Sony Corporation

Sony Semiconductor Solutions Corporation

Other

Sony Group Corporation

Sony Chemical & Information Device Corporation

Katsuhiro Tomoda

Naoki Hirao

Masato Doi

Toyoharu Oohata

Akiyoshi Aoyagi

Toyoharu Ohata

Goshi Biwa

Ken Kikuchi

Toshiya Takagishi

Masaru Fujii

Izushi Kobayashi

Toshihiko Watanabe

Akira Ohmae

Hisashi Kadota

Ippei Nishinaka

Tatsuo Ohashi

Yusuke Kataoka

Izuho Hatada

Toshiaki Kanemitsu

Norifumi Kikuchi

Hiroshi Terahara

Hiroyuki Okuyama

Jun Suzuki

Hidetsugu Namiki

Shiyuki Kanisawa

Hiizu Ohtorii

Huy Sam

Takeshi Mizuno

Kensuke Kojima

Yuji Nishi

Yasunobu Iwakoshi

A mounting substrate according to an embodiment of the present technology includes: a wiring substrate (); a plurality of light-emitting elements () arranged in a matrix on the wiring substrate; and a plurality of drive ICs () that are arranged in a matrix on the wiring substrate, and control light emission of the light-emitting elements. The light-emitting elements and the drive ICs are mounted on a same surface. The wiring substrate includes a plurality of first wiring lines () on a mounting surface where the light-emitting elements and the dive ICs are mounted. The first wiring lines electrically couple the light-emitting elements to the drive ICs.

Mounting substrate and electronic apparatus

There is provided a display device including a plurality of unit regions disposed adjacent to each other, a first region that is provided in each of the unit regions, and emits first light, and a second region that is provided outside the first region in each of the unit regions, and emits second light. The second light is different from the first light in at least one of luminance, wavelength, or surface-reflection component, the second regions are provided between adjacent ones of the first regions, and a difference in luminance, wavelength, or surface-reflection component between the second light to be emitted from adjacent ones of the unit regions is smaller than a difference in luminance, wavelength, or surface-reflection component between the first light and the second light in a same one of the unit regions.

Display device and electronic apparatus

A display device includes a first substrate, a second substrate, and a plurality of light emitting sections. The first substrate includes a first surface and a second surface which faces the first surface. The second substrate is arranged to face the first substrate, and is configured with a first surface which faces the second surface of the first substrate, and a second surface which faces the first surface. The plurality of light emitting sections is provided on the second surface of the first substrate while being separated from the second substrate. A light transmission suppression layer on which a light transmission section to transmit light from light emitting sections is provided is formed on the second surface of the second substrate in correspondence to each light emitting section. An anti-reflection layer is formed in the light transmission section.

Display device

A mounting substrate according to an embodiment of the present technology includes: a wiring substrate (); a plurality of light-emitting elements () arranged in a matrix on the wiring substrate; and a plurality of drive ICs () that are arranged in a matrix on the wiring substrate, and control light emission of the light-emitting elements. The light-emitting elements and the drive ICs are mounted on a same surface. The wiring substrate includes a plurality of first wiring lines () on a mounting surface whre the light-emitting elements and the dive ICs are mounted. The first wiring lines electrically couple the light-emitting elements to the drive ICs.

When display panels are arranged to form a tiled-type display apparatus, the precision of the spaces between adjacent display panels is to be increased, and display quality is to be enhanced. A display apparatus includes display panels and space forming members. Pixels are arranged on the display panels. Space forming members are disposed between a display panel and a display panel, and form a space between the display panels. As spaces are formed by the space forming members, the spaces between the display panels are prevented from changing. Thus, appearances of joints are also prevented.

Display apparatus, display module, and display member

There is provided a mounting substrate that makes a seam more inconspicuous when a plurality of mounting substrates are tiled, and an electronic apparatus including the mounting substrate. The mounting substrate includes a wiring substrate, a plurality of pixels () arranged in a matrix in a pixel region of the wiring substrate, and a plurality of drivers (A) that are disposed in the pixel region and select the pixels in units of two or more pixels. Each of the pixels includes an optical element that emits or receives light, and a pixel circuit that controls light emission or light reception of the optical element. One or more of the plurality of drivers are assigned to each pixel row or every plurality of pixel rows.

A light emitting apparatus including: one or a plurality of light emitting devices each having a plurality of electrodes and each emitting light from the upper surface of the light emitting device; a plurality of terminal electrodes provided on the lower side of the light emitting devices in a positional relation with the light emitting devices and electrically connected to the electrodes of the light emitting devices; a first metal line brought into contact with the upper surfaces of the light emitting devices and one of the terminal electrodes, provided at a location separated away from side surfaces of the light emitting devices and created in a film creation process; and an insulator in which the light emitting devices and the first metal line are embedded.

Light emitting apparatus, illumination apparatus and display apparatus

A device includes: a substrate; and a functional element mounted, the functional element including electrodes. The substrate includes a support substrate, and includes a first seed metal, a second seed metal, and a resin component on the support substrate, the first seed metal being disposed in a section opposed to part or all of a first electrode among the electrodes, and being connected to the first electrode by plating, the second seed metal being disposed in a section opposed to part or all of a second electrode among the electrodes, and being connected to the second electrode by plating, and the resin component being disposed in a layer between the functional element and the support substrate, and fixing the functional element to the support substrate, and being, provided avoiding a neighborhood of an end of the functional element among, opposed side sections of the first and second seed metals.

Electronic device mounted on a substrate

A device includes: a substrate; and a functional element mounted, the functional element including electrodes. The substrate includes a support substrate, and includes a first seed metal, a second seed metal, and a resin component on the support substrate, the first seed metal being disposed in a section opposed to part or all of a first electrode among the electrodes, and being connected to the first electrode by plating, the second seed metal being disposed in a section opposed to part or all of a second electrode among the electrodes, and being connected to the second electrode by plating, and the resin component being disposed in a layer between the functional element and the support substrate, and fixing the functional element to the support substrate, and being provided avoiding a neighborhood of an end of the functional element among opposed side sections of the first and second seed metals.

An assembly including a substrate, a metal wiring layer on the substrate, the metal wiring layer having an opening therein, a thermosetting resin layer on at least a portion of the substrate overlapping the opening of the metal wiring layer, and a device on the resin layer, the device positioned over the opening of the metal wiring layer and bonded to the substrate via the resin layer.

Method of mounting devices in substrate and device-mounting substrate structure thereof

Disclosed herein is a light emitting apparatus including: one or a plurality of light emitting devices each having a plurality of electrodes and each emitting light from the upper surface of the light emitting device; a plurality of terminal electrodes provided on the lower side of the light emitting devices in a positional relation with the light emitting devices and electrically connected to the electrodes of the light emitting devices; a first metal line brought into contact with the upper surfaces of the light emitting devices and one of the terminal electrodes, provided at a location separated away from side surfaces of the light emitting devices and created in a film creation process; and an insulator in which the light emitting devices and the first metal line are embedded.

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Kanagawa, Japan

Katsuhiro Tomoda