Konica Minolta, Inc.

Konica Minolta Opto, Inc.

Katsuki Furuta

Hiroyuki Matsuda

Kazuhiro Wada

A resin amount for forming each first-stage resin layer portion (a first-stage resin replica portion)in a first process is defined to be greater than a resin amount for forming each second-stage resin layer portion (a second-stage resin replica portion)in a second process. Therefore, at a boundary between the first-stage resin layer portionand the second-stage resin layer portion, a joint portionat which resin overlaps is formed, whereby occurrence of an undercut shape can be avoided. Therefore, in a molding process using a sub-master dieand a sub-sub-master dieobtained from the sub-master die, occurrence of an undesired shape can be avoided, whereby mold release resistance can be reduced or eliminated.

Methods for producing molding die, wafer lens, and optical lens

A lens assembling method for assembling a first lens and a second lens where the first lens has a first mark on a first surface thereof and a second mark on a second surface opposite to the first surface, and the second lens has a third mark on a first surface thereof, the lens assembling method including: a first step of aligning a position of one of the first mark and second marks of the first lens with a position of the third mark of the second lens; and a second step of aligning a position of the other one of the first and second marks of the first lens with the position of the third mark of the second lens, while keeping the position alignment performed in the first step.

Growing community of inventors

Hachioji, Japan

Katsuki Furuta