Max Co., Ltd.

Sumco Corporation

Katsuhiko Murayama

Tomohiro Hashii

Sakae Koyata

Kazushige Takaishi

Takeo Katoh

Junichi Tamura

Masakazu Konishi

Hajime Takemura

Keijiro Murayama

Jyunichi Tamura

Hiroshi Tanaka

Satoshi Osuga

Makoto Kosuge

Yuichi Kakizono

Hiroshi Hanagasaki

Kazuhiko Kuraguchi

A method for manufacturing an epitaxial wafer that can reduce occurrence of a surface defect or a slip formed on an epitaxial layer is provided. The manufacturing method is characterized by comprising: a smoothing step of controlling application of an etchant to a wafer surface in accordance with a surface shape of a silicon wafer to smooth the wafer surface; and an epitaxial layer forming step of forming an epitaxial layer formed of a silicon single crystal on the surface of the wafer based on epitaxial growth.

Method for manufacturing epitaxial wafer

A gas combustion type driving tool includes a feed piston/cylinder mechanismby which a feed piston, engaged/disengaged to/from a connecting fastener housed in a magazine, is reciprocated in a fastener feed direction in which the piston is fed toward a nose partand a retracting direction opposite to the feed direction. The feed pistonis constantly spring-urged in the feed direction, and part of a combustion gas is supplied to a feed cylindervia a gas pipeprovided between the combustion chamberand the feed piston/cylinder mechanism, thereby operating the feed pistonin the retracting direction against a spring. In the gas combustion type driving tool, filtersfor cooling a combustion gas are located in the gas pipe

Gas combustion type driving tool

An object of the present invention is to provide a method for etching a single wafer, which effectively realizes a high flatness of wafer and an increase in productivity thereof. In a method for etching a single wafer, a single thin disk-like wafer sliced from a silicon single crystal ingot is spun, and a front surface of the wafer is etched with an etching solution supplied thereto. In the method, a plurality of supply nozzles are disposed above and opposite to the front surface of the wafer at different portions in the radial direction of the wafer, respectively; and then one or more conditions selected from the group consisting of temperatures, kinds, and supply flow rates of etching solutions from the plurality of supply nozzles are changed.

Method for etching single wafer

In a gas cartridge, inside of a metal made outer canis arranged with a metal made inner bagcharged with a fuel gas G. A space between the outer canand the inner bagis charged with a compression gas Gfor pressing to crush the inner bagin accordance with consumption of the fuel gas G. Pertinent positions on an inner side of the outer canare provided with deformation introducing members Pthrough Pfor producing an initial deformation for introducing a deformation of the inner bag when a press force of the compression gas Gis received.

Gas cartridge

An apparatus for etching a wafer by a single-wafer process comprises a fluid supplying device which feeds an etching fluid on a wafer, and a wafer-chuck for horizontally holding the wafer. The wafer-chuck is equipped with a gas injection device for injecting a gas to the wafer, a first fluid-aspirating device, and a second fluid-aspirating device. The etching fluid supplied on the wafer is spread by a rotation of the wafer. The etching fluid is scattered by a centrifugal force, or flows down over an edge portion of the wafer and is blown-off by the gas injected from the gas injection unit, and is aspirated by the first fluid-aspirating device or the second fluid-aspirating device.

Apparatus for etching wafer by single-wafer process and single wafer type method for etching wafer

Fuel gas or some other kind of fluid is stored in a collapsible metallic bag that is attached to a valve and is stored inside a rigid outer container. Between the rigid outer container and the collapsible bag is a space or volume filled with compression gas during use which puts a collapsing pressure evenly upon the bag. In order to reduce bag failures, the outer surface of the collapsible bag has a series of projected streak portions that project outwardly from the vertical length of the collapsing in several locations that prevent the bag from expanding to fill the entire space between the rigid outer container and the bag. These projected streaks form recessed portions in the bag's surface which facilitates the bag collapsing in those predetermined locations evenly which in turn reduces the collapsible bag's failure rate from breaking during operation.

A gas combustion type driving tool is provided with two modes including: a contact mode in which a contact armis pressed against a workpiece P into which a nail is to be driven and the nail is driven under a condition that a trigger leveris pulled; and a trigger mode in which the trigger leveris pulled and the nail is driven under a condition that the contact armis pressed against the workpiece P. In either mode, a nail driving can be continuously executed.

