Ricoh Company, Ltd.

Ricoh Research Institute of General Electronics Co., Ltd.

Katsunari Hanaoka

Hiroshi Miura

Nobuaki Onagi

Kazunori Ito

Shunichi Sato

Hiroshi Deguchi

Akihiro Itoh

Masaru Shinkai

Hajime Yuzurihara

Ikue Kawashima

Masahiro Hayashi

Kazuhiro Harasaka

Yasutomo Aman

Hiroko Tashiro

Wataru Ohtani

Kiyoto Shibata

Hirofumi Watanabe

Makoto Harigaya

Yujiro Kaneko

Hiroyoshi Shouji

Masayuki Fujiwara

Kaihei Isshiki

Masayuki Numata

Shigeru Kinpara

Yasuyuki Shindou

Tetsurou Tanigawa

Ikuo Shiota

Hiroyuki Reciente Chigasaki 408 Iwasa

A surface emitting laser includes a substrate, a plurality of surface emitting laser elements on a first surface of the substrate, a first electrode electrically connected to a first conductive semiconductor of the surface emitting laser elements; and a second electrode electrically connected to a second conductive semiconductor of the surface emitting laser elements. Each of the surface emitting laser elements includes a first reflecting mirror on the substrate; an active layer on the first reflecting mirror; and a second reflecting mirror on the active layer. When a first contact region in which the first electrode and the first conductive semiconductor are connected to each other is on the first surface or in the first conductive semiconductor of the surface emitting laser elements. The first electrode is electrically connected to the light emitting units. The second electrode is electrically connected to each of the light emitting units.

Surface emitting laser, surface emitting laser device, light source device, and detection apparatus

A surface emitting laser element includes a first reflecting mirror; an active layer over the first reflecting mirror; a second reflecting mirror over the active layer; and a multilayer film over the second reflecting mirror. The multilayer film has a side surface including one film and inclined with respect to a principal surface of the second reflecting mirror. The multilayer film includes, in a thickness direction, two or more pairs of a first film having a first refractive index and a second film having a second refractive index higher than the first refractive index. The multilayer film has a center portion and a peripheral portion around the center portion in plan view in a direction perpendicular to the principal surface. The peripheral portion includes the side surface.

Surface emitting laser element, surface emitting laser, surface emitting laser device, light source device, and detection apparatus

A surface-emitting laser device includes a transparent dielectric layer provided in an emitting region and configured to cause a reflectance at a peripheral part to be different from a reflectance at a central part in the emitting region. In the surface-emitting laser device, the thickness of a contact layer is different between a region having a relatively high reflectance and a region having a relatively low reflectance in the emitting region. The contact layer is provided on the high refractive index layer of an upper multilayer film reflecting mirror, and the total optical thickness of the high refractive index layer and the contact layer in the region having the relatively low reflectance is deviated from an odd number multiple of a one quarter oscillation wavelength of laser light emitted from the emitting region.

Surface-emitting laser device, surface-emitting laser array, optical scanner, image forming apparatus, and method for manufacturing surface-emitting laser device

A surface emitting laser array element is disclosed that includes a lower distributed bragg reflector (DBR) that is formed on a substrate, an active layer that is formed on the lower DBR, and an upper DBR that is formed on the active layer. A mesa and a dummy mesa that is arranged at a periphery of the mesa are created by removing a portion of the upper DBR. The mesa forms a surface emitting laser, and a wiring is connected to an electrode that is formed on an upper face of the mesa. The wiring includes a portion that is arranged over an upper face of the dummy mesa, a side face of the dummy mesa, and a bottom face at a peripheral region of the dummy mesa extending along a longitudinal direction of the wiring.

Surface emitting laser array element, optical scanning device, and image forming apparatus

A disclosed vertical cavity surface emitting laser element includes a substrate, a laminated body sandwiching a semiconductor active layer with an upper reflecting mirror and a lower reflecting mirror, a lower electrode, and an upper electrode. The laser element emits laser light in a direction perpendicular to the surface of the substrate when an electric current is supplied between the upper electrode and the lower electrode. The laser element further includes a selective oxidation layer in the upper reflecting mirror having a current blocking structure made of an oxidized region and an unoxidized region, and a detectable portion formed on a side surface of a mesa structure shaped by the upper reflecting mirror including the selective oxidation layer and the active layer, thereby enabling detecting the position of the selective oxidation layer from a top of the laminated body in a depth direction of the laminated body.

