A fluctuation in discharge start voltage can therefore be minimized. This results in a highly reliable product.

IC card with a discharge pattern and a ground pattern separated from

A method for producing an IC card including filling a confined space with a mixture including a foaming resin, the mixture having not been foamed yet, the space being confined by a frame having cut-out portions on inner edges and at least one through-hole passing through the frame in the lateral direction between the inside and the outside of the frame, a circuit board on which functional components are mounted and having edges fitted to one of the cut-out portions of the frame so that the surface of the circuit board on which functional components are mounted faces inward, the frame and the circuit board forming a substantially flat outer surface, and a thin plate having edges fitted to another of the cut-out portions of the frame with the thin plate opposing the circuit board, the frame and the thin plate forming a substantially flat outer surface; foaming the mixture at a predetermined temperature for a predetermined time, thus filling the confined space with foamed resin, and thus making the foamed resin a structural member having mechanical strength, molding the frame, the circuit board, and the thin plate into one body; and removing excess foamed resin from the through-hole in the frame.

An IC card production method includes the steps of mounting a card board (12) having a through opening onto a lower mold (16) of molding dies (15), mounting a semiconductor module (2) onto the opening of said card board (12), tightening an upper die (17) of the molding dies (15) having a gate (19) onto a lower die (16), and molding by injecting resin (13) into the opening from the gate (19) in a state in which only an electrode terminal face (7) for external connection of the semiconductor module (2) is exposed. The IC card includes a card board (12) having a through opening, a semiconductor module (2) mounted onto this opening, and a molded resin (13) injected into said opening so that the resin moding is formed under such condition that only an electrode terminal face for external connection (7) of said semiconductor module (2) is made to expose.

Production method for an IC card

An IC card includes: a circuit board on which functional components are mounted; and a frame covered with a thin plate, the circuit board being disposed in the frame, the inside of the frame being filled with a foamed resin. As a result of the above arrangement, an IC card having a strong resistance to various external forces is produced. Furthermore, because it is possible to incorporate a surface material with a design in an integrally molded device, thus it is also possible to produce an IC card device having an excellent appearance.

IC card including frame with lateral hole for injecting encapsulating

A semiconductor device having a rectangular COB substrate body, a die pad on the surface of the substrate body, a plurality of outer leads at the periphery of the substrate body, a plurality of wiring patterns on the surface of the substrate body connected to corresponding outer leads, a plurality of inner leads on the surface of the substrate body surrounding the die pad, connected to corresponding outer leads by the corresponding wiring patterns, and arranged in a substantially rectangular shape having sides, each respectively forming a predetermined acute angle with respect to a corresponding side of the substrate body whereby intervals between adjacent wiring patterns are longer than a predetermined length, a semiconductor chip having a plurality of electrode pads and mounted on the die pad, and a plurality of wires establishing electrical connections between the plurality of electrode pads of the semiconductor chip and corresponding inner leads.

High density semiconductor device having inclined chip mounting

In an IC card and a manufacturing method therefor, an adhesive is applied between core layers in the vicinity of an opening in which an IC module is placed. The core sheet layers held between adhesive layers can easily be deformed when heat and pressure are applied. Therefore, a gap formed between the card substrate and the IC module is filled. Furthermore, the gap from the IC module is narrower at the corners of the IC module than conventionally shaped openings. As a result, gaps at the corners of the IC module after integral molding are prevented. Therefore, the gap between the IC module and the card substrate can be reliably filled during molding.

Growing community of inventors

Itami, Japan

Katsunori Ochi