Nippon Kayaku Kabushiki Kaisha

Katsuhiko Oshimi

Masataka Nakanishi

Yasumasa Akatsuka

Toru Kurihashi

Masahiro Imaizumi

Toyofumi Asano

Sumio Ichimura

Syouichi Tomida

Takao Sunaga

Masahiro Hirano

Shigeru Moteki

Ryutaro Tanaka

Kenichi Kuboki

Yoshitaka Kajiwara

Eiichi Nishihara

Yoshio Shimamura

Naoyuki Ochi

Masaru Kudo

Koji Nakayama

Kazuyuki Ohhashi

Eiko Watanabe

Masayuki Itai

This invention provides a modified liquid epoxy resin having a low viscosity and a high performance, which is obtained by reacting a mixture of a bisphenol and a phenol aralkyl resin with an epiholohydrin. The bisphenol is preferable to be bisphenol F and is further preferable to have a bifunctional form purity as detected by gel permeation chromatography at UV 254 nm of not less than 95% by area in view of the fluidity. Moreover, the mixture of bisphenol and the phenol aralkyl resin is preferable to have a ratio of the phenol aralkyl resin of 10-70% by mass.

Modified liquid epoxy resin as well as epoxy resin composition using the same and cured product thereof

Disclosed is a phenol aralkyl epoxy resin having a structure wherein at least a phenol or a naphthol is bound by using an aralkyl group as a linking group and a structure represented by formula (1) below, while satisfying the condition 1 below. This epoxy resin is excellent in workability during production of a composition and is easy to control quality. Condition 1: The following relation (&#x3b1;) is satisfied with A being the hydroxyl equivalent (as measured in accordance with JIS K 0070) of a phenol-modified epoxy resin obtained by adding an equivalent molar amount of phenol relative to the epoxy equivalent of the epoxy resin, and B being the epoxy equivalent of the epoxy resin. 50&#x2266;1000&#xd7;(A&#x2212;B)/B&#x2266;250 (&#x3b1;). 

Phenol aralkyl epoxy resin with secondary hydroxyl groups

A phenol aralkyl type phenolic resin represented by the general formula (1), wherein the total content of the compounds represented by formulae (2) to (4) is 58 to 92% as determined by GPC and the contents of the compounds represented by formulae (2) to (4) as determined by HPLC satisfy the following relationship: 0.60&#x2266;(2a+b)/(2a+2b+2c)&#x2266;0.90 wherein a is the content of the compound of formula (2); b is the content of the compound of formula (3); and c is the content of the compound of formula (4). 

Phenolic resin, process for production thereof, epoxy resin, and use thereof

To provide an epoxy resin giving a cured object having high heat resistance, which is improved in impact resistance and moisture resistance as compared with conventional high-heat-resistance epoxy resins. The epoxy resin is obtained by glycidylating one or more phenol compounds comprising 95% or more 1,1,2,2-tetrakis (hydroxyphenyl)ethane, and is characterized in that in an examination by gel permeation chromatography, the epoxy resin has a tetranucleus-form content of 50 to 90% by area and an octanucleus-form content of at least 5% by area and has a total chlorine content of 5,000 ppm or smaller.

Tetraglycidyl ether of 1,1,2,2-tetrakis(hydroxyphenyl)ethane

The present invention relates to a sealant for liquid crystals having extremely low contamination nature to a liquid crystal, excellent coatability and bondability to a substrate, long service life and pot life and high adhesive strength. A sealant for liquid crystals of the present invention is characterized by comprising (a) an epoxy resin represented by general formula (1): (wherein a represents an integer of 2 to 4; n represents 0 to 3 (average value); R represents a divalent hydrocarbon group of 2 to 6 carbon atoms; A represents a polyvalent aromatic group; and G represents a glycidyl group, provided that when n is 0, (a) an epoxy resin represented by general formula (1) is a bisphenol S-type.), (b) a thermo-curing agent, (c) and a filler having average particle diameter of not larger than 3 &#x3bc;m.

Liquid crystal sealing agent and liquid crystalline display cell using the same

The object of the present invention is to provide an epoxy resin and epoxy resin composition having a low viscosity which can afford a cured product having an excellent heat resistance. The present invention is characterized by using an epoxy resin which is obtained by reacting 5-methylresorcin with epihalohydrin in the presence of alkali metal hydroxide.

Epoxy resins, epoxy resin mixtures, epoxy resin compositions and products of curing of the same

Polyphenol resin, process for its production, epoxy resin composition and its use

Resin compositions having a low viscosity, a low hygroscopicity, high adhesive properties and a high heat resistance as well as being light in weight and excellent in mechanical properties are provided. The resin compositions include polyhydric phenol compounds represented by the formula ( ) and epoxy resins represented by the formula ( ).

Polyhydric phenol compounds, epoxy resins, epoxy resin compositions and cured products thereof

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Saitama, Japan

Katsuhiko Oshimi