Nhk Spring Co., Ltd.

Sumitomo Chemical Company, Limited

Katsumi Mizuno

Yutaka Natsume

Kazuhiko Konomi

Ryo Miyakoshi

Takeshi Kondo

Daiki Ikeda

Asuka Kawasaki

Kohei Shimomura

According to one embodiment, a metal base circuit board includes a metal base substrate, a first circuit pattern, and a first insulating layer between the metal base substrate and the first circuit pattern. The first insulating layer covers a lower surface of the first circuit pattern and at least part of a side surface of the first circuit pattern, the lower surface facing the metal base substrate, the at least part of the side surface being adjacent to the lower surface.

Metal base circuit board and method of manufacturing the metal base circuit board

A circuit board laminate includes a metal substrate, an insulation layer disposed on the metal substrate, and a metal foil disposed on the insulation layer. A metal-based circuit board includes a metal substrate, an insulation layer disposed on the metal substrate, and a circuit pattern disposed on the insulation layer. The insulation layer contains a liquid crystal polyester and 50% by volume or more of an inorganic filler. The inorganic filler is made of boron nitride and at least one of aluminum nitride and aluminum oxide. A proportion of boron nitride in the inorganic filler is within a range of 35 to 80% by volume.

Circuit board laminate and metal-based circuit board

Growing community of inventors

Yokohama, Japan

Katsumi Mizuno