Dai Nippon Printing Co., Ltd.

Dai Nippon Printingco., Ltd.

Katsunari Obata

Toshihiko Takeda

Hiroyuki Nishimura

Yoshinori Hirobe

Hiroshi Kawasaki

Yutaka Matsumoto

Masato Ushikusa

Takashi Takekoshi

Yasuko Sone

Kenji Nakamura

Takuya Hata

Hideyuki Okamoto

Yoshiyuki Honma

Atsushi Yoshizawa

Shinichi Handa

Hiromitsu Ochiai

Kumiko Hokari

Atsushi Maki

Hiroyuki Endo

Hiroyuki Endoh

Yoshihiro Kobayashi

Chiaki Hatsuta

Hiroyoshi Nakajima

Takayoshi Nirengi

Asako Narita

Hitoshi Ishiro

Yoshiko Miyadera

Naoto Yamada

A manufacturing method of a deposition mask includes a resin-layer forming step of forming a resin layer on one surface of a substrate by applying a resin solution to the surface of the substrate, a step of forming a non-contact area, which is not in contact with the surface of the substrate in the resin layer, by removing at least a part of the substrate, a step of bringing the resin layer into contact with a liquid or heating the resin layer after the non-contact area has been formed in the resin layer, and a resin-layer processing step of forming an opening in the resin layer by processing the resin layer after the step of bringing the resin layer into contact with the liquid or heating the resin layer.

Manufacturing method of deposition mask and manufacturing method of organic EL display

A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.

Vapor deposition mask with metal plate

A method for producing a frame-equipped vapor deposition mask sequentially includes preparing a vapor deposition mask including a metal mask having a slit and a resin mask having an opening corresponding to a pattern to be produced by vapor deposition at a position overlapping the slit, the metal mask and the resin mask being stacked, retaining a part of the vapor deposition mask by a retainer and stretching the vapor deposition mask retained by the retainer outward, and fixing the vapor deposition mask in a state of being stretched to a frame having a through hole. During stretching, any one or both adjustments of a rotating adjustment and a moving adjustment of the vapor deposition mask are performed with respect to the vapor deposition mask in the state of being stretched or with the vapor deposition mask being stretched.

Method for producing frame-equipped vapor deposition mask, stretching apparatus, apparatus for producing organic semiconductor device and method for producing organic semiconductor device

A vapor deposition mask includes a metal mask and a resin mask having an opening. An inner wall surface for composing the opening has an inflection point in a thicknesswise cross section of the resin mask. When an intersection of a first surface, not facing the metal mask, of the resin mask and the inner wall surface is set to be a first intersection, an intersection of a second surface, facing the metal mask, of the resin mask and the inner wall surface is set to be a second intersection, and there is set a first inflection point first positioned from the first intersection toward the second intersection, an angle formed by a line connecting the first intersection and the first inflection point and the first surface is larger than an angle formed by a line connecting the first inflection point and the second intersection and the second surface.

Vapor deposition mask, frame-equipped vapor deposition mask, and method for producing organic semiconductor element

In a method for producing a vapor deposition mask including a resin maskincluding resin mask openingscorresponding to a pattern to be produced by vapor deposition, and a metal maskincluding a metal mask opening, the metal mask being stacked on one surface of the resin mask, when the plurality of resin mask openingsare formed, as to any one resin mask openingof the plurality of resin mask openings, the resin mask openingis formed such that in a thicknesswise cross section of the resin mask, an acute angle (&#x3b8;) formed by one inner wall surface forming the one resin mask opening and the other surface of the resin mask is different from an acute angle (&#x3b8;) formed by the other inner wall surface forming the one resin mask opening and the other surface of the resin mask.

Method for producing vapor deposition mask, method for producing organic semiconductor element, and method for producing organic EL display

There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a method for producing a vapor deposition mask and a vapor deposition mask preparation body capable of simply producing the vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition. A metal maskin which a plurality of slitsare provided and a resin maskare stacked. Openingsrequired for composing a plurality of screens are provided in the resin mask. The openingscorrespond to a pattern to be produced by vapor deposition. Each of the slitsis provided at a position of overlapping with an entirety of at least one screen.

