Mitsubishi Denki Kabushiki Kaisha

Renesas Technology Corp.

Mitsubushi Denki Kabushiki Kaisha

Mitsubhishi Denki Kabsuhiki Kaisha

Katsuhiro Suma

Hideto Hidaka

Takahiro Tsuruda

Masaki Tsukude

Tsukasa Ooishi

Kazutami Arimoto

Mikio Asakura

Kazuyasu Fujishima

Shigeki Tomishima

Yasuhiko Tsukikawa

Masanori Hayashikoshi

Shinji Kawai

Yukinobu Adachi

A semiconductor memory device includes a plurality of N and P channel MOS transistors. The plurality of MOS transistors are formed on an SOI (Silicon On Insulator) substrate. Each MOS transistor includes a source region, a drain region, and a body region located between the source region and the drain region. The body region of at least one N channel MOS transistor is electrically fixed. The body region of at least one P channel MOS transistor is rendered floating.

Semiconductor memory device including an SOI substrate

A semiconductor device includes an SOI substrate, trench memory cells including trench capacitors formed in the SOI substrate and a mesa or trench isolation region for isolating the trench memory cells. As a result, the trench memory cells are isolated more completely and soft errors are reduced.

Semiconductor device using an SOI substrate

A semiconductor memory device includes an SOI substrate, a plurality of word lines, a plurality of bit line pairs, a plurality of memory cells and a plurality of body fixing lines. The plurality of word lines are disposed in the row direction on the SOI substrate. The plurality of bit line pairs are disposed in the column direction on the SOI substrate. The plurality of memory cells are located on the SOI substrate and each are disposed correspondingly to one of crossings between the plurality of word lines and the plurality of bit line pairs. Each of the plurality of memory cells includes a capacitor and a transistor. The transistor is connected between the capacitor and one bit line in the corresponding bit line pair. The transistor is turned on in response to the potential of the corresponding word line. The plurality of body fixing lines are disposed on the SOI substrate. The plurality of body fixing lines are supplied with a predetermined potential. The transistors in the plurality of memory cells have source regions, drain regions and body regions located between the source and drain regions. The body regions of the transistors in the plurality of memory cells are connected to the plurality of body fixing lines.

Semiconductor memory device including memory cell transistors formed on SOI substrate and having fixed body regions

In manufacturing a semiconductor device, the thickness of source and drain regions is maintained equal by performing the same number of etching steps on each source and drain region. This procedure can be applied to various types of semiconductor devices, such as a memory cell transistor of a DRAM, stack-type memory cell transistor of a DRAM, a peripheral circuit of a DRAM, a semiconductor device formed on an SOI structure, and a trench-type memory cell of a DRAM formed on an SOI structure. By maintaining the source and drain regions at the same thickness, the resistance values are maintained, thereby avoiding deterioration of the transistor characteristics.

Semiconductor device including a transistor having portions of source and drain regions removed by the same amount

In etching a polysilicon layer above a gate electrode layer, a portion of the gate electrode layer is left thereunder. The etching process of that polysilicon layer and that gate electrode layer is carried out in two steps of etching the polysilicon layer and an interlayer insulating layer, and etching the gate electrode layer and the gate oxide film. Therefore, the amount that is removed from an SOI layer can be suppressed in the manufacturing process thereof.

Semiconductor device having SOI structure

Semiconductor memory device including memory cell transistors formed on

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Hyogo, Japan

Katsuhiro Suma