C.uyemura Co., Ltd.

Katsuhisa Tanabe

Tsuyoshi Maeda

Tatsushi Someya

Tetsuya Sasamura

Eriko Furuya

Yohei Kaneko

Naoshi Nishimura

Masayuki Kiso

Yoshikazu Saijo

Tohru Kamitamari

Yukinori Oda

Toshiaki Shibata

Seigo Kurosaka

Takuma Maekawa

Hiroki Okubo

Yuhei Oogami

Sayuri Tanaka

Fuminori Shibayama

Tomohiro Kawahara

Shinsuke Wada

The present invention aims to provide an etchant that can provide good deposition of a metal plating such as a nickel plating, despite its acidity, and a method of surface treatment of aluminum or an aluminum alloy using the etchant. Included is an etchant containing a zinc compound and a fluorine compound and having a pH of 4.5 to 6.5.

Etchant and method of surface treatment of aluminum or aluminum alloy

An object of the present invention is to provide an electroless Pd plating solution which enables formation of a Pd plating film forming a plating film having excellent wire bondability even after a high-temperature thermal history. An electroless Pd plating solution of the present invention includes: a Palladium compound, a reducing agent, a complexing agent, and at least one selected from a group consisting of Ge and rare earth element.

Electroless palladium plating solution

The purpose of the present invention is to provide a palladium plating solution and a plating method for improving a bath stability of a palladium plating, without decreasing a deposition property of the palladium plating. A palladium plating solution for improving a bath stability, without decreasing a deposition property, comprising: an aqueous palladium compound: one or more complexing agent containing a compound having at least an ethylenediamine or a propylenediamine skeleton; a formic acid or a formate; and a sulfur compound, wherein the palladium plating solution is having two or more sulfide groups in a molecule of the sulfur compound.

Palladium plating solution and plating method

An electroless palladium plating liquid containing at least hydrazine or a salt thereof as a reducing agent, which has excellent bath stability in the vicinity of acidity to neutrality range, long-term stability, and is capable of suppressing the Pd film deposition rate decrease caused by elution of etching resist. An electroless palladium plating solution of the invention includes a palladium compound, hydrazine or its salt, at least one selected from a group consisting of a compound represented by the following formula (1) or its salt and a compound represented by the following formula (2) or its salt; and a pH of 8 or less, NHNHCOR(1), (NHNHCO)(R)n (2), wherein Rrepresents H, NH, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, NHNH, or an aromatic group, wherein each of these groups may have a substituent; Rrepresents (CH) or an aromatic group, wherein each of these groups may have a substituent; and n represents an integer of 0 to 10.

Electroless palladium plating solution and palladium film

The present invention provides an electroless gold plating bath having excellent plating bath stability without containing a cyanide compound under long term plating bath heating time. An electroless gold plating bath of the present invention solving above problems includes: a water-soluble gold salt; a reducing agent; and a phosphine compound represented by a following formula (1) wherein R, R, and Rrepresent identically or differently either a phenyl group, or an alkyl group having 1 to 5 carbons, and at least one of the phenyl group or the alkyl group is substituted by a sulfonate group or its salt, a cyano group, or a carboxy group or its salt.

Electroless gold plating bath

A film formation method is provided with a catalyst film formation step for forming a catalyst film on the surface of a substrate by displacement reduction plating, an intermediate film formation step for forming a palladium plating film on the catalyst film, and a surface film formation step for forming a gold plating film on the palladium plating film.

Film formation method

An electroless platinum plating solution includes a soluble platinum compound, a complexing agent, a reducing agent, and a halide ion supplying agent, the reducing agent being formic acid.

Electroless platinum plating bath

An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, a formaldehyde metabisulfite adduct, and an amine compound represented by R&#x2014;NH&#x2014;CH&#x2014;NH&#x2014;Ror (CH&#x2014;NH&#x2014;CH&#x2014;NH&#x2014;CH)(wherein Rto Rrepresent &#x2014;OH, &#x2014;CH, &#x2014;CHOH, &#x2014;CHOH, &#x2014;CHN(CH), &#x2014;CHNH(CHOH), &#x2014;CHNH(CHOH), &#x2014;CHNH(CHOH), &#x2014;CHNH(CHOH), &#x2014;CHN(CHOH), &#x2014;CHN(CHOH), &#x2014;CHN(CHOH)or &#x2014;CHN(CHOH), and n is an integer of 1 to 4). A gold plated coating of a good appearance can be formed without causing a failure in appearance owing to the progress of intergranular corrosion in a nickel surface.

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Osaka, Japan

Katsuhisa Tanabe