Tokyo Electron Limited

Tokyo Electron Kabushiki Kaisha

Tokyo Electron Tohoku Kabushiki Kaisha

Tokyo Electron Kabushiki

Tokyo Electron Tonoku Kabushiki Kaisha

Tokyo Electron Tohoku Kabushiki Kaisha, Both of

Katsuhiko Mihara

Yuji Ono

Satoshi Asari

Hiroshi Kikuchi

Kenichi Yamaga

Hiroyuki Iwai

Masahiro Miyashita

Tsutomu Wakamori

Disclosed is an improved transfer mechanism that transfers, in a vertical heat treatment system, process objects W between a container (carrier), and a holder (boat) holding plural process objects at vertical intervals. The transfer mechanism includes plural substrate support devices spaced at intervals, and each of the substrate support devices has a gripping mechanism for gripping a process object on the under side. The gripping mechanism includes a fixed engagement member on a distal end of the substrate support device, and a movable engagement member movably attached to a proximal end of the substrate support device.

Vertical heat treatment system and method of transferring process objects

A transfer mechanismof a vertical heat treatment systemincludes a base capable of vertical movement and turning movement, and plural substrate support devices, disposed on the base so as to be movable anteroposterior, that hold wafers W. Provided on the baseis a first sensorthat emits a light beam directed toward a direction in which the substrate support devicemoves anteroposterior, and detects the target member upon receipt of a reflected light of the light beam. Provided on two tip end portions of the substrate support deviceis a second sensorthat detects the target member upon interruption of a light beam traveling between the tip end portions by the target member. When a target memberprovided at its specific positions with projectionsandis placed at a position in a wafer boatthe basemoves vertically and turns, and the substrate support devicemoves anteroposterior. The position of the target member, or the transfer target position of the wafer, is automatically detected based on the detection signals of the first sensorand the second sensor obtained at the time and encoder values of drive systems relating to the movement of the baseand the substrate support member

Vertical heat treatment system and automatic teaching method for transfer mechanism

A vertical type of thermal processing apparatus of the present invention includes a thermal processing furnace having a furnace opening at a lower portion thereof. A boat holding objects to be processed in a tier-like manner in a vertical direction is adapted to be contained in the thermal processing furnace through the furnace opening. A lid supporting the boat is capable of closing the furnace opening. A transferring chamber is connected to the furnace opening. An elevating mechanism provided in the transferring chamber is configured to move up and down the lid in order to load and unload the boat into and out from the thermal processing furnace. A connecting port provided at a wall of the transferring chamber is capable of being connected to an opening of a conveying container for containing the objects to be processed. A first containing portion provided in the transferring chamber is capable of temporarily containing unprocessed objects to be processed for a next thermal process. A second containing portion provided in the transferring chamber is capable of temporarily containing processed objects to be processed conveyed out from the thermal processing furnace. A transferring mechanism transfers objects to be processed between the conveying container, the first containing portion, the second containing portion and the boat.

Vertical type of thermal processing apparatus and method of using the same

A treatment system is disclosed, which has a treatment apparatus for performing a predetermined treatment for a planar workpiece contained in a carrier, and a first air-tight carrier storage chamber for storing the carrier. The treatment apparatus may also have an air-tight second carrier storage chamber. An inert gas supply pipe and an exhaust pipe are connected to each of the treatment apparatus, the first carrier storage chamber, and the second carrier storage chamber. A open/close valve device is provided for each of the inert gas supply pipes and the exhaust pipes.

Treatment system and treatment apparatus with multi-stage carrier

A vertical heat treating apparatus includes a first boat elevator for carrying a first wafer boat between a wafer transfer region and a predetermined position in a heat treating furnace, and a second boat elevator for carrying a second wafer boat between the wafer transfer region and the predetermined position in the heat treating furnace. With this construction, it is possible to eliminate the problems of causing the position shift of the wafer boat, so that and it is possible to prevent the wafer boat from overturning. The apparatus also has cutouts formed in the lower end portion of the wafer boat, and guide members formed on the upper surface of a wafer transfer stage so as to be engageable with the cutouts. With this construction, if the positioning is forcibly carried out when the wafer boat is loaded on the wafer transfer stage, it is possible to correct the position shift to prevent the shift from accumulating, so that it is possible to prevent the wafer boat from overturning.

Vertical heat treating apparatus

A processing apparatus is provided with a reaction furnace for subjecting semiconductor wafers, which are objects to be processed, to a predetermined processing; a storage rack for storing carriers (wafer cassettes), each containing a predetermined number of semiconductor wafers; and a conveyor for conveying the carriers into and out of the reaction furnace and the storage rack. In this case, a second conveyor mechanism, which comprises the storage portion and at least part of the conveyor, and a third conveyor mechanism are disposed within a sealed chamber in such a manner that they are isolated from the outer atmosphere. An exchange chamber that can be isolated from the outer atmosphere is further provided, for temporarily storing carriers that are to be conveyed into or out of the storage portion, through the sealed chamber via a communicating port. The interiors of the sealed chamber and the exchange chamber are formed so that they can be supplied with nitrogen. This ensures that unprocessed and processed semiconductor wafers can be held in an inert gas environment, so that contamination of the semiconductor wafers by organic substances and heavy metals can be prevented.

Processing apparatus

A treatment system is disclosed, which has a treatment apparatus for performing a predetermined treatment for a planar workpiece contained in a carrier, and an first air-tight carrier storage chamber for storing the carrier. The treatment apparatus may also have an air-tight second carrier storage chamber. An inert gas supply and exhaust are connected to each of the treatment apparatus, the first carrier storage chamber, and the second carrier storage chamber. A valve device is provided for the inert gas supply and exhaust.

Treatment system and treatment apparatus

A treatment system is disclosed, which has a treatment apparatus for performing a predetermined treatment for a planar workpiece contained in a carrier, and a first air-tight carrier storage chamber for storing the carrier. The treatment apparatus has an air-tight second carrier storage chamber. An inert gas supply pipe and an exhaust pipe are connected to each of the treatment apparatus, the first carrier storage chamber, and the second carrier storage chamber. An open/close valve and an open/close device are connected to each of the inert gas supply pipes and the exhaust pipes.

Treatment system including a plurality of treatment apparatus

A treatment system is disclosed, which has a treatment apparatus for performing a predetermined treatment for a planar workpiece contained in a carrier, and an first air-tight carrier storage chamber for storing the carrier. The treatment apparatus may also have an air-tight second carrier storage chamber. An inert gas supply and an exhaust means are connected to each of the treatment apparatus, the first carrier storage chamber, and the second carrier storage chamber. A valve device is provided for the inert gas supply and exhaust means.

Growing community of inventors

Hachioji, Japan

Katsuhiko Mihara