Hitachi, Ltd.

Hitachi Car Engineering Co., Ltd.

Other

Katsuhiko Kikuchi

Masahide Hayashi

Hiromichi Ebine

Satoshi Shimada

Atsushi Miyazaki

Hiroshi Onuki

Kenji Nakabayashi

Takatoshi Yamamoto

Yoshiyuki Akiyama

Kazuya Ishihara

Masaaki Suzuki

Ryozo Tomosaki

Hiroshi Hitachi Ltd Ipg 12Th Floor Onuki

Kenji Hitachi Ltd Ipg 12Th Floor Nakabayashi

Takatoshi Hitachi Ltd Ipg 12Th Floor Yamamoto

Yoshiyuki Hitachi Ltd Ipg 12Th Floor Akiyama

Kazuya Hitachi Ltd Ipg 12Th Floor Ishihara

An electronic device requires an electronic component to be mounted for the purpose of static shielding. The mounting of such an electronic component raises a problem of avoiding thermal stresses and cracks generated due to the difference between the coefficients of linear expansion of component materials. A positioning recess, a joining-substance thickness ensuring recess, a joining-substance thickness ensuring projection, etc. are formed in a combined manner in an electronic component mount portion of each of leads, whereby spreading of cracks generated in the joining substance can be suppressed and reliability can be improved. Filling a sealing material so as to seal and restrain the electronic component mounted in the electronic component mount portion without leaving voids contributes to further suppressing spreading of cracks generated in the joining substance and ensuring more improved reliability of the joining substance.

Electronic device and pressure sensor

After the periphery of the magnetic sensitive element is surrounded by an elastic member, the magnetic sensitive element is mold-formed with resin material. Soft epoxy or gel resin is employed as the elastic member, poured in an element-mounting space and solidified. The magnetic sensitive element is surrounded by silicone rubber. Such construction allows the magnetic sensitive element not to be affected by vibration and allows the elastic member to absorb the stress which is created due to the thermal deformation of the molded resin.

Noncontact rotation angle sensor, manufacturing method for the same, and throttle valve control device for internal combustion engine having the same

An outer case connector portion, a gauge housing case, and the like for use with a pressure sensor, for example, are generally made of a thermoplastic or thermosetting resin. However, the resin physically causes curing shrinkage. Especially when a metal is insert molded with a resin, curing shrinkage of the resin generates a gap at the interface between the resin and the metal. By filling an anaerobic, high-permeability adhesive in the gap, hermetic sealing can be ensured and reliability can be enhanced. Inexpensive hermetic sealing and enhanced reliability are realized.

Pressure sensor, flowmeter electronic component, and method for manufacturing the same

The invention is intended to provide a small and highly reliable pressure sensor, which has a smaller number of components and can be produced by using a mold for resin molding in common. A sensor unit () is molded with resin and includes a semiconductor chip () for converting the change in pressure of a medium introduced through an introduction hole for measurement into an electric signal. A lead member () has one end exposed in a connector () and is electrically connected to the semiconductor chip () in the sensor unit () beforehand. Pressure is applied to the semiconductor chip () through a pipe (). An outer case () is integrally formed of synthetic resin by insert molding of the sensor unit (), the lead member () and the pipe ().

Light source device and display device

The present invention provides a pressure detector capable of easily responding to changes in specification. The pressure detector has a sensor unit for detecting pressure and electronic parts for reducing electrical disturbance which are electrically joined to an exposed part of lead material of an opening of an external case. Thermoset resin is injected and set in the opening to obtain fixed members. An external electronic part for compensating for transient voltage resistance and electromagnetic failure resistance of a single one-chip semiconductor sensor can be mounted, and cost can be reduced by miniaturization, light weight, and reduction in man-hours required for assembly.

Pressure detecting apparatus

Growing community of inventors

Hitachinaka, Japan

Katsuhiko Kikuchi