Tdk Corporation

Katsunari Moriai

Takahiro Itami

Dai Matsuoka

Kaname Ueda

Yo Saito

Kazuto Takeya

Takashi Inagaki

Hitoshi Ishida

Takeshi Yanata

Takeshi Oyanagi

Hitoshi Tanaka

Takahiro Sato

Satoshi Kurimoto

Naoyoshi Yoshida

Yuji Terada

Yukihiro Murakami

Koichi Ishii

Naoki Chida

Takehiko Abe

Izuru Soma

Yoshihiko Satoh

Hisayoshi Saito

A piezoelectric device has: a ceramic substrate having a first principal surface and a second principal surface opposed to each other; a piezoelectric element arranged on the first principal surface; a frame having a first face and a second face opposed to each other and arranged on the ceramic substrate so as to surround the piezoelectric element; a metal layer arranged on the second face of the frame; and a metal lid arranged on the metal layer so as to close a space surrounded by the frame. The first face of the frame is in contact with the first principal surface of the ceramic substrate. The metal layer and the metal lid are joined to each other by resistance welding. The frame has a composite portion containing a metal and a metal oxide and the composite portion includes the second face and is in contact with the metal layer.

Piezoelectric device

Provided is a piezoelectric device capable of improving measurement precision of a temperature of a piezoelectric element. A piezoelectric device () includes a package () including a housing member () having a thermistor substrate () and a frame () provided to project from a first main surface () of the thermistor substrate () and in which a housing part () is formed by the first main surface () and the frame () and a lid () provided on the frame () to cover a space () of the housing part (), and a piezoelectric vibration element () provided on the first main surface () of the thermistor substrate () in the housing part (), wherein the thermistor substrate () is a multilayer negative temperature coefficient (NTC) thermistor.

Temperature compensated piezoelectric oscilator device package wherein the base of the package consists of a multilayer thermistor

An element body has first and second faces opposed to each other. A first conductor has one end exposed in a first face and the other end located in the element body. The second conductor has one end exposed in a second face and the other end located in the element body. The element body has a first element body section having the nonlinear voltage-current characteristics and a second element body section in which an electric current is more likely to flow than in the first element body section. The first element body section is located at least in part between the first conductor and the second conductor, in a direction in which the first conductor and the second conductor are separated from each other. The other end of the first conductor and the other end of the second conductor are located in the second element body section.

Chip varistor

A chip varistor is provided with a varistor section and a plurality of terminal electrodes. The varistor section is comprised of a sintered body containing ZnO as a major component, exhibits the nonlinear voltage-current characteristics, and has a pair of principal surfaces opposed to each other. The plurality of terminal electrodes are connected each to the varistor section. Each of the terminal electrodes has a first electrode portion connected to either of the principal surfaces and a second electrode portion connected to the first electrode portion.

A chip varistor is provided with a varistor section, a plurality of electroconductive sections, and a plurality of terminal electrodes. The varistor section is comprised of a sintered body containing ZnO as a major component and is configured to exhibit the nonlinear voltage-current characteristics. The plurality of electroconductive sections are comprised of sintered bodies containing ZnO as a major component and arranged with the varistor section in between, and each electroconductive section has a first principal surface connected to the varistor section and a second principal surface opposed to the first principal surface. The plurality of terminal electrodes are connected respectively to the corresponding electroconductive sections. Each terminal electrode has a first electrode portion connected to the second principal surface and a second electrode portion connected to the first electrode portion.

A chip varistor is provided with a varistor section, a plurality of electroconductive sections, and a plurality of terminal electrodes. The varistor section is comprised of a sintered body containing ZnO as a major component and exhibits the nonlinear voltage-current characteristics. The plurality of electroconductive sections are arranged on both sides of the varistor section and each electroconductive section has a first principal surface connected to the varistor section and a second principal surface opposed to the first principal surface. The terminal electrodes are connected to the respective second principal surfaces of the electroconductive sections.

