Nippondenso Co., Ltd.

Katsuhiro Izuchi

Takao Yoneyama

A fluxless soldering process comprising the steps of: preparing first and second members to be bonded by soldering, the first member having a bonding surface with a higher solder-wettability and the second member having a bonding surface with a lower solder-wettability; placing the second member with the bonding surface thereof facing upward, a solder foil on the bonding surface of the second member, and the first member on the solder foil and with the bonding surface thereof facing downward, to form an assembly; heating the assembly in a reducing atmosphere to fuse the solder foil, thereby forming a molten solder between the first and second members; and cooling the assembly to solidify the molten solder, thereby bonding the first and second members.

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Anjo, Japan

Katsuhiro Izuchi