Murata Manufacturing Co., Ltd.

Katsuji Matsuta

Masahiko Kawaguchi

Toshimi Kaneko

Kazuyoshi Uchiyama

Minoru Matsunaga

Naoki Iida

Kazuhide Kudo

Kenichi Ito

Kazuo Dougauchi

Katsuhiro Misaki

Yukio Sakamoto

Kosuke Ishida

Toshiya Sasaki

Yasuhiro Fujiki

Kenichi Itou

An electronic component is configured to include a laminate disposed between first and second magnetic substrates. The laminate is formed by laminating resin insulating layers, a coil pattern, and a lead pattern. The coil pattern is connected to external electrodes disposed on end surfaces of the laminate by using internal electrodes. The electronic component further includes expansion relaxation portions disposed in the inside of the resin insulating layers and located in the vicinity of connection regions of the internal electrodes and the external electrodes. The expansion relaxation portions are formed by using a magnetic powder resin in which a ferrite powder and a resin material are mixed.

Electronic component

An electronic component and an electronic-component production method in which the magnitude of a stray capacitance produced between adjacent outer electrodes is controllable. The electronic component includes a chip body and first to fourth outer electrodes. In the chip body, first and second coil block are sandwiched between magnetic substrates. Dielectric layers are interposed between the outer electrodes and the chip body such as to be away from exposed portions of coil patterns in the coil blocks. The dielectric layers have a width larger than a width of the outer electrodes, and a dielectric constant of the dielectric layers is set to be lower than the dielectric constant of the magnetic substrates.

Electronic component and electronic-component production method

A laminated balun transformer that achieves improved balance characteristics and prevents the occurrence of parasitic inductance has an impedance transformation ratio of one to four and outputs balanced signals generated from an unbalanced signal. The laminated balun transformer includes a magnetic substrate, a laminated body, and external electrodes. The laminated body includes a first transformer, a second transformer, and a non-magnetic body which completely covers the first and second transformers from the outside. The first and second transformers are arranged side by side in a direction substantially parallel to the magnetic substrate. A primary coil of the first transformer and a secondary coil of the second transformer are configured to be 180-degree rotationally symmetric with respect to a center line, while a secondary coil and a primary coil are also configured to be 180-degree rotationally symmetric with respect to the center line L.

Laminated balun transformer

A coil component includes a first coil block and a second coil block that are sandwiched between magnetic substrates so as to form a chip body, and external electrodes that are attached to the chip body. The first coil block includes a coil body and an insulating body. The coil body includes an outer coil portion and an inner coil portion. The outer coil portion includes a first pattern group and a second pattern group, which are connected helically vertically in an alternating fashion. The inner coil portion includes a first spiral pattern and a second spiral pattern, which are connected to each other in series. In other words, low stray capacitance is achieved by the outer coil portion, while high inductance is achieved by the inner coil portion.

Coil component

A common mode choke coil array of a two-element type includes two common mode choke coil elements including at least two spiral coils and arranged side by side in a laminate body (chip member) in plan view. The spiral coils are configured so that the number of turns of the coils on the sides thereof where the coils are adjacent to each other is smaller than the number of turns of the coils on the sides thereof where the coils are distant from each other. The spiral directions of the coils arranged side by side are opposite to each other.

Common mode choke coil array

A coil device includes a first magnetic substrate, a laminated body disposed on the first magnetic substrate and having insulating layers, coil patterns, and at least one through-hole, a magnetic layer covering the upper surface of the laminated body, an adhesive layer disposed on the magnetic layer, and a second magnetic substrate disposed on the adhesive layer and bonded to the magnetic layer via the adhesive layer. The insulating layers defining an insulator and the coil patterns for forming a coil are alternately stacked so that the coil patterns are arranged in the insulator, the through-hole is located at an area where the coils are not located and extends from the upper surface of the laminated body to the first magnetic substrate. The magnetic layer has at least one portion extending through the through-hole to contact the first magnetic substrate. The adhesive layer is nonmagnetic, and the laminated body is sandwiched between the first and second substrates.

Coil device

A method of manufacturing an electronic component secures sufficient area such that an element of the electronic component can be formed on the surface of a mother substrate while preventing debris from an insulating film from remaining on the element. According the method, individual elements are cut out from the mother substrate by cutting the mother substrate along cut lines A and B by using a dicing process wherein a protecting film is not located only at portions of the surface of the mother substrate where cut lines A and B intersect with each other and the surface of the mother substrate is exposed only at the intersection portions.

Method of manufacturing electronic component

A method of manufacturing an electronic component provides a wide area which can be used for forming elements on the surface of a mother substrate and effectively produces an electronic component having excellent performance characteristics. At least a portion of the mother substrate is cut by using a blade having a shape in which a portion thereof butted against the boundary (shoulder) between the electrode arrangement surface and the cut end surface of the mother substrate or a portion which becomes the boundary (shoulder) is inclined at a predetermined angle to form an inclined surface at the boundary (shoulder) or the portion which becomes the boundary (shoulder) so as to expose a part of an electrode at the inclined surface.

