Hitachi, Ltd.

Hitachi Vsli Engineering Corp.

Katsuhiro Tabata

Tsutomu Mimata

Toshihide Uematsu

Kunihiko Nishi

Michio Tanimoto

Hideaki Nakamura

Tsuyoshi Shimizu

Toshihiro Yasuhara

Isao Akima

Yasuhiro Yoshikawa

Toshio Nosaka

Souichi Kunito

A package is provided for achieving higher packing density and higher circuit integration of memories, in particular, a structure is provided having a plurality of thin, surface mount packages which are stacked up. Each of the laminated packages includes a semiconductor pellet, leads fixed to the front surface of the pellet, a radiating plate fixed to the rear surface of the same, and a resin mold member. To achieve a stabilized laminated structure, the mold member is shaped into a convex form on the front side of the pellet and into a concave form on the rear side of the same, so that the concave portion of one package can engage with the convex portion of another package.

Semiconductor device and an electronic device with the semiconductor

A manufacturing apparatus has a clean air supply means provided integrally with a part thereof for supplying clean air toward at least an area in which a workpiece exists, and an air discharge means disposed so as to face the clean air supply means across the workpiece and adapted to discharge the air to the outside of the apparatus. It is therefore possible for clean air to be constantly supplied to the workpiece area under positive pressure. Thus, there is no risk of dust generated not only inside but also outside the apparatus being moved to the vicinity of the workpiece. Accordingly, it is possible to prevent adhesion of dust to the surface of the workpiece by the apparatus alone and also possible to install the apparatus as desired.

Manufacturing apparatus

A mold assembly for resin sealing for use in the manufacture of a semiconductor device etc., includes a pair of upper and lower molds. Elastic deformation parts adapted to be deformed in the direction of compression of the upper and lower molds with an object to-be-sealed, held therebetween, are provided on at least one of a cavity block of the upper mold and a cavity block of the lower mold. Grooves are provided in the surface of the cavity block formed with the elastic deformation parts.

Mold assembly for resin-sealing

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Higashimurayama, Japan

Katsuhiro Tabata