Vertical cavity surface emitting laser element, vertical cavity surface emitting laser array, optical scanning device, and image forming apparatus

A surface-emitting laser element includes a substrate; a plurality of semiconductor layers laminated on the substrate, the plural semiconductor layers including a resonator structural body including an active layer and semiconductor multilayer film reflection mirrors having the resonator structural body sandwiched therebetween; an electrode provided in such a manner as to surround a emitting region on a surface of the surface-emitting laser element from which light is emitted; and a dielectric film provided in the emitting region such that a reflection ratio of a peripheral part of the emitting region is different from a reflection ratio of a center part of the emitting region. Edge portions that are near edges of the dielectric film are tilted with respect to the surface.

Surface-emitting laser element, surface-emitting laser array, optical scanning device, and image forming apparatus

The present invention provides a process for producing inexpensively and effectively a stamper utilized for producing multi-valued ROM discs, which comprises:

Process for producing stamper of multi-valued ROM disc, apparatus for producing the same, and resulting disc

In an optical disk substrate film-formation apparatus which prepared an optical disk by forming a thin film on a substrate, the optical disk substrate is held by a holder section. A contact support surface is provided to the holder section which closely contacts at least a portion of the surface of the optical disk substrate rear to the surface where the think film is formed.

Optical device substrate film-formation apparatus, optical disk substrate film-formation method, substrate holder manufacture method, substrate holder, optical disk and a phase-change recording type of optical disk

OPTICAL DEVICE SUBSTRATE FILM-FORMATION APPARATUS, OPTICAL DISK SUBSTRATE FILM-FORMATION METHOD, SUBSTRATE HOLDER MANUFACTURE METHOD, SUBSTRATE HOLDER, OPTICAL DISK AND A PHASE-CHANGE RECORDING TYPE OF OPTICAL DISK

An optical information recording medium having a substrate, a first dielectric layer provided on the substrate, a recording layer provided on the first dielectric layer, a second dielectric layer provided on the recording layer, a light reflection and heat dissipation layer provided on the light reflection and heat dissipation layer, and a crystallization accelerating layer provided in contact with at least a portion of the recording layer and made of a material including a substance selected from Bi, Bi-containing compounds, Al, Al-containing compounds, In, In-containing compounds, Tl and Tl-containing compounds.

Optical recording medium and method of fabricating same

A method for forming ohmic contact has the steps of a) a process for forming an insulating film having a predetermined thickness on a diffusive layer formed on a semiconductor substrate; b) a process for forming a mask on the insulating film; the mask having a small selective ratio with respect to the insulating film and having an opening portion for a contact hole; c) a process for implanting ions into the diffusive layer through the opening portion; d) a process for taking heat treatment to electrically activate the implanted ions; e) a process for completely removing the mask and forming the contact hole by simultaneously etching the mask and the insulating film exposed through the opening portion of the mask; and f) a process for making an electrode come in ohmic contact with the semiconductor substrate exposed from the formed contact hole. In this method, the ohmic contact is formed with high accuracy with respect to a fine contact hole.

Method for forming ohmic contact

A method of fabricating a semiconductor device includes the steps of forming a contact hole in an insulator layer, filling the contact hole by a conductor material, removing the conductor material from the upper major surface of the insulator layer to form a conductive plug such that the conductive plug fills the contact hole, applying an anisotropic etching process upon the insulator layer, such that the anisotropic etching process acts substantially vertically and selectively to the insulator layer, with an etching rate substantially larger than an etching rate for the conducive plug.

Fabrication process of a semiconductor device having an interconnection

In a manufacturing method of a semiconductor device, a gate insulating film is grown in an active region. Thereafter, an N-type polysilicon film is formed on the gate insulating film and is patterned so that a gate electrode and a polysilicon electrode are formed. Next, arsenic ions are implanted onto entire faces of the gate and polysilicon electrodes so that a source-drain region is formed on a substrate. An interlayer insulating film is then formed on an entire face of the source-drain region, etc. Thereafter, a contact hole is formed on a drain region in a position in which the drain region partially overlaps the polysilicon electrode. A surface portion of the polysilicon electrode is exposed into the contact hole. Thereafter, phosphoric ions are implanted through the contact hole with the interlayer insulating film as a mask. The implanted ions are thermally processed to activate these implanted ions. Thereafter, metal wiring is formed. Thus, resistance of a common contact having s three-dimensional structure is reduced.

Semiconductor device with contact hole

A semiconductor integrated circuit device includes a substrate formed with semiconductor elements and a metal wiring having a laminated structure and provided on the substrate. The metal wiring includes a first layer including aluminum as a main component, and a second layer formed on the first layer. The second layer includes titanium and nitrogen as main components. The second layer includes more titanium than nitrogen in number of atoms. A third layer may be formed between the first and second layers. The third layer includes a compound of aluminum and titanium as a main component. A fourth layer may further be formed between the second and third layers. The fourth layer includes titanium as a main component and is free of aluminum.

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Kanagawa, Japan

Katsunari Hanaoka