Electronic component and method of manufacturing same

A variable inductor device has at least two coils. The at least two coils are disposed on an insulating substrate with an inductance adjusting element located therebetween. The inductance adjusting element is electrically connected at one end to a tap center electrode. The at least two coils are electrically connected to each other via the inductance adjusting element. The inductance adjusting element is grooved and horizontal paths of the inductance adjusting element are sequentially disconnected one by one by, for example, a laser beam. The inductances are thus varied. It is therefore possible to provide a variable inductor device in which the area required for mounting the device on a printed circuit board is decreased and the inductances are stably adjusted while keeping the inductances balanced.

Variable inductor device

A method of manufacturing an electronic component includes forming a slit in a connecting electrode located on the surface of a mother substrate such that the slit extends in a direction intersecting a cutting line, and cutting the mother substrate along the cutting line while cutting the connecting electrode having the slit. The connecting electrode is thereby reliably exposed on two opposing cut surfaces, and the reliability of external connection of the electronic component is improved.

Method of manufacturing electronic components

There is provided a chip type filter which can be made compact, allows the matching of input/output impedance, and has preferable characteristics. A ground electrode is formed on one side of a dielectric substrate, and spiral-shaped pattern electrodes are formed on the other side. Input/output electrodes are led out from intermediate portions of the pattern electrodes. Curved portions are formed between the input/output electrodes and the ends of the pattern electrodes. The ends of the pattern electrodes are positioned close to each other. Protective layers are formed on the ground electrode and pattern electrodes, which are laminated and integrated to form external electrodes. The ends of the pattern electrodes and the ground electrode are connected by one of the external electrodes.

Chip type filter with electromagnetically coupled resonators

A resonator 10 includes a first dielectric substrate 12. An earth electrode 14 is formed almost entirely on one main surface of the first dielectric substrate 12. A first pattern electrode 16 and a first drawing electrode 18 are formed on the other main surface of the first dielectric substrate 12. The first pattern electrode 16 and the first drawing electrode 18 are covered with an insulation layer 20. A second pattern electrode 22 and a second drawing electrode 24 are formed on the insulation layer 20. The second pattern electrode 22 and the second drawing electrode 24 are covered with a protecting layer 26. The earth electrode 14 is covered with a protecting layer 28. The earth electrode 14, the first pattern electrode 16 and the second pattern electrode 22 are connected with each other through a terminal electrode 30a. Terminal electrodes 30b and 30c are connected to the earth electrode 14. A drawing terminal electrode 32 is connected to the first drawing electrode 18 and the second drawing electrode 24.

Resonator with spiral-shaped pattern electrodes

A resonator comprises two dielectric substrates. A ground electrode and a U-shaped pattern electrode are formed respectively on the two surfaces of the first dielectric substrate. A take-out electrode is drawn out at a certain distance from one end of the pattern electrode, and is connected to the take-out terminal electrode. A guard electrode is formed opposite to the other end of the pattern electrode. A shield electrode is formed on a second dielectric substrate. The pattern electrode, the ground electrode and the shield electrode are connected by a terminal electrode. In addition, the guard electrode, the ground electrode and the shield electrode are connected by a terminal electrode. A chip-type filter can be obtained by forming a plurality of pattern electrodes on an dielectric substrate, and coupling them electromagnetically.

Resonator and chip-type filter using it

A strip line filter has at least two strip lines and a common ground electrode, and on an end, has a solder ground terminal electrode and at least two link ground terminal electrodes at a distance from the solder ground terminal electrode. The solder ground terminal electrode is electrically connected with the common ground electrode, and the link ground terminal electrodes electrically connect each of the strip lines with the common ground electrode. Another strip line filter has at least two strip lines and a common ground electrode, and on an end, has a ground terminal electrode which has a solder portion and at least two arm portions extending from the solder portion. The ground terminal electrode is electrically connected with the common ground electrode via the solder portion and with the strip lines via the arm portions.

Strip line filter

An earth electrode and a spiral pattern electrode are formed on both surfaces of a dielectric plate. One end of the pattern electrode is connected to the earth electrode. The width of the pattern electrode is made narrow in proportion to going from one end toward the other end. An area ratio S2/S1 is 0.15 or more when defining an area of the pattern electrode as S1, and an area of center portion where the pattern electrode is not formed as S2. A take-out electrode is drawn out from the pattern electrode with a distance from the one end of the pattern electrode. A chip type filter is manufactured by forming plural pattern electrodes on the dielectric plate, and coupling the pattern electrodes electromagnetically.

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Yokohama, Japan

Katsuji Matsuta