Disclosed is a method for smoothing the surface of at least one side of a wafer which is obtained by slicing a semiconductor ingot. In this method, a fluid is applied according to projections of the wafer surface, thereby reducing the projections. Alternatively, a fluid is applied over the wafer surface, thereby smoothing the entire surface of the wafer while reducing the projections in the wafer surface.

Method for smoothing wafer surface and apparatus used therefor

In a feed piston and cylinder mechanism for feeding a feed claw that engages with and disengages from connected nails accommodated within a magazine to a nose portion, the feed claw is biased in a feeding direction by a bias member and is retracted in a backward direction by high-pressure combustion gas. A valve is provided in a path which guides the high-pressure combustion gas to the feed piston and cylinder mechanism and communicates the path with the atmosphere. The feed piston and cylinder mechanism is controlled by opening/closing the valve.

Gas combustion-type driving tool

An object of the present invention is to provide a single wafer etching apparatus realizing a high flatness of wafers and an increase in productivity thereof. In the single wafer etching apparatus, a single thin disk-like wafer sliced from a silicon single crystal ingot is mounted on a wafer chuck and spun thereon, and an overall front surface of the wafer is etched with an etching solution supplied thereto by centrifugal force generated by spinning the wafer. The singe wafer etching apparatus includes a plurality of supply nozzlescapable of discharging the etching solutionfrom discharge openingsonto the front surface of the wafer, nozzle-moving devices each capable of independently moving the plurality of supply nozzles, and an etching solution supplying devicefor supplying the etching solutionto each of the plurality of supply nozzles and discharging the etching solutionfrom each of the discharge openings to the front surface of the wafer

Single wafer etching method

When gas is explosively burnt within a combustion chamber, a striking piston is impulsively driven to drive out a fastener from a nose portion. A gas tube is provided between the combustion chamber and a feed cylinder which accommodates a feed piston that reciprocally moves a feed claw engaged with and disengaged from connected fasteners to a nail feed direction for feeding to the nose portion side and an evacuation direction in opposite thereto. A check valve having a restriction hole is disposed on the way of the gas tube so as to be opened and closed. The check valve is normally urged by a spring to a closed direction and opens against the force of the spring by the gas pressure from the combustion chamber.

This wafer polishing apparatus includes: a polishing plate having a polishing pad; a carrier plate which is placed facing the polishing pad and which slides and presses wafers against the polishing pad, while rotating in a state of holding the wafers; and an abrasive slurry supply device, wherein the abrasive slurry supply device is able to supply different abrasive slurries, each of the abrasive slurries contains abrasives of which the average grain size is different from those contained in the other abrasive slurries. This method for polishing wafers includes: while supplying an abrasive slurry to a surface of a polishing pad, sliding and pressing wafers against the polishing pad, wherein different abrasive slurries are supplied to the surface of the polishing pad, and each of the abrasive slurries contains abrasives of which the average grain size is different from those contained in the other abrasive slurries.

Wafer polishing apparatus and method for polishing wafers

When a movable sleeveon a cylinder moves upward, a combustion chamberin a sealed state is formed. Mixed gas is explosively burnt within the combustion chamberso as to drive a fastener out. A lock cylinderis disposed beneath the movable sleeve. A lock pistonis housed within the lock cylinderso as to be movable in an up/down direction. The upper end of the lock pistonis capable of being engaged with a holding memberwhich is interlocked with the movable sleeve. The lower portion of the lock cylinder is coupled to the combustion chamber via a gas tube. The gas tubeis provided with a check valve. The lock cylinderis provided with an electromagnetic valve. The electromagnetic valveopens upon the lapse of a predetermined time period after the combustion within the combustion chamber.

In a gas combustion type striking tool which strikes a fastener supplied in a nose portion into a member to be fastened by burning mixed gas inside a combustion chamber above a striking cylinder in accordance with a pulling operation of a trigger lever to drive a striking piston and a driver by a pressure of the combustion gas thus generated, a topper is disposed so as to be able to protrude into a path of a feed pawl or a feed piston, and a stopper engaging member, which extends downward from the striking cylinder and is movable in a vertical direction, engages with the stopper when the stopper engaging member moves downward, thereby retracting the stopper from the path.

Gas combustion type striking tool

In a gas cartridge, inside of an outer canis arranged with an inner bagcharged with a gas, and a space between the outer canand the inner bagis charged with a compression gas Gfor pressing to crush the inner bagin accordance with consumption of the gas. The outer canis integrally formed with a deformation introducing portion Pfor producing an initial deformation at the inner bag

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Tokyo, Japan

Katsuhiko Murayama