Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Katsumasa Miki

Suzushi Kimura

Yuji Mido

Tatsuo Fujii

Masaya Nakatani

Koji Nomura

Makoto Nakano

Yoshiyuki Yamamoto

Yasuhiro Sugaya

Toshiyuki Asahi

Takeshi Masutani

Takeshi Nakayama

Ryoichi Takayama

Kazuki Komaki

Masaaki Katsumata

Isaku Kanno

Hirofumi Tajika

Katsuya Morinaka

Kazuhiko Fujikawa

Tsuyoshi Himori

Tetsuhiro Korechika

Tsutomu Nakanishi

Hideki Masumi

Hiroyuki Ishitomi

Yuji Midou

Shinji Umeda

Yoshiyuki Saitou

A multilayered substrate includes a plurality of circuit boards including a plurality of wiring layers including a grounding layer and a power layer, a solid electrolytic capacitor having an insulative oxide film layer, an electrolytic layer, and a conductor layer sequentially formed on one surface or both surfaces of a foil-like metal substrate, and a conductive substance passing through the circuit board across a thickness thereof. The solid electrolytic capacitor is disposed to be held between the plurality of circuit boards. The conductor layer is connected to a grounding electrode formed on the grounding layer, the foil-like metal substrate being connected to a power electrode formed on the power layer.

Multilayer wiring board

The mounting board has a capacitor-forming sheet made from a valve metal, first and second board-forming structures, first and second electrodes, an extractor electrode, and a conductive polymer. The capacitor-forming sheet has an inner layer and a rough oxide film on at least one face of the inner layer. The first board-forming structure is provided on a face of the capacitor-forming sheet, and the second board-forming structure is provided on another face thereof on a side opposite to the first one. The first and second electrodes are isolated to each other and provided on a surface of at least one of the first and second board-forming structures. The extractor electrode and conductive polymer are provided inside at least one of the first and second board-forming structures. The extractor electrode electrically-connects the first electrode with the inner layer. The conductive polymer electrically-connects the second electrode with the rough oxide film.

Mounting board, mounted body, and electronic equipment using the same

A capacitor includes a first capacitor element and a second capacitor element laminated on this first capacitor element. The first capacitor element is a solid electrolytic capacitor including a through-hole electrode penetrating a valve metal sheet and having one surface on which cathode and anode terminal portions are taken out. The second capacitor element has first and second electrodes which are provided via a dielectric layer, and second through-hole electrodes penetrating the dielectric layer. The second through-hole electrodes are coupled to the first electrode and insulated from the second electrode. Lead-out portions of the second electrodes are exposed from the dielectric layer. The second through-hole electrodes and the lead-out portions are disposed alternately. The first electrode is electrically coupled to the first through-hole electrode and the second electrode is electrically coupled to the valve metal sheet.

Capacitor

A micro-transfer device for fine positioning is employed typically in recording and playback apparatus for recording disks. Voltage is stably supplied to an expandable element which displaces the position of a recording head by applying voltage. An end different from one end connected to a base, where the recording head is mounted, is fixed to a fixing substrate for preventing changes in dimensions of the expandable element. An external electrode connection for supplying voltage to the expandable element is provided in an area on the fixing substrate.

Micro-moving device and its manufacturing method

A solid electrolytic capacitor includes a valve metal sheet having a porous portion on one side of the sheet, a dielectric layer formed on the porous portion, a solid electrolyte layer formed on the dielectric layer, a collector layer formed on the solid electrolyte layer, a through-hole electrode connected to the collector layer and penetrating the valve metal sheet to be exposed to the other side of the sheet, and an electrode terminal insulated from the through-hole electrode and connected to the valve metal sheet. The capacitor further includes an insulating portion penetrating the valve metal sheet and a penetration electrode penetrating the insulating portion. The solid electrolytic capacitor has a large capacitance and an excellent radio frequency response, and can be easily mounted on a semiconductor device.

Electrolytic capacitor and method for manufacturing the same

A method for manufacturing large capacitance solid electrolytic capacitors that can be connected direct with semiconductor component, and offer a superior high frequency characteristic. An aluminum foilis made porous in one of the surfaces, a dielectric layeris formed on the porous portion, a through holeis provided in the aluminum foilat a certain specific location. An insulation layeris formed to cover the other surface, viz. non-porous surface, of the aluminum foiland the inner wall surface of through hole, a solid electrolytic layeris provided on the dielectric layer, and a through hole electrodeis formed in the through hole, and then a collector layeris formed on the solid electrolytic layer. The insulation layerdisposed on aluminum foilis provided with an openingat a certain specific location, and a connection terminalis provided at the openingof insulation layerand the exposed surface of the through hole electrode, respectively.

Method for producing solid electrolytic capacitor

A method for manufacturing solid electrolytic capacitor that can be mounted direct on a semiconductor component and offers a superior high frequency characteristic. An aluminum foilis provided on one surface with a resist filmand then with a through hole. Next, an insulation filmis formed to cover the other surface of aluminum foiland to fill the first through hole, and then the resist filmis removed; and then the surface of aluminum foilis roughened to be provided with a dielectric layerthereon. A second through holeis formed in the insulation film, which is filling the first through hole. A through hole electrodeis formed in the second through hole; and then, on the surface of the dielectric layer, a solid electrolytic layerand a collector layerare formed. After an openingis provided, a first connection terminalis formed therein, and a second connection electrodeon the exposed surface of the through hole electrode

Method for manufacturing solid electrolytic capacitor

A solid electrolytic capacitor includes a bulb-metal sheet of which first face has a porous section. A dielectric film, a solid electrolyte layer, and a current-collecting layer are formed in this order on the porous section. On top of the current-collecting layer, a reinforcing plate is bonded. A second face opposite to the first face of the sheet has a connecting terminal conductive to the current-collecting layer. This connecting terminal is coupled to a through-hole electrode which extends through the bulb-metal sheet for appearing outside the second face. The second face has another connecting terminal conductive to the bulb-metal sheet. This structure makes the capacitor thin, and allows the capacitor to increase its stress-resistance and be excellent in responsiveness to a high frequency as well as in mounting convenience.

