Sony Corporation

Katsumi Ando

Yoichiro Sako

Akira Tange

Yuki Koga

Takeshi Nogami

Takatoshi Nakamura

Tadashi Yamamoto

Naoki Komai

Mitsuru Taguchi

Kazutoshi Serita

Hideyuki Kito

Makoto Morishita

Makoto Futatsugi

Toru Yamamuro

Provided is a medical system including a first capsule type medical device, and a second capsule type medical device. The first and second capsule type medical devices operate in cooperation with each other in a body.

Medical system including a plurality of capsule type medical devices

There is provided an information processing device including a characteristic detection unit that detects a characteristic of a battery and a characteristic of an operating device that operates using electric power obtained from the battery, a symbol setting unit that sets one symbol on which information corresponding to the detected characteristics is reflected, and a display control unit that causes the set symbol to be displayed.

Information processing device, information processing method, and program

A method of implementing an electrolytic polishing process against a wiring-material film by way of preventing excessive polishing or incomplete polishing caused by presence of differential steps locally generated in the objective wiring-material film. The inventive method comprises a step of forming a wiring-material film for burying recessed portions formed on an insulating film formed on a substrate via a plating process; a step of reducing a local differential step generated on the surface of the wiring-material film by way of preserving the wiring material film on the insulating film; and a final step of removing the wiring-material film deposited on the insulating film by way of preserving such wiring-material film deposited, solely inside of the recessed portions.

Method of manufacturing a semiconductor device

A semiconductor laser such as a laser diode includes a semiconductor substrate and a laser diode region disposed on said semiconductor substrate and having a laser beam emission end. The semiconductor substrate has a front surface directly below said laser beam emission end, said front surface being retracted from said laser beam emission end. The front surface may be formed as an optically roughened surface as a side wall surface of a groove when the groove is defined in the semiconductor substrate by dicing. The laser diode region includes an active layer of GaAs or AlGaAs. The front surface may further be optically roughened by etching or sputtering.

Semiconductor laser and method of manufacturing same

Growing community of inventors

Tokyo, Japan

Katsumi Ando