Disco Corporation

Konica Corporation

Nec Corporation

Canon Kabushiki Kaisha

Adv Antest Corporation

Nec Access Technica, Ltd.

Tokyo Seimitsu Co., Ltd.

Nec Accesstechnia Ltd.

Katsuhiko Suzuki

Sadayasu Ishikawa

Katsuhiro Shirota

Shinichi Hakamada

Hiroyuki Uchida

Takashi Saito

Junichi Sakai

Takao Yamazaki

Hiroyuki Hoshino

Fumihiko Mukae

Shizuaki Masuda

Shinji Watanabe

Sadayuki Sugama

Shinya Watanabe

Hiroto Nakamura

Nobuyuki Sato

Masashi Tsujimura

Hayato Kiuchi

Yasuhiro Nito

Yoshihito Kobayashi

Hirofumi Ichinose

Tomoyuki Nakayama

Koichi Osumi

Hiromitsu Kishi

Takeshi Onishi

Katsunobu Suzuki

Sayoko Nagashima

Ichiro Yamahata

Akira Haga

Takatoshi Sakurai

Satomi Kawabe

Isamu Sorimachi

Hiroki Ikeda

Hiroshi Takada

Toshihiko Yagi

Hideki Takayama

Kousuke Yamasaki

Yoshihisa Yamashita

Shin-ichi Sato

Fumiaki Fujioka

Tomoo Murakami

Tomoaki Sugiyama

Hiromoto Ii

Shigeki Kaneko

Itaru Tsuji

Yoshiko Iwai

Aki Takano

Toshiya Kondou

Yuuki Fujimura

Yoshihiro Omuro

Hisashi Arakida

Shinji Watababe

Ryoji Osu

Kikuo Wada

Hiromoto Il

Minoru Yatsuda

Shin-Ichi Sato

The chiller system includes an internal circulation path, an external circulation path, and a control device. The internal circulation path is equipped with a refrigerant tank, an internal circulation pump, and a freezer. The external circulation path includes a feed path and a return path the feed path being equipped with an external circulation pump and a temperature sensor. A communication path that provides communication between the return path and the refrigerant tank is equipped with throttle means. The internal circulation path is equipped with an on-off control valve, with one end of the pressurizing path being connected to an upstream side of the on-off control valve in the internal circulation path and the other end being connected to an upstream side of the throttle part in the communication path. The control device controls operation of the on-off control valve based on a measurement result of the temperature sensor.

Chiller system

A workpiece processing apparatus which coats a front surface of a workpiece with a resin, the workpiece having devices formed in regions demarcated by a plurality of planned dividing lines formed in a lattice pattern. The workpiece processing apparatus includes a cassette mounting base mounted with a cassette housing a plurality of workpieces, a resin coating unit that coats the front surface of the workpiece with the resin, a resin curing unit that cures the resin by applying an external stimulus to the coated resin, a resin grinding unit that flattens the cured resin by grinding the cured resin by a rotating grinding stone, and a conveying mechanism that conveys the workpiece between the units.

Workpiece processing apparatus including a resin coater and a resin grinder

A peeling method for peeling off a substrate provided over a front surface of a support plate through a peel layer from the support plate after dividing the substrate into a plurality of small pieces, the peeling method comprising: a first holding step of holding the support plate by a first holding unit; a dividing step of causing a cutting blade to cut into the substrate, or applying a laser beam of such a wavelength as to be absorbed in the substrate to the substrate, along division lines set on the substrate, to divide the substrate into the plurality of small pieces; a start point region forming step of blowing a fluid to the peel layer exposed at an end portion of a small piece among the plurality of small pieces, to form a start point region which will serve as a start point when peeling off the small piece from the support plate; a second holding step of holding the small piece by a second holding unit; and a peeling step of relatively moving the first holding unit and the second holding unit in directions for spacing away from each other, to peel off the small piece from the support plate.

Peeling method for peeling off substrate from support plate

A processing apparatus used in processing a workpiece having a device in each of a plurality of regions that includes a chuck table holding the workpiece, positioning means positioning the workpiece before grinding, resin coating means including a rotatable spinner table for coating the workpiece with a resin, cleaning means, a grinding unit, and a transfer unit. The transfer unit includes a first transfer unit transferring the workpiece from the positioning means to the spinner table and from the spinner table to the chuck table, a second transfer unit transferring the workpiece from the chuck table to the cleaning means, and a front/back surface inversion transfer unit taking over the workpiece from the cleaning means to the second transfer unit.

Workpiece processing and resin grinding apparatus

There is provided a carrier plate removing method for removing a carrier plate from a workpiece disposed on a top surface of a carrier plate via a provisional bonding layer. The carrier plate removing method includes a stepped portion forming step of forming a stepped portion in which the workpiece projects sideward as compared with the carrier plate by processing the carrier plate so as to remove a peripheral portion of the carrier plate along a peripheral edge of the carrier plate from an undersurface side opposite from the top surface of the carrier plate, a carrier plate holding step of holding the carrier plate by a carrier plate holding unit, and a removing step of removing the carrier plate from the workpiece by applying a force from the carrier plate side to the stepped portion, and moving the workpiece in a direction of separating from the carrier plate.

Carrier plate removing method

A method of removing a carrier plate is used to peel off and remove the carrier plate from a workpiece of a disk-shaped composite substrate in which the workpiece is disposed on a face side of the carrier plate with a temporary adhesive layer interposed therebetween. The method includes a step forming step of forming a step protruding laterally from the carrier plate more on a reverse side of the carrier plate than on the face side of the carrier plate, by removing an outer circumferential portion of the workpiece, an outer circumferential portion of the temporary adhesive layer, and a face-side side of an outer circumferential edge of the carrier plate, a starting point region forming step of forming a starting point region that acts as a starting point in peeling off the carrier plate from the workpiece.

