Jsr Corporation

Japan Synthetic Rubber Co., Ltd.

Arakawa Chemical Industries, Ltd.

Kawasaki Jukogyo Kabushiki Kaisha

Katsumi Inomata

Akira Tsuji

Shin-ichiro Iwanaga

Toshiyuki Ota

Masahiro Akiyama

Hiroyuki Ishii

Atsushi Ito

Masayoshi Suzuki

Yoshiji Yumoto

Takashi Nishioka

Masaru Ohta

Shin-ichirou Iwanaga

Atsushi Itou

Nasahiro Akiyama

Torahiko Yamaguchi

Nobuyuki Ito

Hideaki Masuko

Isamu Mochizuki

Yasunori Kondo

Hiromichi Hara

Seiichirou Takahashi

Shinichiro Iwanaga

Hiroyoshi Iwata

Satomi Hasegawa

Kouichi Hirose

Tooru Mizumachi

Katsuji Douki

Hidekazu Anai

Kunihiro Nagamori

Isao Makiuchi

Tooru Niihara

Makoto Oda

Yasuyuki Sakai

There is shown a stack including a substrate material temporarily fixed on a support via a temporary fixing material, wherein the temporary fixing material includes a temporary fixing material layer (I) in contact with the support-facing surface of the substrate material, and a temporary fixing material layer (II) formed on the support-facing surface of the layer (I), wherein the temporary fixing material layer (I) is formed of a temporary fixing composition containing a polymer (A) and a release agent (B) which contains a functional group capable of reacting with the polymer (A) to form a chemical bond.

Stack, method for treating substrate material, temporary fixing composition, and semiconductor device

The invention provides a substrate treating method which can favorably prevent damages to a substrate when the substrate is separated from a support, thus achieving a high yield. The substrate treating method includes, in the sequence set forth, a stepof temporarily fixing a substrate onto a support via a temporary fixing material to form a stack, the temporary fixing material including at least a temporary fixing material (I) containing a cycloolefin polymer (A) and a compound (B) having a structure (b1) such as a dialkyl silicone structure, and a structure (b2) such as a polyoxyalkylene structure, a stepof processing the substrate and/or transporting the stack, and a stepof applying a force to the substrate or the support in a direction substantially perpendicular to the plane of substrate to separate the substrate from the support.

Substrate treating method, temporary fixing composition and semiconductor device

A shield machine including an excavator capable of excavating tunnels of various cross-sectional shapes, the excavator including: a rotary drum supported at a front end side portion of a shield machine main body to be rotatable around a first center axis; a cutter supporting frame supported by the rotary drum to be rotatable around a second center axis; a rotary cutter head supported by the cutter supporting frame to be rotatable around a third center axis and including a plurality of cutter bits on a surface thereof; a rotary auxiliary cutter head supported by the rotary drum to be rotatable around a fourth center axis; and first, third, and fourth rotating mechanisms, and a swinging drive mechanism configured to respectively cause the rotary drum, the rotary cutter head, the rotary auxiliary cutter head, and the cutter supporting frame to independently rotate.

Shield machine

Positive photosensitive insulating resin compositions of the invention contain at least (A) an alkali soluble resin having a phenolic hydroxyl group, (B) a compound having a quinonediazido group, (C) crosslinked fine particles, (D) a compound containing at least two alkyletherified amino groups in the molecule, and (F) a solvent The resin compositions have excellent resolution, electrical insulating properties and thermal shock properties. Cured products of the invention are obtained by curing these resin compositions, and they show good adhesive properties.

Positive photosensitive insulating resin composition and cured product thereof

A process for forming bumps on electrode pads for a wiring board including a substrate and a plurality of electrode pads. The process (a) forms a laminated two-layer film on the wiring board and forms a pattern of apertures at positions corresponding to the electrode pads, the laminated two-layer film including a lower layer containing an alkali-soluble radiation-nonsensitive resin composition and an upper layer containing a negative radiation-sensitive resin composition; (b) fills a low-melting metal in the aperture pattern; (c) reflows the low-melting metal by pressing or heating to form bumps; and (d) peels and removes the laminated two-layer film from the board. The laminated film including two layers with different properties permits high resolution and easy peeling.

