Hitachi Chemical Company, Ltd.

Katsuji Shibata

Hiroshi Shimizu

Nozomu Takano

Kazuhito Kobayashi

Masami Arai

Ikuo Hoshi

Yasuo Miyadera

Masami Yusa

Akishi Nakaso

Nobuyuki Ogawa

Hiroyuki Izawa

Ayako Iwamaru

Mitsumasa Kojima

Hidetaka Satou

Takeshi Horiuchi

Masatoshi Yoshida

Toshihiko Kato

Hisayo Masuda

Ayako Matsuo

The present invention provides a dissolution method for saturated polyester capable of recycling saturated polyester used in fibers, a film, a bottle and others with ease and a low cost, a solution decomposing saturated polyester and a decomposition method using the solution.

Method for dissolving saturated polyester solution for decomposing saturated polyester and method for decomposition using the same

A method of treating a composite material of epoxy resin-cured product and inorganic matter to easily recover the resin components in a recyclable state without causing thermal decomposition. A method of separating the inorganic matter. The epoxy resin-cured product is treated with a treatment liquid which contains a decomposition catalyst for epoxy resin-cured products and an organic solvent to decompose and dissolve the epoxy resin-cured product. A composite material of epoxy resin-cured product and inorganic matter is also treated to decompose and dissolve the epoxy resin-cured product in the above-mentioned manner and the inorganic matter is then separated from the liquid.

Method of treating epoxy resin-cured product

The present invention provides a decomposition treatment liquid for a cured unsaturated polyester resin, comprising a phosphoric acid-type compound or salt thereof and an organic solvent as essential components. By using the treatment liquid of the invention, a cured unsaturated polyester resin can be easily decomposed or dissolved.

Treatment liquid for cured unsaturated polyester resin and treatment method thereof

An etching solution comprising (A) an amine as a solvent, (B) an alkali metal compound, and (C) an alcohol as a solvent, this etching solution being a non-aqueous solution. This etching solution is-effective for etching a cured epoxy resin layer for forming holes for interstitial via holes having a small diameter, in the production of a multilayer printed circuit board. This etching solution is particularly effective for etching a cured epoxy resin layer formed from a thermosetting epoxy resin composition including (a) an epoxy resin, (b) a crosslinking agent, and (c) a polyfunctional epoxy resin, which forms a thermosetting copper-clad adhesive resin sheet which covers an interlayer circuit plate of a multilayer printed circuit board.

Process for producing multilayer printed circuit boards

A process for producing a multilayer printed circuit board produced characterized by using a special thermosetting epoxy resin composition comprising (a) an epoxy resin, (b) a crosslinking agent and (c) a polyfunctional epoxy resin, for forming a thermosetting copper-clad adhesive resin sheet, which cover an interlayer circuit plate, followed by etching of cured adhesive resin for forming holes for interstitial via holes (IVH) having a small diameter using a special etching solution comprising (A) an amine as a solvent, (B) an alkali metal compound, and (C) an alcohol as a solvent, is suitable for mass production of multilayer printed circuit boards having IVH excellent in connection reliability and electrical properties.

Ultra high molecular weight epoxy resins are produced in a short time by polymerizing a difunctional epoxy resin having two epoxy group per molecule and a dihydric phenol by heating the difunctional epoxy resin and the dihydric phenol which are present in quantities which provide a ratio of phenolic hydroxyl groups to epoxy groups of from 1:0.9 to 1:1.1, in an amide solvent, in the presence of a polymerization catalyst, and the ultra high molecular weight epoxy resins are linearly polymerized so highly as to have the capability of being formed into films having high strength.

Method of producing high molecular weight epoxy resin using an amide

An epoxy resin film which is so strong as to have a tensile strength of not less than 10 MPa and an elongation of not less than 5% is formed by using a substantially linear high molecular weight epoxy resin which is synthesized by polymerizing a difunctional epoxy resin having two epoxy groups per molecule and a dihydric phenol in an aprotic polar solvent, in the presence of a solvent, at a reaction temperature ranging from 80.degree. to 130.degree. C., the difunctional epoxy resin and the dihydric phenol being used in quantities which provide a ratio of phenolic hydroxyl groups to epoxy groups of from 1:0.9 to 1:1.1 and a proportion of the total of them of at most 50% by weight based on the total of them and the aprotic polar solvent.

Method of producing epoxy resin film

Epoxy resin film and method of producing epoxy resin film

Disclosed herein are processes for the preparation of polyimide-isoindroquinazolinediones and precursor thereof. These polymers are useful as heat-resistant electric insulation materials, surface coating films for electronic instrument parts and especially suitable for manufacturing a photoresist. The above precursor is produced by reacting a an alkylenebistrimellitate dianhydride, a diaminoamide compound and the other amine. The precursor is readily dehydrated and ring-closed to produce polyimide-isoindroquinazolinedione, which is often conveniently conducted by producing a varnish of the precursor, applying it onto adequate substrates such as silicon wafers, glass plates, metal plates, etc. and then subjecting the coated film to dehydration. The resulting films have excellent physical properties such as good adherence, high tensile strength, low elasticity, etc.

Processes for preparation of polyimide-isoindroquinazolinedione and

An epoxy resin composition for a copper-clad laminate comprising an epoxy resin having at least two epoxy groups in one molecule, a phenolic compound having at least two functional groups in one molecule as a hardener, an imidazole compound having a masked imino group as a hardening accelerator, and one or more of nitrogen compounds selected from the group consisting of urea derivatives represented by the formula R.sup.1 --NH--CO--NH.sub.2, wherein R.sup.1 is hydrogen or an organic group; acid amide compounds; and guanidine derivatives, which is advantageously used for the material of a copper-clad laminate. Accordingly, the copper-clad laminate is especially used for the production of printed circuit boards, and its drilling property, peeling resistance of the copper foil, adhesive property, and heat resistance are improved remarkably. In addition, this epoxy resin composition has an excellent storing stability.

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Shimotsuma, Japan

Katsuji Shibata