Seiko Epson Corporation

Katsuji Arakawa

Jun Amako

Shinichi Yotsuya

Hiroshi Koeda

Kazushige Umetsu

Kazufumi Oya

Masahiro Fujii

Nozomu Hirokubo

Hiroshi Komatsu

Susumu Shinto

Yoshihide Matsuo

Yasutaka Matsumoto

Yuji Chino

A wavelength variable interference filter includes a fixed substrate, a movable substrate that faces the first substrate, a fixed reflective film that is disposed between the fixed substrate and the movable substrate, and a movable reflective film that is disposed between the fixed reflective film and the movable substrate, in which the fixed substrate transmits light, the fixed reflective film includes silver, and a concentration of a hydroxyl group that the fixed substrate includes is 500 ppm or less or 1000 ppm or more.

Wavelength variable interference filter having substrate hydroxyl group concentration, electronic component, manufacturing method of electronic component, and electronic apparatus

A movable substrate of a wavelength variable interference filter includes a movable portion and a groove which is provided outside of the movable portion, in a plan view when the movable substrate is seen from a substrate thickness direction, the groove includes a bottom surface having an even groove depth dimension and a side surface which is continued to the bottom surface, and the side surface is configured with arc-like first curved surface portion and second curved surface portion, in a cross-sectional view when the movable substrate is cut along the substrate thickness direction.

Wavelength variable interference filter, manufacturing method of wavelength variable interference filter, optical filter device, optical module, and electronic apparatus

A variable wavelength interference filter includes a first substrate having a fixed mirror, a second substrate bonded to the first substrate and having a movable portion and a movable mirror fixed to the movable portion, a third substrate bonded to the second substrate on the side opposite to the first substrate, and an electrostatic actuator which displaces the movable portion in a substrate thickness direction, wherein a penetration hole connecting a light exiting-side space between the first substrate and the second substrate and a light incident-side space between the second substrate and the third substrate to a space outside the filter is formed, and the penetration hole is sealed with a sealant which tightly closes each space in a reduced-pressure state.

Variable wavelength interference filter, optical module, optical analysis device, and method for manufacturing variable wavelength interference filter

A nozzle plate includes: a nozzle plate main body made of metal, the nozzle plate main body having nozzle rows formed of nozzles arranged in parallel and penetrating the nozzle plate main body in a thickness direction, wherein at the outer edge of the nozzles on a droplet discharge surface of the nozzle plate main body, a water-repellent film is provided, and primer treatment is performed on at least part of the periphery of the droplet discharge surface of the nozzle plate main body, the periphery outside the water-repellent film.

Nozzle plate, discharge head, method for producing the nozzle plate, method for producing the discharge head, and discharge device

A nozzle plate includes a silicon substrate, and a nozzle hole formed in the silicon substrate for discharging a liquid droplet provided with: a first nozzle portion formed perpendicularly to a surface of the silicon substrate; a second nozzle portion formed on a same axis as an axis of the first nozzle portion and having a cross-sectional area that is larger than a cross-sectional area of the first nozzle portion; and an inclined portion having a cross-sectional area gradually increasing from the first nozzle portion to the second nozzle portion.

Nozzle plate, droplet discharge head, method for manufacturing the same and droplet discharge device

A droplet discharging head includes: a nozzle substrate that has a plurality of nozzle holes; a cavity substrate that communicates with the nozzle holes and which has a plurality of independent discharge chambers, the discharge chambers generating pressure therein so as to discharge droplets through the nozzle holes; a reservoir substrate that has a reservoir concave section and is provided between the nozzle substrate and the cavity substrate, the reservoir concave section functioning a reservoir, the reservoir being shared for communicating with the discharge chambers; a resin thin film formed on an entire inner surface of the reservoir concave section by film deposition, the resin thin film not being formed in the reservoir substrate on a side of an adhesion interface with the nozzle substrate or the cavity substrate; and a bottom surface of the reservoir concave section functioning a diaphragm section, the diaphragm section including the resin thin film and buffering pressure fluctuation.

Droplet discharging head, droplet discharging apparatus, method for manufacturing droplet discharging head and method for manufacturing droplet discharging apparatus

To provide an electrostatic actuator that generates high pressure under a given voltage and includes an insulating film exhibiting excellent insulation resistance, a droplet discharge head that includes the electrostatic actuator and a method for manufacturing the droplet discharge head, a droplet discharge apparatus that includes the droplet discharge head and has excellent printing performance, and a device that includes the electrostatic actuator and has excellent driving performance. A diaphragm, a counter electrodeopposite to the diaphragmwith a gap interposed therebetween, and an insulating filmon a surface of the diaphragmopposite to the counter electrodeare included. The insulating filmincludes at least a dielectric filmformed of a substance having a higher relative dielectric constant than silicon oxide.

