Hitachi Via Mechanics Ltd.

Katsuhiro Nagasawa

Tamio Otani

Akira Irie

Takahiko Yamashita

Hiroyuki Kamata

Yasuhiko Kanaya

Atsushi Katayama

Jun Wakamatsu

Yasushi Ito

Nobuhiko Suzuki

Toru Yuki

Hirofumi Kado

Hiroshi Kawasaki

Norio Michigami

Tomoaki Ozaki

Shintaro Takahashi

Takao Furukawa

Toshiyuki Iwata

Takayuki Hashimoto

Shintarou Takahashi

Yuji Honda

Kazuo Watanabe

Kenta Kumagai

Norishige Kumagai

The invention provides a machining apparatus, and its machining method, having machining tables whose weight do not increase so much even if a number of machining sections such as spindles is increased. One of the machining tables is a rectangular stationary table having a groove in the direction perpendicular to the longitudinal direction on its surface and the other is a rectangular movable table engaged with the groove. The machining apparatus machines a printed circuit board, whose area is larger than that of the movable table, on a mounting surface of the stationary table by changing position of the printed circuit board by moving the movable table and by determining machining position by moving a spindle at position facing the mounting surface of the stationary table.

Machining apparatus and machining method

A printed circuit board machining apparatus includes a spindle that holds a tool for machining a printed circuit board and a pressure unit for pressing the printed circuit board to a table in machining the printed circuit board. The pressure unit includes a pressure foot movable up an down along the spindle, a rotating member having a plurality of pressure pieces through which a through hole for passing the tool is formed and provided so as to select one among the plurality of pressure pieces, a motor for moving the rotating member, cylinders and electromagnetic valves for moving the pressure foot up and down and a control section for controlling the cylinders and electromagnetic valves. The control section rotates the motor so as to select the pressure piece and controls the cylinders and the electromagnetic valves to change force for pressing the printed circuit board.

Printed circuit board machining apparatus

There is provided a drilling method capable of improving machining accuracy of a printed board drilling apparatus as a whole by decreasing dispersion of the machining accuracy even if it is a multi-spindle printed board drilling apparatus. A misalignment of an axial center of a drill with respect to a designed axial center in X and Y directions is detected in advance per a certain number of revolutions of each spindle that rotates the drill. Holes of two or more types of diameter are made on a printed board by making holes of at least one diameter, e.g., an exposure master hole, per each spindle and by making holes of all other diameters almost simultaneously by all of the spindles.

Drilling method

A tool positioning device and a machining element have simple structures which can reduce running cost. In addition to a hole that engages with a shank of an end mill, a channel is provided so that it penetrates through the device such that one end thereof communicates with an upper face of the device and the other end communicates with a lower end of the device. In this case, it is more effective to provide a concave portion that is opened to the upper face and communicates with the hole. The same effect may be obtained by making a cylindrical hole, for example, instead of the channel.

Tool positioning device and machining tool

A manufacturing method of a multi-layered circuit board allows electronic parts to be mounted adequately and will not hamper performance of the electronic parts. A power terminal (pin) of an electronic part to be mounted on a surface of the multi-layered circuit board is inserted into a plated through hole to connect with a first conductive layer. A detecting section having a detecting hole which is formed coaxially with the through hole and whose diameter is larger than the through hole is provided on a second conductive layer on the back of the first conductive layer. A hole having a large diameter is formed by a tool along the through hole from the back while applying voltage between the second conductive layer and the tool. The depth of the hole is set based on the tool electrically conducting with the detecting hole. Unnecessary plate of the through hole may be removed by the large hole.

Manufacturing method of a multi-layered circuit board

A printed board drilling method and a printed board machining apparatus capable of improving machining quality, such as improving positional accuracy of holes and true roundness of machined holes, and improving work efficiency by minimizing a runout of the tip of a drill. An extension of the drill extending out of a spindle when the drill is held by the spindle is defined in advance per type or mode of use of each drill. One drill is selected among a plurality of drills corresponding to a shape of holes to be drilled in the printed board and the spindle holds the drill so that the selected drill extends out of the spindle by the extension corresponding to the selected drill. Then, the move of the spindle with respect to the printed board is controlled and the selected drill is rotationally driven by the spindle to drill the printed board.

Printed board drilling method and printed board machining apparatus

Substrate processing apparatus for processing holes accurately positioned in an long film, comprising: work supporting devices for supporting the work; clamping devices for clamping the work onto the work supporting devices; first movement devices for moving the work supporting devices in the transferring direction of the work; guiding devices for guiding the work supporting devices; guide supporting devices for supporting these guiding devices; and second movement devices for moving the guide supporting devices in the direction perpendicular to the transferring direction of the work, wherein two pins or holes are disposed on or in each of the guiding devices, holes or pins to engage with the pins or holes are disposed on or in each of the guide supporting devices to combine the guiding devices and guide supporting devices in a grid form, and the holes and pins at four junctions are fitted.

Substrate processing apparatus

In a machining method and a machining apparatus, prior to machining, an NC control unit makes an X-axis drive unit move a table based on examination conditions specified in advance. Thus, the NC control unit obtains a stabilization time required from the command-reach time of a poisoning command and till the stabilization of position response of the table within a predetermined allowable range. Likewise, for moving a drill in a Y-axis direction, the NC control unit obtains a stabilization time required till the stabilization of position response within a predetermined allowable range. At the time of machining, the drill is moved in a Z-axis direction to cut into a printed wiring board as soon as the obtained stabilization time has passed.

Machining method and machining apparatus

Nuts are engaged with one ball screw , and the nut is directly fixed on a slider main body . The nut is rotatably held by a bearing , and a bearing holder holding the bearing is fixed on a slider main body . And, a gear is fixed on the side of the nut , and a gear engaging with the gear is provided. And, a motor for driving a gear is fixed on a bracket , being united with the slider main body . The ball screw is stopped and the motor is rotated so as to individually position the slider . Even if the number of the sliders is increased, a machine is not made bigger, and the printed board processing machine having simple structure can be provided.

Printed board processing machine

A printed circuit board drilling machine, with a well-designed outer shape, providing excellent operability and maintainability, which sequentially makes a number of holes in at least one printed circuit board, placed on a table,moved in an XY plane, by using a drill driven by a spindle motor,The machine has openable/closable doors,and,which is separated into an upper door and a lower door in a front portion. The upper door,opens upward, while the lower door,opens downward. The upper door,comprises transparent material. Upon maintenance, the doors,and,are opened, and the table,is moved inwardly. Thus, the distance from the outside of the machine to the spindle motor,and its peripheral parts can be reduced, and maintenance can be easily performed with respect to the spindle motor,and its peripheral parts.

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Ebina, Japan

Katsuhiro Nagasawa