Other

Sulfur Chemical Laboratory Inc.

Meiko Electronics Co., Ltd.

Denso Corporation

Sulfur Chemical Institute Inc.

Mori, Kunio

Katsuhito Mori

Kunio Mori

Yusuke Matsuno

Takahiro Kudo

Shigeru Michiwaki

Manabu Miyawaki

Kouichi Kamiyama

Hitomi Chiba

Shuukichi Takii

Yasuyuki Masuda

Masanori Yanai

Masami Saito

Hirotaka Miyano

Kazuhiro Morita

Taiga Handa

A bonded structure includes a first bonded member having a first bonding surface, a second bonded member having a second bonding surface, and a bonding layer that bonds the first bonding surface and the second bonding surface. The bonding layer includes a stress relaxation layer containing a chain polymer, a first bonded molecular layer containing a first bonded molecule bonded to the first bonding surface, and a second bonded molecular layer containing a second bonded molecule bonded to the second bonding surface. A first end of the chain polymer is bonded to the first bonded molecule via a first binding molecule or without bonding via the first binding molecule. A second end of the chain polymer is bonded to the second bonded molecule via a second binding molecule or without bonding via the second binding molecule.

Bonded structure

A surface treatment agent including a compound (&#x3b1;) is provided. The compound (&#x3b1;) has one or more M-OH groups and/or groups capable of forming M-OH (wherein M represents a metal atom), an amino group and a triazine ring; wherein said amino group is bonded to a terminal; one or more said amino groups bonded to the terminal are present; and one or more said triazine rings are present.

Surface treatment agent and novel compound

A surface treatment technique having excellent adhering function, excellent reacting function and rich diversity is provided. The surface treatment includes applying a solution containing compound (&#x3b1;) to a substrate and thus providing compound (&#x3b1;) thereon, wherein: the compound (&#x3b1;) is at least one of Formula [IV] and Formula [V]: 

Surface treatment method, surface treatment agent, and novel compound

The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (&#x3b1;) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (&#x3b1;) by a wet-mode plating technique, wherein the compound (&#x3b1;) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.

Process for forming metal film, and product equipped with metal film

To provide a technique by which an &#x2014;OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (&#x3b1;) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (&#x3b1;) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (&#x3b1;) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.

Bonding method, bondability improving agent, surface modification method, surface modifying agent, and novel compound

Growing community of inventors

Morioka, Japan

Katsuhito Mori