Nec Corporation

Mitsubishi Engineering-Plastics Corporation

Matsumura Sangyo Co., Ltd.

Katsuhiro Otsuka

Makoto Nakamura

Hiroshi Nakano

Kazutoyo Matsumura

The present invention relates to a thermoplastic resin composition which comprises 100 parts by weight of a thermoplastic resin (component A) and 1 to 400 parts by weight of a granular inorganic filler (component B) comprising an inorganic filler having an average particle diameter of 0.01 to 100 &#x3bc;m and a water-soluble polyester resin binder, and having a bulk density of 0.4 to 1.5 g/mL; and a resin molded article obtained by molding the thermoplastic resin composition. The thermoplastic resin composition is improved in various properties such as extrusion moldability, rigidity, impact resistance, thermal stability and hue, and exhibits an excellent balance between these properties.

Thermoplastic resin composition and resin molded article

A portable telephone having a ten-key pad that allows input of a plurality of kinds of characters is disclosed. Each of the keys of the ten-key pad has a plurality of contact points having a corresponding position with respect to the key, at least one of the contact points being selected depending on which position of the key is pressed, another position of the key being determined by pressing all of the contact points simultaneously. Each key preferably has five positions. A table correlates each position of the key and an individual character of a selected type of characters. Input of an individual character depends on a pressed position of the key correlated by the table to a pressed key of the ten-key pad.

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Tokyo, Japan

Katsuhiro Otsuka