Solid electrolytic capacitor and manufacturing method of the same

A method of manufacturing solid electrolytic capacitors that can be directly connected to semiconductor components and have a faster response to a high frequency as well as a larger capacitance includes: a dielectric forming stage where a valve metal sheet ( ) is made porous and a dielectric coating ( ) is provided on the porous face ( ); an element forming stage where a solid electrolytic layer ( ) and a collector layer ( ) are formed on the dielectric coating ( ); and a terminal forming stage where a connecting terminal ( ) for connecting to an external electrode is formed. The element forming stage includes the steps of forming the solid electrolytic layer ( ); a forming through-hole electrode ( ) in a through-hole ( ) that is prepared on the valve metal sheet ( ); and forming the collector ( ) on the solid electrolytic layer ( ).

Method of manufacturing solid-state electrolytic capacitor

The present invention aims to provide a circuit module that includes a sheet-like solid electrolytic capacitor and reduces an area and volume required for mounting electronic components. In the sheet-like solid electrolytic capacitor, valve metal sheet has dielectric layer and current collector layer formed on the surface thereof, and is packaged by insulators and The circuit module is structured to embed the sheet-like solid electrolytic capacitor in a circuit board.

Circuit module

A dielectric layer is formed on a surface of a porous portion formed at least on a surface of a valve metal sheet. A solid electrolyte layer is formed on the dielectric layer, and a collector layer is formed on the solid electrolyte layer. A first insulating portion is formed on an outer periphery of the dielectric layer, and a solid electrolyte layer is formed on a portion of the dielectric layer corresponding to an opening of the first insulating portion. A portion of the solid electrolyte layer is formed on the first insulating portion. A second insulating portion is formed on the first insulating portion and on the outer periphery of the solid electrolyte layer. A collector layer is formed on a surface of the solid electrolyte layer exposed through an opening of the second insulating portion, thus providing a solid electrolytic capacitor. The solid electrolytic capacitor has less current leakage and a high withstand voltage.

Solid electrolytic capacitor and method of manufacturing capacitor

A solid electrolytic capacitor having a high capacitance and excellent high frequency response including a valve metal sheet which is made porous, a dielectric layer formed on the porous portion, a solid electrolyte layer formed on the dielectric layer, a collector layer and an electrode exposure area formed on the solid electrolyte layer, and an insulating section electrically insulating the electrode exposure area from the collector layer, in which the electrode exposure area and the collector layer are formed on the same surface of the valve metal sheet.

Solid electrolytic capacitor and method of manufacturing the capacitor

A liquid injector having a liquid eject outlet side reduced in size is provided. In a head block of the liquid injector, a pressurizing chamber is linearly aligned with a liquid eject outlet and liquid feed inlet.

Liquid injector, method of manufacturing the injector, and ink-jet spray using the injector

A fluid ejection device, such as for an ink jet printer or the like, having increased increasing nozzle density. A through-hole ( ) is provided in a glass substrate ( ) to which a second silicon substrate ( ) is directly bonded to form an ink outlet ( ). The first silicon substrate ( ) is etched to form a pressure chamber ( ), an ink channel ( ) and an ink inlet ( ), and bonded directly to the glass substrate ( ). A piezoelectric thin film ( ), having a conductive, elastic body ( ), is bonded to the first substrate covering the pressure chamber ( ). The elastic body ( ) is sandwiched between the piezoelectric thin film ( ) and a resin layer ( ). The second substrate ( ) has a thickness of less than about 0.8 mm in a range of thickness comprising about 1.2 to about 1.9 times (rg-rs), wherein rg is the diameter of the wide end of the through-hole ( ) and rs is the diameter of the narrow end of the through-hole ( ).

Fluid ejection device and process for the production thereof

The present invention relates to an infrared detector element to detect infrared rays by means of a pyroelectric material, and an infrared sensor unit and an infrared detecting device using the infrared detector element and has an object of realizing an omnidirectional infrared detector element that can gain an output against an object to be detected moving in whatever directions. In order to accomplish this object, the present invention proposes a setup comprising a pair of first electrodes ( ), which have a function of absorbing infrared rays, are close to trapezoidal in shape, respectively, and are disposed on one of the surfaces of a pyroelectric material ( ) with electrical connections made in such a way that the first electrodes are opposite to each other in polarity, and a pair of second electrodes ( ) disposed on the other surface of the pyroelectric material ( ) and electrically connected with each other, in which the lower side of the close to trapezoidal shape of the first electrodes ( ) of one hand is aligned in the same direction as the lower side of the close to trapezoidal shape of the second electrodes ( ) of the other hand, thereby producing an effect of gaining an output against an object to be detected making a movement from whatever directions.

Growing community of inventors

Osaka, Japan

Katsumasa Miki