Kaneka Corporation

Kaneka North America LLC

Katsuhiro Ando

Toshihiko Okamoto

Toshifumi Hirose

Fumio Kawakubo

Junji Takase

Jun Hattori

Hiroshi Iwakiri

Masato Kusakabe

Hidetoshi Odaka

Shintaro Komitsu

Atsushi Kawakami

Toru Inaya

The present invention has its object to provide a liquid-applied moisture-permeable waterproofing material that can protect a building from rainwater or humidity in the air, can drain moisture, which has been gathered on a substrate of a building, and can be applied easily. The present invention is a curable composition comprising:

Curable composition

Provided is a curable composition having excellent water vapor permeability, which enables to protect a building from rainwater or moisture in the air and release the water accumulated on the side of the base of the building, to the outside. Also provided is a curable composition which has easy workability and is less likely to allow migration or exudation of a plasticizer to the surface of the cured product. Also provided is a liquid waterproof coating material having moisture permeability which contains the curable composition. The curable composition includes an organic polymer (I) that has less than one hydrolyzable silyl group per molecule on average and contains 5 to 80 wt % of oxyethylene units.

It is an object of the present invention to provide a two-component curable composition whose component A is easy to be handled, and which shows excellent internal curability and good storage stability. This problem is solved using a two-component curable composition, comprising component A comprising 100 parts by weight of an organic polymer containing a reactive silicon group, (B) 0.1-300 parts by weight of an epoxy group-containing compound, and (C) 0.1-20 parts by weight of water, and component B comprising (D) 0.1-20 parts by weight of a curing catalyst, and (E) 0.1-200 parts by weight of an amine compound.

The invention aims to improve surface tackiness of a curable composition comprising a reactive silicon group-containing polyoxypropylene polymer without decreasing coating workability, strength, adhesion and appearance. As one embodiment of a means for resolution, a curable composition comprising (A) 100 parts by weight of a reactive silicon group-containing polyoxypropylene polymer, (B) from 0.1 to 20 parts by weight of a silane coupling agent, (C) from 0.1 to 80 parts by weight of an epoxy group-containing compound, (D) from 0.1 to 60 parts by weight of a tertiary amine, and (E) from 0.1 to 30 parts by weight of a primary or secondary amine having a melting point of 20&#xb0; C. or more is mentioned.

It is the subject of the present invention to provide a solvent-free ambient-temperature curable composition, excellent in water-resistant adhesion, storage stability and curability, and generates neither smoke nor odor when working therewith. The relevant problem is solved by a curable composition including (A) a natural asphalt and/or petroleum asphalt, (B) a polyoxyalkylene polymer having one or more reactive silicon groups capable of cross-linking by forming siloxane bonds through silanol condensation reaction.

By using a high viscosity moisture-curable adhesive composition comprising at least one polymer or resin selected from the group consisting of (A) a reactive silyl group-containing polyoxyalkylene polymer, (B) a reactive silyl group-containing saturated hydrocarbon polymer, (C) a copolymer of which molecular chain is substantially made of one or more alkyl (meth)acrylate monomer unit(s) and (D) an epoxy resin, it becomes possible to bond an adherend to a substrate without open time and without temporary tacking after application.

Method of bonding adherend

The present invention is to provide a curable resin composition comprising (I) a reactive silicon group-containing polyoxyalkylene polymer wherein a introduction rate of a reactive silicon group into molecular chain terminus is not less than 85% as analyzed by H-NMR spectrometry and (II) an epoxy resin. The curable resin obtained from this composition reflects improvements in tensile strength and tensile shear bond strength and in adhesion to various substrates.

Curable resin composition

By using a curable composition comprising, (A) per 100 parts by weight of an epoxy resin, (B) from 1 to 50 parts by weight of a reactive silicon group-containing polyoxyalkylene polymer, and (C) from 1 to 90 parts by weight of a curing agent for epoxy resins, the working properties of an existing rubber-modified epoxy resin are improved to thereby give stable adhesion properties (for example, improved peel strength) without worsening the shear strength.

Rubber-modified epoxy resin composition

Process for fitting glass members onto vehicles

A curable resin composition containing (a) an oxyalkylene polymer which comprises at least one silicon-containing group having at least one hydroxyl or hydrolyzable group bonded to a silicon atom, (b) an epoxy resin, (c) a ketimine compound and (d) a carbonyl compound, which has improved storage stability.

Growing community of inventors

Akashi, Japan

Katsuhiro Ando