Chip varistor and chip varistor manufacturing method

A varistor is provided with a varistor element body, a plurality of internal electrodes arranged in the varistor element body so as to sandwich a partial region of the varistor element body between them, and a plurality of external electrodes arranged on the surface of the varistor element body and connected to the corresponding internal electrodes. The external electrode has a sintered electrode layer formed by attaching an electroconductive paste containing an alkali metal to the surface of the varistor element body and sintering it. The varistor element body has a high-resistance region formed by diffusing the alkali metal in the electroconductive paste into the varistor element body from an interface between the surface of the varistor element body and the sintered electrode layer.

Varistor and method for manufacturing varistor

An electronic component has an element body, and a plurality of external electrodes formed on one principal face of the element body. Each external electrode has a first electrode layer joined to the one principal face of the element body, and a second electrode layer joined as laid on an inside region inside an edge of the first electrode layer. An apical surface of the second electrode layer is planar. A joint portion in the second electrode layer to the first electrode layer is rounded.

Electronic component

A chip-type electronic component has: a ceramic element body; a plurality of first and second internal electrodes arranged in the ceramic element body so as to be opposed at least in part to each other; a first external connection conductor to which the plurality of first internal electrodes are connected; a second external connection conductor to which the plurality of second internal electrodes are connected; first and second terminal electrodes; a first internal connection conductor arranged in the ceramic element body and connecting the first external connection conductor and the first terminal electrode; and a second internal connection conductor arranged in the ceramic element body and connecting the second external connection conductor and the second terminal electrode. The number of the first internal connection conductor is set to be smaller than the number of the first internal electrodes and the number of the second internal connection conductor is set to be smaller than the number of the second internal electrodes.

Chip-type electronic component

An object of the present invention is to provide a multilayer filter constructed so as to be less likely to suffer peeling between a varistor part and an inductor part. A multilayer filteras a preferred embodiment has a structure in which a varistor partand an inductor part are stacked. The varistor partconsists of a stack of varistor layerswith internal electrodes, and the varistor layers contain ZnO as a principal component, and contain at least one element selected from the group consisting of Pr and Bi, Co, and Al as additives. The inductor partconsists of a stack of inductor layers-with conductor patterns-, and the inductor layers contain ZnO as a principal component and substantially contain neither Co nor Al.

Multilayer filter

A multilayer chip varistor comprises a multilayer body in which a plurality of varistor portions are arranged along a predetermined direction, and a plurality of terminal electrodes. Each varistor portion has a varistor layer to exhibit nonlinear voltage-current characteristics, and a plurality of internal electrodes disposed so as to interpose the varistor layer between them. Each terminal electrode is disposed on a first outer surface parallel to the predetermined direction out of outer surfaces of the multilayer body and is electrically connected to a corresponding internal electrode out of the plurality of internal electrodes. Each of the plurality of internal electrodes includes a first electrode portion overlapping with another first electrode portion between adjacent internal electrodes out of the plurality of internal electrodes, and a second electrode portion led from the first electrode portion so as to be exposed in the first outer surface. The plurality of terminal electrodes are electrically connected via the respective second electrode portions to the corresponding internal electrodes.

Multilayer chip varistor

A surge absorber has a first terminal electrode, a second terminal electrode, a third terminal electrode, an inductor portion, a surge absorbing portion, and a capacitor portion. The inductor portion has a first internal conductor and a second internal conductor mutually coupled in a polarity-reversed relation. One end of the first internal conductor is connected to the first terminal electrode. One end of the second internal conductor is connected to the second terminal electrode. The other end of the first internal conductor is connected to the other end of the second internal conductor. The surge absorbing portion has a first internal electrode connected to a connection point between the first internal conductor and the second internal conductor, and a second internal electrode connected to the third terminal electrode. The capacitor portion has a capacitance component connected between the first terminal electrode and the second terminal electrode.

Surge absorber

A multilayer chip varistor comprises a multilayer body and a pair of external electrodes formed on the multilayer body. The multilayer body has a varistor section and a pair of outer layer sections disposed so as to interpose said varistor section. The varistor section comprises a varistor layer developing a voltage nonlinear characteristic and a pair of internal electrodes disposed so as to interpose the varistor layer. The pair of external electrodes are connected to respective electrodes of the pair of internal electrodes. The relative dielectric constant of the outer layer sections is set lower than the relative dielectric constant of the region where the pair of internal electrodes in the varistor layer overlap each other.

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Tokyo, Japan

Katsunari Moriai