Jsr Corporation

Mitsubishi Denki Kabushiki Kaisha

Tomy Kogyo Co., Ltd.

Mitsubishi Electric Corporation

Kabushikigaisha Tokyo Kikai Seisakusho

Nippon Keiki Works, Ltd.

Katsumi Sato

Kazuo Inoue

Hisao Igarashi

Hideo Matsumoto

Shigeru Hokuyo

Mutsuhiko Yoshioka

Hitoshi Fujiyama

Satoshi Nakamura

Futoshi Tokunoh

Susumu Yoshida

Kazuhiro Morishita

Masaya Naoi

Naoto Kaguchi

Ryoji Setaka

Takao Oda

Shinji Koga

Kunihiko Maruyama

Norihisa Asano

Provided is a semiconductor device that carries current in both directions and that enables accurate detection of current flowing through the semiconductor device. The semiconductor device includes a transistor and a diode both formed in a common semiconductor base body. The semiconductor device includes: a first main surface; a second main surface; a first electrode; a second electrode; a third electrode for current sensing; and a fourth electrode for current sensing. The semiconductor base body includes: a transistor region in which the transistor is formed; a diode region in which the diode is formed; and a separation region formed between the transistor region and the diode region. The third electrode is provided on the first main surface in the transistor region at a distance from the first electrode. The fourth electrode is provided on the first main surface in the diode region at a distance from the first electrode.

Semiconductor device and power conversion device

A semiconductor device includes: an emitter electrode formed of a silicide film, and provided on a semiconductor layer; an insulating film provided on the emitter electrode; and an electrode pad made of Al, and provided on the insulating film.

Semiconductor device

A sheet-like probe and a method of producing the probe. In the probe electrode structure bodies do not come out from an insulation film and achieve high durability, and in a burn-in test for a wafer having a large area and for a circuit device having to-be-inspected electrodes with small intervals, positional displacement, caused by temperature variation, between the electrode structure bodies and the to-be-inspected electrode can be reliably prevented for stable connection conditions. The sheet-like probe includes an insulation layer and a contact film provided with electrode structure bodies arranged on the insulation layer to be apart from each other in the surface direction of the insulation layer and penetratingly extend in the thickness direction of the insulation layer. The electrode structure bodies each are composed of a surface electrode section exposed to the front surface of the insulation layer.

Sheet-like probe, method of producing the probe, and application of the probe

A sheet-like probe has a porous film. In the sheet-like probe, a contact film is penetratingly supported at each position of through-holes formed in the porous film, and a peripheral edge of the contact film and the porous film are integrated such that a flexible resin insulation layer is included in a fine hole of the porous film. Electrode structure bodies are supported in a penetrating manner in the insulation layer. Each electrode structure body includes a surface electrode section exposed to the front surface of the insulation layer and projecting from the front surface of the insulation layer, a back surface electrode section exposed to the back surface of the insulation layer, a short-circuit section continuously extending from the base end of the front surface electrode section, penetrating the insulation layer in its thickness direction, and connected to the back surface electrode section, a holding section extending outward, along the front surface of the insulation layer, from the base end section of the front surface electrode section, and a supporting body supporting the insulation layer.

A probe device including a circuit board for inspection having a great number of inspection electrodes, a probe card having a circuit board for connection having a great number of terminal electrodes and a contact member, an anisotropically conductive connector arranged between the circuit board for inspection and the circuit board for connection and electrically connecting the respective inspection electrodes to the respective terminal electrodes, and a parallelism adjusting mechanism for adjusting a parallelism of the circuit board for inspection and the circuit board for connection to the wafer. The parallelism adjusting mechanism includes a location-varying mechanism, which relatively displaces the circuit board for inspection or the circuit board for connection in the thickness-wise direction of the anisotropically conductive connector. A wafer inspection apparatus can include the probe device.

Probe apparatus, wafer inspecting apparatus provided with the probe apparatus and wafer inspecting method

An anisotropically conductive sheet which does not contaminate an object of connection, does not adhere to the object of connection even when it is left to stand for a long period of time in a state pressurized by the object of connection under a high-temperature environment and can prevent or inhibit electric charge from being accumulated to eliminate an adverse influence by static electricity, a production process thereof, and applications thereof. The anisotropically conductive sheet has an anisotropically conductive sheet body formed by an elastic polymeric substance and having a plurality of conductive parts extending in a thickness-wise direction of the sheet body and an insulating part mutually insulating these conductive parts, and a DLC film integrally formed on one or both surfaces of the anisotropically conductive sheet body so as to cover at least the insulating part.

Anisotropic conductive sheet, its manufacturing method, and its application

Disclosed herein are a sheet-like probe capable of surly preventing positional deviation between electrode structures and electrodes to be inspected by temperature changes in a bum-in test, even when the object of inspection is a wafer having a large area of 8 inches or greater in diameter or a circuit device, the pitch of electrodes to be inspected of which is extremely small, and thus capable of stably retaining a good electrically connected state, and a production process and applications thereof. The sheet-like probe of the present invention comprises a contact film obtained by holding a plurality of electrode structures arranged in accordance with a pattern corresponding to respective electrodes to be connected and having a front-surface electrode part exposed to a front surface and a back-surface electrode part exposed to aback surface by an insulating film composed of a flexible resin, and a frame plate supporting the contract film.

