Fujitsu Corporation

Katsumi Uchikawa

Keiji Arai

Kazuhiko Iijima

Shuntaro Takizawa

Tohru Matsui

Takanori Kobayashi

Shuji Higuchi

Kouji Takamachi

Shigemitsu Matsumoto

Tohru Goto

Koichi Takemata

Naoto Maezawa

Ryo Fujita

A multilayer printed circuit board is provided which includes a base member having a surface provided with a base wiring pattern, an inner buildup layer laminated on the base member and having a surface formed with an inner buildup wiring pattern, and an outer buildup layer laminated on the surface of the inner buildup layer and having a surface formed with an outer buildup wiring pattern. The wiring patterns are electrically connected to each other through vias. The inner buildup layer is formed of a resin material which is not reinforced by glass fibers, whereas the outer buildup layer is formed of a resin material reinforced by glass fibers.

Multilayer printed circuit board and method of making the same

A manufacturing line including a plurality of processing sections disposed in a series for manufacturing multi-layered printed circuit boards by continuously conveying and processing boards through the plurality of processing sections, in which the plurality of processing sections have at least two specific processing sections for conducting a common type of processes, and the specific processing sections are disposed in a common area.

Manufacturing line for multi-layered printed circuit boards

A method for forming a resist pattern comprising the steps of: placing a transparent mask substrate on an object coated with a resist; drawing a mask pattern directly on the transparent mask substrate with an ink jetter; exposing the resist to light with intervention of the mask pattern; peeling off the mask substrate; and developing the resist, thereby forming a predetermined resist pattern.

Method and apparatus for forming resist pattern, and printed wiring

Growing community of inventors

Kawasaki, Japan

Katsumi Uchikawa