Sumitomo Electric Industries, Limited

Sumitomo Electric Printed Circuits, Inc.

Katsunari Mikage

Hiroshi Ueda

Masamichi Yamamoto

Jun Yorita

Keiji Koyama

Junichi Okaue

A flexible printed circuit board of the present invention includes an insulating base film and an electrode stacked on a first surface of the base film, in which the electrode includes a low-melting-point metal layer on a surface of the electrode, and a plate- or strip-like rigid member electrically insulated from the electrode is disposed in a region of a second surface of the base film opposite from the electrode.

Flexible printed circuit board, method for producing connection body, and connection body

Provided is a different-pitch flat cable connection structure for connecting a first flat-cable part that includes a plurality of first conductors arranged in a stripe pattern with a first pitch to a second flat-cable part that includes a plurality of second conductors arranged in a stripe pattern with a second pitch smaller than the first pitch, and establishing electrical continuity between the first conductors and the second conductors. The different-pitch flat cable connection structure includes a connection sheet laminated on one surface side of ends of the first conductors and ends of the second conductors in which at least the one surface side of the ends is exposed. The connection sheet includes a base layer, a plurality of third conductors laminated on another surface side of the base layer so as to extend between the first conductors and the corresponding second conductors in a one-to-one relationship, and a plurality of conductive adhesive layers disposed between facing surfaces of the first conductors and the third conductors and between facing surfaces of the second conductors and the third conductors.

Different-pitch flat cable connection structure, pitch-conversion flat cable, and method for producing pitch-conversion flat cable

In a processing method of a fine structure according to the present invention, an opposed platen () is moved from a retreat position to a molding/processing position, so that a film () is pressed against a mold () and processed. Thereafter a second block () is separated from a first block (). Thus, improvement of the cooling rate for the opposed platen () can be attained by reducing the total thermal capacity of the opposed platen () by reducing the volume of the opposed platen () in cooling and physically discharging heat stored in the opposed platen (). Thus, cooling efficiency for the opposed platen () is improved, and the heat cycle of the opposed platen () can be reduced.

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Osaka, Japan

Katsunari Mikage