Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Katsuhiko Watanabe

Hiroshi Ebihara

Hiroshi Nasu

Hiroyuki Kobayashi

Kazuki Fukada

Naoto Hosotani

Hiroshi Yamauchi

Ryo Fujita

Makoto Imanishi

Takahiro Yonezawa

Mikio Hasegawa

Hiroyuki Imamura

Ken Kobayashi

A bonding tool, including: a component mounting unit including a horn that has a heater insertion hole, in which a heater is inserted with a predetermined clearance, and transmits ultrasonic vibration, an ultrasonic transducer that is fixed on the horn and produces the ultrasonic vibration, and an electronic component holder that is fixed on the horn, holds an electronic component and is heated by the heater; a leg that supports the horn on both sides of the horn at nodal points of the ultrasonic vibration on the horn; a supporter that holds the leg; and a heater holder that holds the heater on both sides of the horn, wherein the leg and the heater holder are formed integrally with each other.

Bonding tool and electronic component mounting apparatus and method

A bonding tool comprises: a horn which transmits an ultrasonic vibration; a ultrasonic transducer which is provided on one end of the horn, and produces the ultrasonic vibration; a heater disposition part, in which a heater is disposed, which is provided between the one end of the horn and the other end of the horn; a bonding action part which is provided between the one end of the horn and the other end of the horn, holds an electronic component, and is heated by the heater; a first cooling part, through which a fluid flows, which is provided between the heater disposition part and the one end of the horn; and a second cooling part, through which a fluid flows, which is provided between the heater disposition part and the other end of the horn.

Bonding tool, electronic component mounting apparatus and electronic component mounting method

An electronic component mounting apparatus includes an electronic component mounting head for holding an electronic component and an up/down device for pressing the electronic component against a circuit board, and the electronic component is pressed against the circuit board while ultrasonic vibrations are applied from an ultrasonic transducer of the electronic component mounting head to the electronic component via a component holding unit, so that the electronic component is mounted onto the circuit board. In the electronic component mounting apparatus, the electronic component is heated via the component holding unit by radiant heat from a heater fixed to the component holding unit in a noncontact state, so that even when the electrothermal heater is replaceably attached, characteristics of the ultrasonic vibrations applied to the electronic component can be maintained constant.

Electronic component mounting head, and apparatus and method for mounting electronic component

In a direction parallel to a directionof ultrasonic vibrations imparted from an ultrasonic vibrator, the shape of a center portionof a tooland the shape of an end portionof the toolare changed such that the cross-sectional areas are different, whereby ultrasonic amplitudesin a direction perpendicular to the directionof ultrasonic vibrations are substantially equal. By this means, the difference in ultrasonic vibration between at the center portionof the tooland at the end portionof the toolcan be eliminated or reduced.

Electronic component mounting apparatus and electronic component mounting method

There is provided an electronic component mounting apparatus including: a component holder which holds an electronic component; a pressing unit which applies pressure to the held electronic component through the component holder; and an ultrasonic transducer which applies ultrasonic vibration to the held electronic component through the component holder. The component holder includes a horn at one end of which is mounted the ultrasonic transducer and a holding tool which is fixed to the other end of the horn by using bolts and holds the electronic component. The horn has a surface Aand a surface Aat the other end and the holding tool has a surface Bin intimate contact with the surface Aand a surface Bin intimate contact with the surface A.

In an electronic component mounting apparatus, a vertical load and horizontal loads applied to an electronic component are detected by a load sensor that has piezoelectric elements provided in a stack in a mounting direction of the electronic component. Therefore, a size in a horizontal direction of the load sensor can be reduced, and a load applied to the electronic component can be detected at a neighborhood of a mounting position of the electronic component. Moreover, by comparing a position, in a two-dimensional space in which load values in an X-direction and Y-direction of the horizontal load serve as coordinate values, with a tolerance range in the two-dimensional space, a mounting failure can be detected from a deviation in the horizontal loads.

Disclosed are an apparatus and a method for bonding electronic components, a circuit board, and an electronic component mounting apparatus, whereby various kinds of circuit boards can be manufactured, each by a small amount, with high productivity as compared with the conventional art. There are provided a stage member and a heating device, so that a circuit board is heated by the heating device while held in contact with the stage member, which stage member has a size almost equal to that of one circuit board. Generation of losses can be reduced for compact circuit boards, and heating can be performed individually, correspondingly, for each kind of circuit board. Manufacturing various kinds of circuit boards, each by a small amount, with high productivity as compared with the conventional art is enabled accordingly.

Growing community of inventors

Osaka, Japan

Katsuhiko Watanabe