Electrostatic actuator, droplet discharge head and method for manufacturing the droplet discharge head, droplet discharge apparatus, and device

A method for manufacturing a droplet ejection head includes a step of forming recessed sections for forming nozzles by etching half way through a first face of a silicon substrate, a step of bonding a first support substrate to the first face of the silicon substrate, a step of reducing the thickness of the silicon substrate by processing a second face of the silicon substrate that is opposite to the first face thereof, and making the recessed sections through holes, and a step of removing the first support substrate from the silicon substrate after the reduction of the thickness of the silicon substrate.

Method for manufacturing a droplet ejection head

A method of manufacturing a nozzle plateis disclosed. The nozzle platehas a plurality of nozzle openingsthrough each of which a droplet is adapted to be ejected. The method includes the steps of: preparing a processing substrate (silicon substrate) constituted from silicon as a main material, the processing substrate having two major surfaces; providing a supporting substratefor supporting the processing substrate onto one major surface of the processing substrate; and forming the plurality of nozzle openingson the other major surface of the processing substrate by subjecting the other major surface of the processing substrate to an etching process while the processing substrate is supported by the supporting substrate

Method of manufacturing a nozzle plate

A method for surface treatment includes: a first step in which a surface treatment apparatusand a substratein a state where a front surfaceof the substratefaces the surface treatment apparatusare conveyed to the inside of a decompression chamber to decompress a plurality of concave portions(enclosed spaces); a second step in which the surface treatment apparatusand the substrateare brought out from the inside of the decompression chamber to environment under atmospheric pressure in a state where the substrateis being attracted to the surface treatment apparatuswith the use of a difference between negative pressure inside the concave portionsand atmospheric pressure; and a third step in which the surface treatment is carried out to a back surfaceof the substratewith the substratebeing attracted by the surface treatment apparatus

Method for surface treatment

A stable and durable heat-generating element and substrate, a method of efficient and highly precise manufacture of same, and equipment utilizing same are obtained. Employing as material a silicon substrate into at least a portion of which boron or another impurity is diffused to impart conductivity, a heater portion, in which are provided one or a plurality of slits the corner portions of which are removed or are rounded, is fabricated integrally on the silicon substrate by etching processes. Simultaneously with this, a depression portion provided below to control the heating state of the heater portion is formed integrally.

Heat-generating element, heat-generating substrates, heat-generating substrate manufacturing method, microswitch, and flow sensor

A semiconductor chip having a vertical current conduction structure of a high reliability: a semiconductor device, a circuit substrate, and an electronic apparatus each containing such semiconductor chips; and a method for producing them. A prehole ( ) is formed in a silicon substrate ( ) surface-oriented to a (100) face by laser beam irradiation. The prehole ( ) is enlarged by anisotropic etching to thereby form a through-hole ( ). An electrically insulating film is formed on an inner wall of the through-hole ( ). An electrically conducting material is provided inside the insulating film to thereby form a metal bump ( ).

Semiconductor chip, semiconductor device, circuit board and electronic equipment and production methods for them

A method for processing a work in which a processed hole with a high aspect ratio is formed by laser machining. Silicon oxide films ( ) are formed as protective films on front and rear surfaces, respectively, of a silicon substrate ( ). The silicon substrate ( ) is irradiated with a laser light through the protective films ( ) to thereby perform a perforating process. Alternatively, the silicon substrate ( ) is irradiated with a circularly or randomly polarized laser light. Hence, a processed hole with a high aspect ratio can be obtained. Moreover, the processed hole can be shaped straightly, so that processing accuracy is improved.

Method for machining work by laser beam

An ink jet head which is -prevented from corrosion by ink, and an ink jet recording apparatus using the same. An ink-resistant thin film ( ) made of Ti, a Ti compound, or Al O is formed on the surface of recess portions ( to ) of a substrate in which a reservoir ( ) for reserving ink, orifices ( ) and pressure chambers ( ) are formed. Since this ink-resistant thin film ( ) is formed, corrosion can be restrained without reducing printing quality, without necessity to change the component/composition of the ink and the material of the head, and with little change of its manufacturing process, even if there is a fear that the head material may be corroded by the ink.

Printing head and ink jet recording apparatus using the same

A semiconductor chip having a vertical current conduction structure of a high aspect ratio and high reliability: a semiconductor device, a circuit substrate, and an electronic apparatus each containing such semiconductor chips; and a method for producing them. A prehole ( ) is formed in a silicon substrate ( ) surface-oriented to a (100) face by laser beam irradiation. The prehole ( ) is enlarged by anisotropic etching to thereby form a through-hole ( ). An electrically insulating film is formed on an inner wall of the through-hole ( ). An electrically conducting material is provided inside the insulating film to thereby form a metal bump ( ).

Growing community of inventors

Chino, Japan

Katsuji Arakawa