Method of removing carrier plate

A method of manufacturing a molded chip includes a preparing step of sticking device faces of a plurality of device chips arrayed to a protective member that is thermally insulative, thereby forming a chip group; a molding step of, after the preparing step, supplying a molding resin to reverse sides of the device chips and gaps between the device chips, thereby forming a molded wafer in which the reverse sides and side faces of the device chips are covered with a resin molding; and a molded wafer dividing step of, after the molding step, dividing the molded wafer along centers of the gaps filled with the resin molding into molded chips on the basis of an image in which a face side of the molded wafer has been captured.

Method of manufacturing molded chip

A manufacturing method of a semiconductor device with a metal film includes a cut groove forming step of causing a cutting blade to cut into a first surface of a workpiece and forming cut grooves with a depth that exceeds the finished thickness of the workpiece along planned dividing lines, a protective member sticking step of sticking a protective member to the first surface of the workpiece, a grinding step of grinding the side of a second surface until the thickness of the workpiece becomes the finished thickness to divide the workpiece into semiconductor devices, a metal film covering step of covering, by a metal film, the side surface of each of the semiconductor devices for which the protective member is stuck to the side of the first surface and the side of the second surface after the grinding, and a protective member removing step of removing the protective member.

Manufacturing method of semiconductor device with metal film

A wiring board manufacturing method includes a sheet laminate forming step of impregnating a glass cloth with a synthetic resin to form a plurality of sheets and next stacking these sheets to form a sheet laminate having a first surface and a second surface, a core member forming step of stacking a release plate on the first surface of the sheet laminate, stacking an electrode plate on the second surface of the sheet laminate, next using a pressure plate to press the release plate, the sheet laminate, and the electrode plate in their stacked condition, thereby uniting them together to form a core member, and a grinding step of grinding the release plate of the core member in a condition where the electrode plate of the core member is held on a chuck table, thereby making a thickness of the core member uniform.

Wiring board manufacturing method

A peeling method for peeling off a substrate provided over a support plate through a peel layer from the support plate includes: a first holding step of holding one of the support plate and the substrate by a first holding unit; a start point region forming step of blowing a fluid to an end portion of the peel layer exposed at an end portion of the support plate and the substrate, to form a start point region which will serve as a start point when peeling off the substrate from the support plate; a second holding step of holding the other of the support plate and the substrate by a second holding unit; and a peeling step of relatively moving the first holding unit and the second holding unit in directions for spacing away from each other, to peel off the substrate from the support plate.

A carrier plate removing method for removing a carrier plate from a workpiece previously provided through a temporary bonding layer on the front side of the carrier plate is provided. The carrier plate removing method includes a shoulder portion forming step of processing a peripheral portion of the carrier plate along a peripheral edge thereof from the front side of the carrier plate on which the workpiece is provided, thereby forming a shoulder portion as a lower part connected to the back side of the carrier plate, the lower part projecting horizontally outward from the side surface of an upper part connected to the front side of the carrier plate.

There is provided a removal method of a carrier plate used when the carrier plate is removed from a workpiece bonded to a region excluding an outer rim part in a front surface of the carrier plate by a temporary bonding layer disposed on the whole of the front surface of the carrier plate. This removal method of a carrier plate includes a temporary bonding layer removal step of removing part or all of an outer rim part of the temporary bonding layer, a holding step of holding the workpiece from the upper side by a holding unit after removing part or all of the outer rim part of the temporary bonding layer, and a carrier plate removal step of removing the carrier plate from the workpiece by applying a downward force to the outer rim part of the carrier plate from the side of the front surface.

Removal method of carrier plate

There is provided a carrier plate removing method of removing a carrier plate from a workpiece disposed on a front surface of the carrier plate with a provisional bond layer interposed between the carrier plate and the workpiece. The carrier plate removing method includes a first holding step of holding the carrier plate and exposing the workpiece, a stepped portion forming step of forming a stepped portion in which an back surface side projects outward of a front surface side at an outer peripheral edge of the carrier plate, a second holding step of holding the workpiece and exposing the carrier plate, and a carrier plate removing step of removing the carrier plate from the workpiece by applying a force to the stepped portion and moving the carrier plate in a direction of being separated from the workpiece by a removing unit.

A wafer processing method for processing a wafer having devices on the front side is provided. The wafer processing method includes a back grinding step of grinding the wafer to form a recess and an annular reinforcing portion surrounding the recess on the back side of the wafer, and a dividing step of cutting the wafer along division lines formed on the front side of the wafer. In the back grinding step, a taper surface is formed between the bottom surface of the recess and the annular reinforcing portion. The taper surface is inclined with respect to a direction perpendicular to the bottom surface of the recess. In the dividing step, a cutting blade is lowered to start cutting at a position radially inside the outer circumference of the wafer and is subsequently raised to stop cutting at another position radially inside the outer circumference of the wafer.

Wafer processing method

A semiconductor device chip includes a semiconductor substrate having a first surface and a second surface opposite to the first surface, a semiconductor device disposed on the first surface of the semiconductor substrate, an interconnect pattern having an end connected to the semiconductor device and another end exposed on a surface of a function layer disposed on the first surface of the semiconductor substrate, plurality of external connection electrodes mounted on the surface of the function layer and electrically connected to the other end of the interconnect pattern, an electromagnetic wave shield film for shielding electromagnetic waves, which is disposed on the second surface of the semiconductor substrate and side surfaces of the function layer, and a ground interconnect electrically connected to the electromagnetic shield film and disposed on the function layer.

Semiconductor device chip and method of manufacturing semiconductor device chip

Growing community of inventors

Tokyo, Japan

Katsuhiko Suzuki