Hitachi, Ltd.

Hitachi Microcomputer Engineering, Ltd.

Katsuhiro Arakawa

Kenichi Saito

Tsuyoshi Nakagawa

Shinji Matsushita

Masahito Suzuki

Yasushi Neho

Kenichi Nagashima

Tatsuhiko Matsuoka

Masaaki Eishima

Tsutomu Takahashi

Ryohei Satoh

Takaji Takenaka

Haruhiko Imada

Kiyoshi Kanai

In a liquid-cooling system for a notebook personal computer having a body part including a CPU and a chip set respectively mounted on a mother board and an HDD, and a display part rotatably supported by the body part, a heat receiving head is fixed to at least one heat generation part including the CPU. A tube filled with cooling liquid is connected to the heat receiving head. The tube connected to the heat receiving head is disposed in series on at least one heat generation part including the chip set so as to collect the heat generated from each heat generation part. The tube is also laid in a meandering or zigzagging pattern between a liquid crystal panel and a housing of the display part. The heat generated from each heat generation part is absorbed at part of the tube by the cooling liquid that circulates in the tube and functions as a heat transfer medium. The absorbed heat is then radiated at another part of the tube. Consequently, the heat generated from the chip set including the CPU and other heat sources such as the HDD can be radiated together to the outside. Local temperature rising is prevented. An uniform temperature environment is attained on all the surfaces of the body part.

Liquid cooling system for notebook computer

In a liquid-cooling system for a notebook personal computer having a body part including a CPU and a chip set respectively mounted on a mother board and an HDD, and a display part rotatably supported by the body part, a heat receiving head is fixed to at least one heat generation part including the CPU. A tube filled with cooling liquid is connected to the heat receiving head. The tube connected to the heat receiving head is disposed in series on at least one heat generation part including the chip set so as to collect the heat generated from each heat generation part. The tube is also laid in a meandering or zigzagging pattern between a liquid crystal panel and a housing of the display part. The heat generated from each heat generation part is absorbed at part of the tube by the cooling liquid that circulates in the tube and functions as a heat transfer medium. The absorbed heat is then radiated at another part of the tube. Consequently, the heat generated from the chip set including the CPU and other heat sources such as the HDD can be radiated together to the outside.

Notebook computer having a liquid cooling device

A method for evaluating the life of a connection between members including the steps of extracting parameters defining the shearing strain of a predetermined model representing the connection thereby to calculate the values of plural shearing strains of the connection, calculating the equivalent strain amplitude corresponding to thermal fatigue stress for each of the values of the plural shearing strains defining the relationship between the shearing strain and the equivalent strain amplitude, formulating a life evaluation criterion equation expressed using the equivalent strain amplitude, calculating, for the connection, the equivalent strain amplitude corresponding to each of the shearing strains actually measured using the equation, and substituting the equivalent strain amplitude for the life evaluation criterion equation to acquire the life of the connection. Further, in this method, an equation for evaluating the advancement of a crack is made using the equivalent strain amplitude, and the equivalent is substituted for the crack advancement evaluation equation to calculate the length of the crack.

Method for diagnosing the life of a solder connection

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Zama, Japan

Katsuhiro Arakawa