Sharp Kabushiki Kaisha Corporation

Katsunori Makiya

Kazuo Kusuda

The invention provides a lead frame size requiring a reduced area, and a package reduced in size. Adjacent light couplings have an insulating and light shielding element disposed therebetween to block a light transmission from one to the other. The insulating and light shielding element allows the light couplings to be arranged close together while preventing crosstalk occurring therebetween. In another construction, a primary light coupling section and a secondary light coupling section are formed around each light emitting element on the primary side and each light receiving element on the secondary side. The primary and secondary light coupling sections are optically interconnected through an insulating and light transmitting element. This construction realizes optical paths of reduced volume, and secures a sufficient distance for preventing crosstalk even where adjacent light couplings are arranged with a reduced distance therebetween.

Light coupled device with insulating and light shielding element and light insulating and transmitting element

An optoelectronic device comprising: a plurality of light emitting elements; light receiving elements, each light receiving element facing a light emitting element; a lead made of a thin metal plate and having the light receiving elements fixed thereon, the lead being connected by wires to ground electrodes provided on the light receiving elements; a plurality of ground terminals common to the light receiving elements and integrated with the lead; an inner package, made of translucid resin, for separately sealing each pair of the facing light emitting elements and light receiving elements; and a package, made of resin having light interrupting properties, for sealing the entire inner package. Also, a metal mold that can simultaneously mold a plurality of the inner packages; and a manufacturing method of the optoelectronic device using the metal mold, comprising the steps of: molding the inner package; and then molding the package. Accordingly, a miniature optoelectronic device which has a small number of terminals and in which no crosstalk occurs can be achieved and efficiently manufactured.

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Nara, Japan

Katsunori Makiya