Citizen Watch Company, Ltd.

Katsuji Komatsu

Isao Yabe

Yoshihiro Shimada

Shingo Ichikawa

Yoshihiro Ishida

Seiichi Mimura

Kikuo Takenouchi

Hiroyuki Kaneko

A resin encapsulated pin grid array includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.

Resin encapsulated semiconductor device

Resin encapsulated pin grid array and method of manufacturing the same

A method of making a resin encapsulated pin grid array includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.

Method of making a resin encapsulated pin grid array with integral

A method of making a resin encapsulated pin grid array which includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.

A resin encapsulating method includes the steps of mounting a plate having a gate groove on a substrate to form a side gate, connected to the side surface of a cavity, between the plate and one of the upper and lower half molds, and filling a resin in the cavity.

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Kawagoe, Japan

Katsuji Komatsu