Yamamoto-ms Co., Ltd.

Mitsubishi Heavy Industries Limited

Katsunori Akiyama

Kazutaka Mori

Ikuo Okada

Taiji Torigoe

Wataru Yamamoto

Ichiro Nagano

Kimiko Koiwa

Masazumi Ishiguro

Yoshiaki Hoshino

Sunao Aoki

Toyoaki Yasui

Shunichi Morishima

Toshiya Watanabe

Satoshi Ota

Koichi Akagi

Yukio Takeuchi

Yasuhiko Tsuru

Masato Shida

Yukio Kodama

Chiaki Yasuda

Masakatsu Fujita

Chikako Suzuki

Fumio Harada

Junya Michinishi

Shuichi Kajiwara

Taiji Kikuchi

Yutaka Tsuru

There is provided a plating apparatus capable of suitably measuring a micro-throwing power. A first plating apparatus (A) includes: a first anode (A) disposed in a first plating bathtub (A); an insulating substrate () having a hole () and disposed in the first plating bathtub (A); a pair of first cathodes (AX,AY), each cathode being provided in the insulating substrate () at a bottom portion of the hole () and at a surface on an opening side of the hole (); a first plating power source (A) configured to supply an electric current between the first anode () and the pair of first cathodes (AX,AY); and a first electric current measuring circuit (A) configured to measure respective values of electric currents flowing through the pair of first cathodes (AX,AY).

Plating apparatus and plating system

An object is to provide a composite material manufacturing method for improving interlayer strength. The present disclosure provides a composite material manufacturing method of laminating a plurality of prepregs () formed of a fiber reinforced base material impregnated with an uncured matrix resin and performing hot molding, the method including: using the prepregs () each provided with a gap layer () that does not contain a resin and is continuous in an in-plane direction and resin layers () disposed on both surfaces of the gap layer; disposing a plurality of short fibers () on facing surfaces of the prepregs () that are adjacent to each other; and evacuating the laminated prepregs () to degas the gap layer () and then performing hot molding.

Composite material manufacturing method and composite material

A plating apparatus capable of preventing difference in an electrode potential between the pair of cathodes and a disturbance in a current distribution in Haring cell test and so on is provided. A plating apparatus () has an anode () and a pair of cathodes (X) (Y) which are provided in a plating bathtub (); a plating power source () to supply an electric current between the anode () and the pair of cathodes (X) (Y); and a feedback circuit () to have an electrode potential of a first cathode (X) equal to an electrode potential of a second cathode (Y) while a summation of electric currents flowing through the pair of cathodes (X) (Y) is kept constant.

Plating device

A plating device comprising: a water tank into which a plating solution is poured; a tubular nozzle being disposed in the water tank and serving as an anode; a to-be-plated object being disposed in the water tank so as to be opposed to the nozzle and serving as a cathode; a direct-current power source to apply a voltage between the nozzle and the to-be-plated object; and a pump to circulate the plating solution such that the plating solution poured into the water tank passes through the nozzle and is ejected onto the to-be-plated object. A perforated plate member, which includes a through-hole having a smaller diameter than the inside diameter of the nozzle, is arranged on the inflow side of the nozzle such that the through-hole is opposed to an open region of the nozzle.

There is provided a through-hole manufacturing method for a cylindrical body wall that enables the operation of forming a through-hole without leaving a machining burr on the wall of a cylindrical member to be easily and reliably carried out without depending on experts. A through-hole manufacturing method for a cylindrical body wall in which a machining burr is not formed on inner walls of through holes formed by a tool piercing the wall of a cylindrical body, the method including a hole forming step of forming one pair or a plurality of pairs of the through-holes in the cylindrical body wall by the tool piercing the cylindrical body from the outside orthogonally or substantially orthogonally to a cylindrical body axis of the cylindrical body; and a welding step of sealing the through-hole formed by the tool piercing the cylindrical body from the outer wall to the inner wall by welding using a welding jig made of a material having better heat conductivity than the cylindrical body, wherein the through-hole formed by the tool piercing the cylindrical body from the inner wall to the outer wall is left as a nozzle hole.

Through-hole manufacturing method for cylindrical body wall and cylindrical body structure

A plating jig can perform the processing of plating wherein a thickness of a plating film formed on each object to be plated becomes even when a plurality of objects to be plated are plated at a time. The plating jig is horizontally disposed, immersed in plating solution, and rotated about a rotational axis. The plating jig includes a plurality of supporting rods and a pair of end plates which support both ends of the supporting rods. The supporting rods are disposed on the circumference of the end plates. A plurality of notches are formed on the supporting rod at regular intervals along the rotational axis.

Plating jig

A surface coating film includes, a base material which is a hard material; and an oxidation-resistance coating layer containing, as a main component, a complex oxide of Li and at least Al and covering a surface of the base material. Further, a method of manufacturing a surface coated member, includes, supporting a base material which is a hard material in a hermetic container with the use of a holder arranged in the container; arranging a complex oxide forming target containing Li and at least Al, as main components, in the container; feeding oxygen into the container; and forming an oxidation-resistance coating layer that covers the base material to obtain the surface coated member by effecting electric discharge between the complex oxide forming target as an anode and the holder as a cathode.

Surface coating film, method of manufacturing thereof, cutting tool and machine tool

An electroplating jig which includes: a first insulator plate having an aperture; a second insulator plate sandwiching a body to be plated between the first insulator plate and the second insulator plate so that the body to be plated is faced outside from the aperture; and a conductive plate for conducting electric current supplied from outside to the body to be plated, the conductive plate being arranged between the first or second insulator plate and the body to be plated, wherein the conductive plate is formed using a conductive rubber contacting elastically with the body to be plated.

Electroplating jig

The electrode cartridge for measuring an internal stress of a film of plating includes a cathode support, an anode support, a shield plate and an anode shell. The anode support supports an anode plate so that the anode plate is opposite to the cathode plate with a predetermined spacing. The shield plate is interposed between the cathode and anode plates. A through hole is made in the shield plate in such a manner that the through hole confronts a plating section and has a geometry which is reduced by a first predetermined scale factor relative to a geometry of the plating section. An opening is made in the anode shell in such a manner that the opening confronts the plating section and has a geometry which is magnified by a second predetermined scale factor relative to the geometry of the plating section.

Electrode cartridge and a system for measuring an internal stress for a film of plating

There is provided a novel thermal barrier coating material which does not have a problem of phase transition, whose melting point is higher than its working temperature range, whose thermal conductivity is smaller than that of zirconia, and whose thermal expansion coefficient is greater than that of zirconia. The thermal barrier coating material comprises as a main component, a composition having an orthorhombic or monoclinic structure derived from perovskite (for example, a tabular perovskite structure expressed by the composition formula ABO), or a tetragonal layer structure having a c axis/a axis ratio equal to or greater than 3 (for example, a KNiFstructure, a SrTiOstructure, or a SrTiOstructure), a composition expressed by the composition formula LaTaO, or a composition having an olivine type structure expressed by the composition formula MSiOor (MM')SiO(where M, M&#x2032; are divalent metal elements).

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Tokyo, Japan

Katsunori Akiyama