Matsushita Electric Industrial Co., Ltd.

Katsumi Sasaki

Hiromi Sakita

Kenzo Isozaki

Kengo Shiiba

Kazuhide Goto

Makoto Yoshinomoto

Akio Hidaka

Kazuhiro Eguchi

Takumi Naruse

Hiromitsu Taki

Kuniaki Kiyosue

Mitsuo Kanmera

Masanobu Kuroki

Yoshio Onaka

Sumio Tate

Fumio Fukushima

Takehiko Yoneda

Kazuhiro Takeda

Kenichi Kozaki

Shoichi Ikebe

Koji Nishimura

Akito Hamazono

Jirou Oota

Noriya Satou

A surface-mount type antenna and a communication terminal using the same. A radiator electrode is provided on a first principal face of a substrate. A ground electrode is provided on the second principal face of the substrate. A first feeder electrode has at least a portion thereof provided on a side face and on the second principal face of the substrate. A second feeder electrode is provided on an inner wall face of a hole formed parallel to the first and second principal faces. The first feeder electrode and the ground electrode are kept in a non-contact state. The first feeder electrode and the second feeder electrode are in electrical contact. A mobile communication terminal using the surface-mount type antenna is small in size, exhibits small variations in characteristics, and provides high productivity and reliability.

Surface-mount type antennas and mobile communication terminals using the same

A chip antenna that is simple in structure, produces small variation in antenna characteristics between individual antennas, and requires no circuit adjustments, is excellent in productivity. The chip antenna is capable of being mounted on a circuit board, as well as a wireless terminal using the chip antenna. A method of fabricating the chip antenna. A core body is made from an insulating material in a quadrangular or circular cylinder shape. A conductor in a helical shape is mounted on the side surface of the core body. A terminal portion is provided on the core body and electrically connected with an end portion of the conductor. The width, depth, and length of the core body are within ranges of 0.5-5 mm, 0.5-5 mm, and 4-40 mm, respectively. Intrinsic volume resistance and relative dielectric constant of the material are 10&#x3a9;&#xb7;m or above and 40 or below, respectively.

Chip antenna, radio communications terminal and radio communications system using the same and method for production of the same

A circuit component comprising a circuit board and a terminal for mounting the circuit board on a second circuit board. A length of the circuit board is 10 mm-80 mm, a difference in a coefficient of thermal expansion between the circuit board and the second circuit board is 0.2&times;10 /&deg; C. or greater. The terminal is made of an elastic material, and comprised of a first connection section, a second connection section and an elastic section disposed between the first and second connection sections, and the terminal separates the circuit board from the second circuit board by 0.3 mm-5 mm. In the circuit components of the present invention, deterioration in the conduction between the circuit board and the second circuit board due to heat cycles can be prevented. Thus, a circuit component having stable operating characteristics for a long period of time is obtained.

Circuit component

Filter

An electronic component which comprises a substrate, conductive film on the surface of the substrate, a groove created on the conductive film, a protective material covering the groove, and terminals and on both ends of the substrate. Lengths P to P of the terminals and, the surface roughness and materials of the terminals and, and configuration of the protective material are specified for providing an electronic component and radio terminal with at least one of improved productivity, mountability, and characteristics.

Electronic component and radio terminal using the same

A surface mount type antenna and a communication terminal using the same. A radiator electrode is provided on a first principal face of a substrate. A ground electrode is provided on the second principal face of the substrate. A first feeder electrode has at least a portion thereof provided on a side face and on the second principal face of the substrate. A second feeder electrode is provided on an inner wall face of a hole formed parallel to the first and second principal faces. The first feeder electrode and the ground electrode are kept in a non-contact state. The first feeder electrode and the second feeder electrode are in electrical contact. A mobile communication terminal using the surface-mount type antenna is small in size, exhibits small variations in characteristics, and provides high productivity and reliability.

A chip antenna that is simple in structure, produces small variation in antenna characteristics between individual antennas, and requires no circuit adjustments, is excellent in productivity. The chip antenna is capable of being mounted on a circuit board, as well as a wireless terminal using the chip antenna. A method of fabricating the chip antenna. A core body is made from an insulating material in a quadrangular or circular cylinder shape. A conductor in a helical shape is mounted on the side surface of the core body. A terminal portion is provided on the core body and electrically connected with an end portion of the conductor. The width, depth, and length of the core body are within ranges of 0.5-5 mm, 0.5-5 mm, and 4-40 mm, respectively. Intrinsic volume resistance and relative dielectric constant of the material are 10 &OHgr;&middot;m or above and 40 or below, respectively.

The present invention aims at providing an electronic component that can be readily reduced in size. Further, even when the electronic component is reduced in size, the miniaturized electronic component has (i) a wide range in capacitance, (ii) is allowed to be produced easily, (iii) has excellent electrical characteristics and (iv) can prevent defects due to a poor connection between the electronic component and a circuit board caused by warpage of the circuit board and the like when the electronic component is connected to the circuit board. The electronic component includes a capacitor element with a pair of lead terminals and an exterior packaging material disposed so as to encapsulate the capacitor element. The maximum length of the exterior packaging material is 7.5 mm or less and the maximum length of the capacitor element is 5.5 mm or less. Capacitance C of the capacitor element satisfies an inequality of 4 pF&lE;C&lE;4700 pF and a DC break down voltage BDV satisfies an inequality of BDV&gE;4.5 KV. The smallest spacing between the pair of lead terminals ranges from 3.0 mm to 6.0 mm.

Electronic component

A surface mount component includes a substrate having two main faces, and first electrodes made of a metal, such as zinc, which is unlikely to cause migration. The first electrodes are formed on most of the entire face of both main faces of the substrate. Second electrodes made of a superior bonding material, such as copper, are disposed on the first electrodes. Lead terminals are bonded to the second electrodes by a bonding material, and an external packaging material covers the surface mount component. This configuration suppresses the occurrence of migration and improves resistance to electrical breakdown.

Surface mount electronic component having electrodes suppressing the occurrence of migration

A surface-mount type ceramic capacitor particularly suitable for use in an intermediate to high tension circuit is disclosed, wherein lead terminals are spaced from a dielectric ceramic substrate except for a portion joined with electrodes. With this spaced arrangement, the ceramic capacitor has a high electric breakdown strength and an improved heat-resisting property and, hence, is capable of operating reliably over a long period of use.

Surface-mount type ceramic capacitor

A flat type dielectric filter comprises a substantially U-shaped strip line formed such that each center frequency of spurious output deviates from each odd number frequency times the center frequency of the dielectric filter. That is, it comprises a first portion so curved to form an open loop and two second portions formed to have a larger width than the first portion, each of the second portions being provided to an end of the first portion such that each extends in the opposite direction to the other. In this filter, input/output electrodes confronting ends of U-shaped strip line can be formed on a different layer from the layer where the resonator is formed in order to reduce its size. Reduction of size can be obtained by vertically folding the U-shaped strip line extending horizontally. Terminals of this filter formed on the side surface have a first layer formed on the side surface and a second layer formed on the first layer. The first layer is made of silver, the second layer nickel, or the first layer copper, the second layer solder. This filter has two conducting plates sandwiching dielectric substrates including each resonator, the conducting plate being coated with a epoxy resin or dielectric substance.

Growing community of inventors

Miyazaki, Japan

Katsumi Sasaki