Method for forming bump on electrode pad with use of double-layered film

The invention concerns a lift-off process for patterning layers that are deposited and/or sputtered. The invention provides a two-layer resist and a patterning method using the resist. The patterning method can readily produce burr-free layers on a substrate. The method comprises the steps of:

Two-layer film and method of forming pattern with the same

Positive photosensitive insulating resin compositions of the invention contain at least (A) an alkali soluble resin having a phenolic hydroxyl group, (B) a compound having a quinonediazido group, (C) crosslinked fine particles, (D) a compound containing at least two alkyletherified amino groups in the molecule, and (F) a solvent. The resin compositions have excellent resolution, electrical insulating properties and thermal shock properties. Cured products of the invention are obtained by curing these resin compositions, and they show good adhesive properties.

Positively photosensitive insulating resin composition and cured object obtained therefrom

A photosensitive composition for forming a dielectric of the present invention comprising inorganic particles, an alkali developable resin and additives, wherein the additives comprise a compound having a quinonediazido group (C1), a compound containing at least two alkyletherified amino groups in the molecule (C2) and a thermal acid generator (C3), or wherein the inorganic particles comprise inorganic superfine particles (A-I) having a mean particle diameter of less than 0.05 &#x3bc;m and inorganic fine particles (A-II) having a mean particle diameter of not less than 0.05 &#x3bc;m. The composition can be calcined at low temperatures to form a dielectric layer with high dimensional precision, said layer having a high dielectric constant and a low dielectric loss. Also provided are a dielectric and an electronic part prepared from the composition.

Composition for forming photosensitive dielectric material, and transfer film, dielectric material and electronic parts using the same

A radiation-sensitive resin composition including (A) an alkali-soluble novolak resin obtained by condensing a particular combination of a first phenol having formula:

Radiation-sensitive resin composition

A radiation-sensitive resin composition including (1) an alkali-soluble resin, (2) a quinonediazide compound and (3) a mixed solvent including a monoketone having 7 to 14 carbon atoms and an alkoxypropionic acid alkyl ester is provided. The composition can be coated in a uniform thickness in a small coating weight. The composition has a high sensitivity and a high resolution, and also enables formation of resist patterns having a superior pattern shape with less pattern defects. Thus, it is suitable as a positive resist.

A radiation-sensitive resin composition including an alkali soluble resin and a quinonediazide compound is provided. The quinonediazide compound has the formula (1), for example: ##STR1## wherein, R.sup.1 to R.sup.6 are an alkyl, cycloalkyl or aryl group; a and b are an integer of 1 to 3; D.sup.1 and D.sup.2 are independently a hydrogen atom or a 1,2-quinonediazidosulfonyl group, provided that at least one of D.sup.1 is a 1,2-quinonediazidosulfonyl group; A is a bonding such as single bond; and x and y are an integer of 0 to 2. The composition is suitable as a positive resist, which effectively restrains the occurrence of scum, and excellent in developability, pattern shape, sensitivity, resolution and focus latitude.

A radiation-sensitive resin composition comprising:

A radiation sensitive resin composition containing an alkali soluble resin and a 1,2-quinonediazide compound of a polyphenol or a radiation sensitive resin composition containing an alkali soluble resin and a 1,2-quinonediazide compound and a polyphenol compound.

Radiation sensitive resin composition

The present invention provides a radiation sensitive resin composition which contains an alkali soluble resin and a 1,2-quinonediazide compound represented by the following formula, for example. ##STR1## The radiation sensitive resin composition of the present invention has an excellent developability, provides an excellent pattern shape, is superior in sensitivity and resolution, and has greatly improved focus latitude and heat resistance in particular. Therefore, the radiation sensitive resin composition of the present invention can be suitably used as a resist for the production of LSIs.

Growing community of inventors

Tokyo, Japan

Katsumi Inomata