Ulvac, Inc.

Harima Chemicals, Incorporated

Katsuhisa Oosako

Yoshihisa Misawa

Yorishige Matsuba

Masaaki Oda

Toshihiro Suzuki

Masayuki Ueda

Noriyuki Abe

Hideyuki Goto

Norimichi Saito

This invention provides a low-temperature sintering conductive paste for high density circuit printing which can form a fine circuit having good adhesive force, a smooth surface and low resistance when applied on a substrate and then baked; the conductive paste of the invention uses, as conductive media, in combination with metal fillers having an average particle diameter of 0.5 to 20 &#x3bc;m, ultrafine metal particles having an average particle diameter of not larger than 100 nm, which are set in the state that the surfaces thereof are coated with one compound or more having a group comprising a nitrogen, oxygen, or sulfur atom and capable of coordinate-bonding by a lone pair existing in the atom, as a group capable of coordinate-bonding to a metal element contained in the ultrafine metal particles, and are dispersed uniformly in a resin composition comprising a heat curable resin component, an organic acid anhydride or a derivative thereof or an organic acid, and one or more organic solvent; and thereby it enables low-temperature sintering of the ultrafine metal particles during a heat treatment at a low temperature.

Electroconductive metal paste and method for production thereof

Growing community of inventors

Ibaraki, Japan

Katsuhisa Oosako