Fujitsu Corporation

Pfu Limited

Fuji Furukawa Engineering & Construction Co., Ltd

Fujitu Limited

Katsuhiko Nakata

Tadashi Katsui

Takashi Kitahara

Tadanobu Matsumura

Yasuaki Sugimoto

Takeshi Koga

Yoshimi Tanaka

Takayuki Horinishi

Hideki Kimura

Yoichi Sato

Naoki Shinjo

Akihiro Yasuo

Hitoshi Nori

Mitsuo Hayashi

Yoshihiro Kusano

Yoshihisa Iwakiri

Kengo Ueda

Tomoaki Haneda

Mika Tokumitsu

Kouji Kuroda

Kenji Tosaka

Atsushi Endo

Shinichirou Kouno

Takashi Urai

Masahide Kodama

A disclosed unit device: two first circuit boards provided apart from each other in a horizontal direction; heat generating components respectively provided on the two first circuit boards; two second circuit boards provided between the two first circuit boards, arranged to stand at a distance from each other, and each having an opening; and a fan provided between the two second circuit boards and configured to cool the heat generating components on the two first circuit boards by drawing air through the opening of one of the second circuit boards and by expelling the air through the opening of the other second circuit board.

Unit device

To cool a blade type server disposed in an air-conditioned room, the following arrangements are made. The first is at least one shell having a ventilation passage disposed in the air-conditioned room. The second is, the following are disposed in a ventilation passage: racks, in which blade type servers each composed of a case with slim boards housed therein are stacked; cooling coils each having a coolant passage and a cooling fin and cooling a passing air; and at least one fan unit having axial-flow fans placed therein and producing air currents in one direction. The third is the fan unit forces a cooling air to flow in one direction in the ventilation passage thereby to cool the servers in the racks. The cooling coils and racks are disposed alternately so that warmed cooling air after passing through the rack is cooled by the cooling coil and then cools the next rack.

Cooling system for information device

A shock absorbing body is interposed between an internal component such as a hard disk drive (HDD) and the inside surface of an enclosure for an electronic apparatus such as a notebook personal computer. The shock absorbing body includes a first receiving surface defined at one end of the shock absorbing body so as to receive the internal component. A second receiving surface is defined at the other end of the shock absorbing body so as to receive the inside surface of the enclosure. A constriction is formed in the shock absorbing body between the first and second receiving surfaces. When a larger impact is applied to the enclosure, the shock absorbing body is allowed to suffer from a fracture at the constriction. The energy of the impact is transformed into the energy of the fracture at the constriction. The impact energy is sufficiently consumed in this manner. The internal component can be protected from the larger impact.

Shock absorbing member capable of absorbing larger impact applied to electronic apparatus

A heat sink mounted on a heat producing element for cooling the heat producing element attached on the printed board of the electronic apparatus, having a heat sink body made of a good heat conductive material and a fan assembly installed inside the heat sink body. The heat sink body is efficiently air-cooled by a cooling air generated by the rotation of the fan assembly. The cooling air forcibly cools a base and a fixing wall of the base adjacent to the heat producing element and plate-like radiating fins or a pin-like radiating fins are protruded on the heat sink body to radiate the heat effectively. The position of the fan assembly is at the center of the heat sink body or is at the offset position from the center of the heat sink body. The heat sink of the present invention can be installed in a portable electronic apparatus such as a portable computer.

Heat sink for cooling a heat producing element and application

The integrated circuit package includes a package body, an integrated circuit chip enclosed airtight in the package body, a lead provided at a lower portion of the package body for connecting the integrated circuit chip to an external circuit, and air blasting means for cooling the package body by forced air cooling. The package body has, at an upper portion thereof, a heat radiation region formed from a fin and an air blasting region in which the air blasting means is disposed. A ventilation flue is formed between the heat radiation region and the air blasting region. This package is particularly superior in its heat radiation properties.

Integrated circuit package

Combined heat sink and fan

Growing community of inventors

Kawasaki, Japan

Katsuhiko Nakata