Lintec Corporation

Fsk Kabushiki Kaisha

Katsuhisa Taguchi

Kazuyoshi Ebe

Takanori Saito

Hiroaki Narita

Yoshitaka Akeda

Kazuhiro Takahashi

Yuichi Iwakata

Takeshi Kondoh

Akira Ichikawa

Kiichiro Kato

Yasukazu Nakata

Hayato Noguchi

Takanori Saitoh

Mikio Komiyama

Masateru Yamakage

Hiroshi Koike

Kouichi Nagamoto

Akira Hirata

Tomoyuki Hasegawa

Toru Takahara

The present invention provides an IC tag which has a structure comprising a first adhesive layer formed on a surface of a substrate sheet, an electronic circuit and an IC chip connecting both ends of the electronic circuit, both formed on the surface of the first adhesive layer, and a second adhesive layer covering the electronic circuit and the IC chip. The IC tag further includes a release agent layer formed at positions corresponding to the both ends of the electronic circuit and located at the interface between the substrate sheet and the first adhesive layer. When the IC tag attached to an article is peeled off, the built-in electronic circuit is surely broken.

IC tag

A method of processing a semiconductor wafer. The wafer is secured to a wafer supporting member having a data carrier. Information required for working the semiconductor wafer is input to the data carrier. The wafer is then worked according to information read from the data carrier. The data carrier is configured to permit operations such as back grinding, dicing and pickup of the wafer, and prevents wafer breakage when the wafer is carried between different operations.

Method of processing semiconductor wafer and semiconductor wafer supporting member

A card sealed by using a composition which includes an acrylate compound polymerizable by an ionizing radiation and 1 to 40 parts by weight of a polyfunctional isocyanate compound per 100 parts by weight of the acrylate compound and can be cured by irradiation of the ionizing radiation and a process for producing a card disposing a coating layer of the composition between a substrate sheet and a cover sheet and curing the coating layer by irradiation of an ionizing radiation.

Card and process for producing the card

Cover tape for chip transportation and sealed structure

A layer of base material has a film layer and a barrier layer on the film layer, and also adhesive tape has the base material and an adhesive layer on the barrier layer. Thus, they do not have any fish-eye or foreign substance on their surfaces, so that accuracy in thickness are improved and contamination of a material to be adhered with the adhesive layer is also improved.

Base material and adhesive tape using the same

An energy beam curable hydrophilic pressure sensitive adhesive composition comprising a hydrophilic pressure sensitive adhesive (A) and an energy beam polymerizable compound (B), optionally together with a photopolymerization initiator (C) added according to necessity. Thus, a pressure sensitive adhesive composition suitable for use in a wafer surface protective sheet is provided, which enables easy removal of any residual pressure sensitive adhesive by washing with water, even if the pressure sensitive adhesive remains on the wafer surface after peeling of the pressure sensitive adhesive sheet.

Energy beam curable hydrophilic pressure sensitive adhesive composition

The present invention provides a cover tape comprising a tapelike base material 1, adhesive parts 2 formed on one side of the base material 1 at both edges along the longitudinal direction thereof, and a nonadhesive resin part 3 formed between the adhesive parts 2 and having substantially the same thickness as that of the adhesive parts 2. This cover tape is used to collectively pack chips and other small items while keeping them separate from each other to thereby permit the storage, transportation and automatic takeout thereof, which cover tape can be rendered very long. Further, the present invention provides a coating applicator suitable for use in the production of the above cover tape.

Cover tape and coating applicator

An adhesive sheet according to the present invention comprises a substrate having coated on the surface thereof an adhesive layer consisting of an adhesive and a radiation polymerizable compound, which compound is a urethane acrylate oligomer having a molecular weight of 3,000-10,000, preferably 4,000-8,000. The adhesive sheet is preferably used in subjecting semiconductor wafers to dicing operation and no adhesive sticks to and remains on the back side surface of the wafer chips as picked up.

Adhesive sheets

An adhesive sheet according to the present invention comprises a substrate having coated on the surface thereof an adhesive layer consisting of an adhesive and a radiation polymerizable compound, said compound being a urethane acrylate oligomer having a molecular weight of 3,000-10,000, preferably 4,000-8,000. The adhesive sheet is preferably used in subjecting semiconductor wafers to dicing operation and no adhesive sticks to and remains on the back side surface of the wafer chip as picked up.

Growing community of inventors

Koshigaya, Japan

Katsuhisa Taguchi