Nec Tokin Corporation

Nec Corporation

Other

Tokin Corporation

Nec Toppan Circuit Solutions, Inc.

Katsuhiro Yoshida

Koji Sakata

Takeshi Saito

Masanori Takahashi

Yuji Yoshida

Takeo Kasuga

Sadamu Toita

Toshihiko Nishiyama

Kunihiko Shimizu

Tadamasa Asami

Kazuyuki Katoh

Kunihiko Simizu

Noriko Kuge

Takeshi Saitou

Takashi Kono

Hirofumi Nakamura

Kenji Araki

Takayuki Inoi

Yasuhisa Sugawara

Ryuta Kobayakawa

Shinji Arai

Masako Ohya

Yutaka Akimoto

Hitoshi Takata

Shinya Tokashiki

Keisuke Oga

Yoshitaka Hori

Tomohide Date

Sadamu Toida

Satoshi Nishishita

Yuuichi Maruko

Shinji Miyata

An electric double-layer capacitor includes a capacitor element, which includes a positive electrode and a negative electrode that face each other in a predetermined direction; a positive plate-like terminal portion connected to one end of the capacitor element in the predetermined direction; a negative plate-like terminal portion connected to another end of the capacitor element in the predetermined direction; and an exterior body encapsulating the capacitor element, the positive plate-like terminal portion, and the negative plate-like terminal portion. The positive and the negative plate-like terminal portions include parts that face each other in the predetermined direction, and at least one protruding portion protrudes from a corresponding one of the parts toward a corner of the exterior body.

Electric double-layer capacitor including a terminal having a protruding portion in an exterior body thereof

A solid electrolytic capacitor including a solid electrolytic capacitor component comprises a porous anode bodycomposed of valve metal having a anode leadprotruding therefrom, a anode oxide film, a solid electrolyte layer, a graphite layer, a silver paste layer, a resist layerseparating the anode leadused as a anode portion and the porous anode bodyused as a cathode portion, and a anode lead elementconnected to the anode lead, the anode oxide film, solid electrolyte layer, graphite layer, silver paste layerbeing successively formed on the surface of the porous anode body, wherein the solid electrolytic capacitor component is bonded on a mounting substratehaving a anode terminal, a cathode terminal, and an insulating portiontherebetween with a precuring insulating adhesiveformed on the insulating portionof the mounting substrateand precuring conductive adhesivesformed on the anode terminal and cathode terminal, and sealed with exterior resin

Solid electrolytic capacitor and method of manufacturing same

In a thin solid electrolytic capacitor including a solid electrolytic capacitor element disposed on a substrate, the solid electrolytic capacitor element has an upper surface largely extending along the substrate as compared with a height dimension thereof from the substrate. A casing portion is at least partly made of a resin and surrounds the solid electrolytic capacitor element jointly with the substrate. The casing portion includes a non-adhesive member that is in contact with an upper surface of the solid electrolytic capacitor element, but is not adhesive to the solid electrolytic capacitor element.

Thin solid electrolytic capacitor having high resistance to thermal stress

A method for manufacturing a solid electrolytic capacitor device is disclosed. The solid electrolytic capacitor device comprises a package substrate and a capacitor element which is mounted on the package substrate. The package substrate comprises an outer anode electrode, an outer cathode electrode, an inner anode electrode and an inner cathode electrode. The outer anode electrode is electrically connected to the inner anode electrode. The outer cathode electrode is electrically connected to the inner cathode electrode. The capacitor element comprises a capacitor body and an anode lead portion which extends from the capacitor body. The capacitor body has a surface at least one part of which is provided with a cathode portion. The method comprises: forming the anode lead portion; forming the cathode portion after the formation of the anode lead portion; and connecting the anode lead portion and the cathode portion to the inner anode electrode and the inner cathode electrode, respectively.

Solid electrolytic capacitor device and manufacturing method of the same

Anodized films are formed at both surfaces of an aluminum base and, at the center portion on each side of the aluminum base, a solid electrolyte layer of a conductive polymer, a graphite layer, and a metal layer are stacked in the order, thereby forming a rectangular cathode portion. An insulator layer is formed at the peripheries of four sides of the cathode portion and, further, an anode lead frame is provided at the peripheries of four sides of the upper insulator layer, thereby forming an anode portion. Openings are formed at four corners of the insulator layer or the anode portion, thereby establishing electrical connection between the cathode portions on both sides of the aluminum base. By setting the ratio of a total region, occupied by the openings, of the cathode portion to 25% or less, the ESL of a capacitor can be suppressed low even when the openings are provided.

Solid electrolytic capacitor having dual cathode plates surrounded by an anode body and a plurality of through holes

A solid-state electrolytic capacitor including a stacked body of a solid-state electrolytic capacitor element unit and an electrode conversion board. The unit includes two kinds of solid-state electrolytic capacitor elements. Each of first kind of solid-state electrolytic capacitor elements uses an anode body having a total thickness of an aluminum foil of 350 &#x3bc;m and a residual core thickness, i.e., the total thickness minus the thickness of an etched layer, is 50 &#x3bc;m. A second kind of solid-state electrolytic capacitor element provided on the mounting surface side uses an anode body having a total thickness of an aluminum foil of 150 &#x3bc;m and a residual core thickness is 50 &#x3bc;m. The electrode conversion board includes external anode and external cathode terminals that are arranged in a checkered manner and also includes, on the side opposite to the board, anode electrode and cathode electrode plates.

