Sumitomo Chemical Company, Limited

Other

Katsuhiko Namba

Yasunori Uetani

Masumi Suetsugu

Koshiro Ochiai

Kunihiro Ichimura

Hiroshi Moriuma

Junji Nakanishi

Kaoru Tatekawa

Tsugio Okudaira

The present invention provides a positive resist composition comprising

Positive resist composition

A chemical amplifying type positive resist composition having excellent sensitivity and resolution, manifesting no generation of scum is provided, which comprises a resin which has a polymerization unit derived from hydroxystyrene and a polymerization unit derived from 2-ethyl-2-adamantyl (meth)acrylate, and is insoluble or poorly soluble itself in an alkali, but becomes alkali-soluble after dissociation of the above-mentioned acid unstable group by the action of an acid; a radiation sensitive acid generating agent; and polypropylene glycol.

Chemical amplifying type positive resist composition

Chemical amplification type positive resist composition

A photoresist composition comprising a binder component, an acid generator and a surface active agent containing fluorine atom(s) is provided, and the photoresist composition reduces development deficiency generated at the time of development significantly without lowering the resolution, the profile, or the like. The surface active agent is poly trifluorobutyl methyl siloxane.

Photoresist composition

A positive-working resist composition comprising (A) a quinonediazide compound, (B) an alkali-soluble resin, and (C) a solvent system comprising 2-heptanone, ethyl lactate and .gamma.-butylactone in which the quinonediazide compound exhibits a very high solubility and which characteristics such as sensitivity, profile and coatability are excellent.

Positive-working quinonediazide sulfonic acid ester resist composition

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Hirakata, Japan

Katsuhiko Namba