Sheet-like probe, process for producing the same and its application

An anisotropically conductive connector suitable for use in a wafer inspection apparatus, and a wafer inspection apparatus comprising the anisotropically conductive connector, which anisotropically conductive connector comprises an elastic anisotropically conductive film composed of a plurality of conductive parts for connection and an insulating part formed among these conductive parts for connection, and a frame plate for supporting this film, which plate is formed of a metallic material having a coefficient of linear thermal expansion of 3&#xd7;10to 2&#xd7;10K, the conductive parts for connection are obtained by filling conductive particles having a number average particle diameter of 20 to 80 &#x3bc;m and exhibiting magnetism in an elastic polymeric substance at a high density, the conductive particles have, on a surface of which, a coating layer composed of a noble metal and having a thickness of at least 20 nm, each of the conductive parts for connection has a durometer hardness of 10 to 35, and an electric resistance between the conductive parts for connection is at least 10 M&#x3a9;.

Anisotropic conductive connector and wafer inspection device

Disclosed herein are a sheet-like connector that electrode structures each having a front-surface electrode part small in diameter can be formed, a stable electrically connected state can be surely achieved even to a circuit device, on which electrodes have been formed at a small pitch, and the electrode structures are prevented from falling off from an insulating sheet to achieve high durability, and a production process and applications thereof. The sheet-like connector of the invention has an insulating sheet and a plurality of electrode structures arranged in the insulating sheet and extending through in a thickness-wise direction of the insulating sheet. Each of the electrode structures is composed of a front-surface electrode part exposed to a front surfaces of the insulating sheet and projected from the front surface of the insulating sheet, a back-surface electrode part exposed to a back surface of the insulating sheet, a short circuit part continuously extending from the base end of the front-surface electrode part through the insulating sheet in the thickness-wise direction thereof and linked to the back-surface electrode part, and a holding part continuously extending from a base end portion of the front-surface electrode part outward along the front surface of the insulating sheet.

Sheet-form connector and production method and application therefor

An anisotropically conductive connector, and applications thereof, by which good conductivity is retained over a long period of time even when it is used in electrical inspection of a plurality of integrated circuits formed on a wafer repeatedly over a great number of times, and thus high durability and long service life are achieved. The anisotropically conductive connector includes elastic anisotropically conductive films, in each of which a plurality of conductive parts for connection containing conductive particles and extending in a thickness-wise direction of the film are formed. The conductive particles contained in the conductive parts for connection in the anisotropically conductive connector are obtained by laminating surfaces of core particles exhibiting magnetism with a coating layer formed of a high-conductive metal, and the coating layer is a coating layer having a high hardness.

Anisotropic conductive connector, conductive paste composition, probe member, wafer inspection device and wafer inspection method

An anisotropically conductive connector, by which expected electrical inspection can be conducted even to a circuit device having a clock frequency of, for example, at least 1 GHz, and an electrical inspection apparatus for circuit devices, which is equipped with this connector. The anisotropically conductive connector includes an elastic anisotropically conductive film having a plurality of conductive parts for connection arranged in accordance with a pattern corresponding to electrodes to be connected and extending in a thickness-wise direction of the film and an insulating part mutually insulating these conductive parts for connection, wherein conductive parts for high-frequency shielding extending in the thickness-wise direction are formed in the elastic anisotropically conductive film. The electrical inspection apparatus for circuit devices includes the above anisotropically conductive connector.

Anisotropic conductive connector and circuit-device electrical-inspection device

Disclosed herein are an anisotropically conductive connector, by which good conductivity is retained over a long period of time even when it is used repeatedly over many times or repeatedly used under a high-temperature environment, and applications thereof. The anisotropically conductive connector is an anisotropically conductive connector having an elastic anisotropically conductive film, in which a plurality of conductive parts for connection extending in a thickness-wise direction of the film have been formed.

Anisotropic conductive connector, probe member, wafer inspecting  device, and wafer inspecting method

An anisotropically conductive sheet comprises an anisotropically conductive functional region part exhibiting conductivity in its thickness-wise direction and an insulating peripheral region part located about the functional region part. The thickness of the functional region part is greater than that of the peripheral region part. The difference in thickness makes a space for inserting a holding tip part of a carrier between a target to be electrically connected and an upper surface of the peripheral region part.

Anisotropically conductive sheet and connector

This invention relates to a pressure-contact type semiconductor device ( ) having a ring-shaped gate terminal, and aims at overcoming such a technical problem that a gate current is not uniformly supplied to a semiconductor substrate ( ) due to a connection structure for the device ( ) and an external gate driver ( ). For this purpose, a ring-shaped gate terminal ( ) is structured as a resistor whose resistivity is at least 0.1 m&OHgr;&middot;cm in the present invention. Thus, a voltage drop by the aforementioned resistor enlarges in a concentrated part of the gate current, and it follows that the gate current is shunted to another non-concentrated part. The present invention is utilizable as a high-power element in a power applied device.

Pressure-contact semiconductor device

A reverse conducting gate turn-off thyristor has a separating layer (26) in isolating zone (Z) for electrically separating into thyristor and diode portion (X, Z) a p type base layer (22) formed on an n type base layer (21). A gate electrode (29) is formed both on the p type base layer (22) and the separating layer. A portion of the gate electrode (29) on said separating layer serves as a gate collecting electrode (29a). Thus, area for the isolating zone (Z) and the gate collecting electrode (29a) become common, so that the efficiency of utilization of the wafer surface can be increased.

Growing community of inventors

Tokyo, Japan

Katsumi Sato