Solid-state electrolytic capacitor

A method for manufacturing a solid electrolytic capacitor has the steps of: mixing valve metal powders with organic binder for granulation, press-molding granulated powders embedded with a valve metal lead, sintering a press-molded compact in vacuum to produce a sintered body, and anodizing the sintered body to form a dielectric oxide film layer. The method further has a step of performing a cathode electrolytic cleaning to the sintered body before the step of forming the dielectric oxide film layer. The cathode electrolytic cleaning is performed in an acid solution, which is a mixed acid solution of hydrofluoric acid, nitric acid, and sulfuric acid.

Method for manufacturing a solid electrolytic capacitor

A solid electrolytic capacitor includes a valve metal formed with an anodized film; an inner conductive polymer film formed on the anodized film; and an outer conductive polymer film formed on the inner conductive polymer film. The outer conductive polymer film is obtained by: preparing a first polymer solution (PEDOT/PSSA); dissolving a predetermined dissolved substance in a non-aqueous solvent, the predetermined dissolved substance being selected from the group consisting of boric acid, 1-naphthalenesulfonic acid, 2-naphthalenesulfonic acid, 1,3,6-naphthalenetrisulfonic acid, and polystyrenesulfonic acid, and a salt thereof; mixing the dissolved solvent with pure water to obtain an additive solution; adding the additive solution into the first polymer solution to obtain a second polymer solution; and applying the second polymer solution to the inner conductive polymer film.

Solid electrolytic capacitor and forming method for the same

In a method of manufacturing a solid electrolytic capacitor, at first, an anodic oxide film is formed on the surface of an aluminum base. Then, a solid electrolyte layer is formed of a conductive polymer or the like on the anodic oxide film. Then, a cathode electrode portion including a silver paste layer is formed on the solid electrolyte layer. Then, a conductive paste is coated on the anodic oxide film on one side of the aluminum base and cured, thereby forming a metal silver layer. Then, a laser beam is irradiated from the opposite side of the aluminum base to weld together the aluminum base and the metal silver layer, thereby forming an anode electrode portion.

Solid electrolytic capacitor manufacturing method capable of easily and properly connecting anode electrode portion

A solid electrolytic capacitor is provided which is capable of exhibiting an excellent characteristic and high reliability against thermal stress. The solid electrolytic capacitor includes a base member having a capacitor element connecting face on its upper surface side and an electrode mounting face on its lower surface side and being made up of an insulating plate having first conductors and second conductors, disposed in a staggered format, each providing conduction between the upper and lower surface sides of the base member, and the capacitor element having anode portions and cathode portions, each being disposed in a staggered format, connected to each of the first and second conductors.

Solid electrolytic capacitor

On a surface-roughened aluminum foil, an aluminum oxide film as an anodic oxide film is formed. Then, a conductive polymer layer as a solid electrolyte is formed thereon and thereafter a first metal plating layer is directly formed on the conductive polymer layer, thereby forming a cathode portion. On the other hand, a second metal plating layer is formed on another portion of the surface-roughened aluminum foil, which is not subjected to anodic oxidation or which is subjected to anodic oxidation followed by polishing or formation of an anode deposition film, to thereby form an anode portion. Third metal plating layers are formed at the anode and the cathode portions to obtain a capacitor element. A plurality of capacitor elements are stacked and bonded together fusion after formation of the third metal plating layers. Alternatively the capacitor elements may be bonded together by conductive paste without the third metal layers.

Solid electrolytic capacitor, stacked capacitor using the same, and fabrication method thereof

The capacitor element includes as an anode an aluminum foil in the form of a thin plate, an oxide layer formed as a dielectric on the surface of the anode, and a conductive polymer layer formed as a cathode on the dielectric. The capacitor is formed by drawing terminals in arrays from the capacitor element. On the upper side of the capacitor element is provided an embossed copper foilfor suppressing deformation of the capacitor element. The anode terminals and the cathode terminals are drawn to the lower side of the capacitor element. The anode terminals and the cathode terminals are alternately formed at the same pitch in the x-direction and the y-direction, so that the heteropolar terminals are disposed at the adjacent positions with respect to any one of the terminals.

Thin multi-terminal capacitor and method of manufacturing the same

In a solid electrolytic capacitor including a device portion having a cathode conductor layer and an anode conductor layer arranged on a sheet-like or a foil-like base member, a first insulating resin layer is formed on the cathode conductor layer and the anode conductor layer. A positive electrode mounting terminal layer is formed on the first insulating resin layer. An anode conductor portion penetrates the first insulating resin layer to electrically connect the positive electrode mounting terminal layer to the anode conductor layer. A plurality of negative electrode mounting terminal layers are arranged on the first insulating resin layer. A cathode conductor portion penetrates the first insulating resin layer to electrically connect the negative electrode mounting terminal layer to the cathode conductor layer. A second insulating resin layer is formed on the positive electrode mounting terminal layer. The second insulating resin layer has a plurality of first opening portions partially exposing the positive electrode mounting terminal layer.

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Sendai, Japan

Katsuhiro Yoshida