Vapor deposition mask, vapor deposition mask preparation body, method for producing vapor deposition mask, and method for producing organic semiconductor element

There is provided a vapor deposition mask including: a resin mask including a resin mask opening corresponding to a pattern to be produced by vapor deposition; and a metal layer partially positioned on one surface of the resin mask.

Vapor deposition mask, frame-equipped vapor deposition mask, vapor deposition mask preparation body, vapor deposition pattern forming method, method for producing organic semiconductor element, and method for producing organic EL display

There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a vapor deposition mask preparation body capable of simply producing the vapor deposition mask and a method for producing a vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition. A metal maskin which a slitis provided and a resin maskin which openingscorresponding to a pattern to be produced by vapor deposition are provided at a position of overlapping with the slitare stacked, and the metal maskhas a general regionin which the slitis provided and a thick regionlarger in thickness than the general region.

A vapor deposition mask capable of correctly performing confirmation of whether a shape pattern of openings formed in a resin mask is normal or similar confirmation while satisfying both high definition and lightweight, a vapor deposition mask preparation body for obtaining the vapor deposition mask, a frame-equipped vapor deposition mask including the vapor deposition mask, and a method for producing an organic semiconductor element using the frame-equipped vapor deposition mask. The aforementioned problem is solved by using, in a vapor deposition mask including a metal mask in which a through hole is formed and a resin mask in which an opening corresponding to a pattern to be produced by vapor deposition is formed at a position overlapping with the through hole, the metal mask and the resin mask being stacked, wherein the resin mask has about 40% or less of light ray transmittance at a wavelength of about 550 nm.

Vapor deposition mask, frame-equipped vapor deposition mask, vapor deposition mask preparation body, and method for producing organic semiconductor element

In a method for forming a vapor deposition pattern using a vapor deposition mask provided with a plurality of openings corresponding to a pattern that is produced by vapor deposition, and forming a vapor deposition pattern in a vapor deposition target, the method includes a close contact step of disposing the vapor deposition mask on one surface side of the vapor deposition target, disposing a pressing member and a magnetic plate in layer in this order on the other surface side of the vapor deposition target, and bringing the vapor deposition target and the vapor deposition mask into close contact with each other by using magnetism of the magnetic plate, and a vapor deposition pattern forming step of causing a vapor deposition material released from a vapor deposition source to adhere to the vapor deposition target through openings after the close contact step, and forming the vapor deposition pattern in the vapor deposition target.

Method for forming vapor deposition pattern, pressing-plate-integrated type pressing member, vapor deposition apparatus, and method for producing organic semiconductor element

A vapor deposition mask includes: a metal mask in which a metal mask opening is provided; and a resin mask in which a resin mask opening corresponding to a pattern to be produced by vapor deposition is provided at a position overlapping with the metal mask opening, the metal mask and the resin mask being stacked, wherein an arithmetic average height (Sa) of a surface of the resin mask exposed from the metal mask opening is not more than 0.8 &#x3bc;m.

Vapor deposition mask, frame-equipped vapor deposition mask, vapor deposition mask preparation body, vapor deposition pattern forming method, and method for producing organic semiconductor element

A vapor deposition mask preparation body in which a metal mask is provided on one surface of a resin plate for obtaining a resin mask, and a protective sheet with peel strength not less than about 0.0004 N/10 mm and less than about 0.2 N/10 mm in conformity with JIS Z-0237:2009 is provided on the other surface of the resin plate is prepared, with respect to the vapor deposition mask preparation body, the resin plate is irradiated with laser light from the metal mask side to form a resin mask opening corresponding to a pattern to be produced by vapor deposition in the resin plate, and the protective sheet is peeled off from the resin mask in which the resin mask opening corresponding to the pattern to be produced by vapor deposition is formed.

Method for producing vapor deposition mask, vapor deposition mask preparation body, method for producing organic semiconductor element, method for producing organic EL display, and vapor deposition mask

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Tokyo, Japan

Katsunari Obata