Nitto-denko Corporation

Essilor International

Katsuhiko Kamiya

Kiyoe Shigetomi

Hironao Ootake

Takeshi Matsumura

Tatsuya Suzuki

Akiko Tanaka

Masatsugu Higashi

Shuuhei Murata

Shinji Hoshino

Masayuki Satake

Masahiko Ando

Junichi Nakayama

Takahiro Nonaka

Satomi Yoshie

Tomonari Naito

Tomohide Banba

Yoshihiro Minamizaki

Shou Takarada

Aimi Matsuura

Koji Shitara

Mizue Yamasaki

Azusa Iseki

Catherine Berger

Manuela Desousa

Violaine Coue

The invention relates to a functionalized laminated optical element comprising: &#x2014;An optical base element; &#x2014;A functional film structure consisting of a single layer or a multilayer structure; &#x2014;A layer of a pressure-sensitive adhesive of optical quality, placed between one surface of the optical base element and the functional film structure so as to permanently retain said functional film structure on the surface of the optical base element. Said functionalized laminated optical element maintains its integrity after typical processing of an optical article which includes wheel edging. More particularly the invention relates to the use of a specific adhesive system for improving the wheel edging resistance of functionalized laminated optical element. The functional laminated optical may be an ophthalmic lens.

Functionalized laminated optical element with improved edging resistance

Provided is a PSA composition for forming a PSA comprising a (meth)acrylic polymer, comprising, as monomeric components constituting the (meth)acrylic polymer: (A) a Calkyl (meth)acrylate, (B) an alicyclic monomer, and (C) a monomer having at least either a hydroxyl group or a carboxyl group. The average number of carbons of alkyl group in the (A) is 8 or less. The monomeric components comprise the (C) at 3% by weight or greater while the weights Wb and Wc of the (B) and (C) satisfy a relationship 0.8&#x2264;Wb/Wc.

Pressure-sensitive adhesive composition

A pressure-sensitive adhesive of the invention include a (meth)acryl-based polymer obtained by polymerization of a monomer component including 30 to 99.5% by weight of an alkyl (meth)acrylate having an alkyl group of 10 to 18 carbon atoms at an ester end and 0.5 to 50% by weight of a cyclic nitrogen-containing monomer. The pressure-sensitive adhesive has a satisfactory level of adhesive performance and can form a pressure-sensitive adhesive layer with a lower dielectric constant and reliable moisture resistance.

Adhesive, adhesive layer, and adhesive sheet

Provided is a pressure-sensitive adhesive capable of realizing a pressure-sensitive adhesive layer having satisfactory adhesion performance and a high ink step absorbability. A radiation-curable pressure-sensitive adhesive, which contains a (meth)acryl-based polymer obtained by polymerizing a monomer component containing 30 to 90% by weight of an alkyl(meth)acrylate having an alkyl group of 10 to 22 carbon atoms at an ester end, and having a radically polymerizable functional group containing a carbon-carbon double bond.

Radiation-curable pressure-sensitive adhesive, radiation-curable pressure-sensitive adhesive layer, radiation-curable pressure-sensitive adhesive sheet, and laminate

Provided is a pressure-sensitive adhesive layer for a transparent conductive film having a patterned transparent conductive thin film, which has transparent as the pressure-sensitive adhesive layer for transparent conductive film and can prevent the patterned transparent conductive thin film from degrading the appearance of the conductive film. A pressure-sensitive adhesive layer for a transparent conductive film having a patterned transparent conductive thin film, wherein the pressure-sensitive adhesive layer is made from an acrylic pressure-sensitive adhesive composition containing: 100 parts by weight of an acryl-based polymer obtained by polymerization of a monomer component including an alkyl(meth)acrylate; and 30 to 150 parts by weight of a styrene-based oligomer, the pressure-sensitive adhesive layer has a refractive index of 1.50 or more, the pressure-sensitive adhesive layer has a haze of 2% or less as measured at a thickness of 30 &#x3bc;m.

Pressure-sensitive adhesive layer for transparent conductive film, transparent conductive film with pressure-sensitive adhesive layer, transparent conductive laminate, and touch panel

Provided is a dicing die-bonding film which is excellent in balance between retention of a semiconductor wafer upon dicing and releasability upon picking up. Disclosed is a dicing die-bonding film comprising a dicing film having a pressure-sensitive adhesive layer on a substrate material, and a die-bonding film formed on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer contains a polymer including an acrylic acid ester as a main monomer, 10 to 40 mol % of a hydroxyl group-containing monomer based on the acrylic acid ester, and 70 to 90 mol % of an isocyanate compound having a radical reactive carbon-carbon double bond based on the hydroxyl group-containing monomer, and is also cured by irradiation with ultraviolet rays under predetermined conditions after film formation on the substrate material, and wherein the die-bonding film contains an epoxy resin, and is also bonded on the pressure-sensitive adhesive layer after irradiation with ultraviolet rays.

Dicing/die bonding film

A dicing die-bonding film having a pressure-sensitive adhesive layer on a base and a die-bonding film on the pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer comprising an acrylic polymer comprising acrylic ester A represented by CH&#x2550;CHCOOR(where Ris an alkyl group having 6-10 carbon atoms), acrylic ester B represented by CH&#x2550;CHCOOR(where Ris an alkyl group having 11 carbon atoms or more), a hydroxyl group-containing monomer, and an isocyanate compound having a radical reactive carbon-carbon double bond where the ratios of components are 40-10 mol % of the acrylic ester B with respect to 60-90 mol % of the acrylic ester A, 10-30 mol % hydroxyl group-containing monomer with respect to 100 mol % of the total of the acrylic ester A and the acrylic ester B, and 70-90 mol % isocyanate compound with respect to 100 mol % of the monomer containing a hydroxl group.

Dicing die-bonding film

The present invention provides a dicing die-bonding film including: a dicing film having a pressure-sensitive adhesive layer provided on a base material; and a die-bonding film provided on the pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer of the dicing film is an active energy ray-curable pressure-sensitive adhesive layer which contains a gas-generating agent in a ratio of 10 to 200 parts by weight based on 100 parts by weight of a base polymer which is a specific acrylic polymer A, and the die-bonding film is formed of a die-adhering layer.

Dicing die-bonding film and process for producing semiconductor device

The purpose of the invention is to obtain a water-dispersible adhesive composition capable of coating in an aqueous system and, particularly, an adhesive composition capable of preparing a removable water-dispersible acrylic adhesive sheet with less contamination to the surface of an adherend and having high resistance to water intrusion during wafer polishing, which is particularly suitable as an adhesive sheet for use in semiconductor wafer processing. The invention relates to a water-dispersible acrylic adhesive composition, which includes an acryl emulsion polymer obtainable by an emulsion polymerization of a monomer mixture containing an alkyl (meth)acrylate ester; and a crosslinker which is a carbodiimide crosslinker or a hydrazine crosslinker, in which the acryl emulsion polymer has a glass transition temperature of from &#x2212;80 to &#x2212;20&#xb0; C.

Removable water-dispersible acrylic adhesive composition and adhesive sheet

A pressure sensitive adhesive optical film with a pressure sensitive adhesive layer laminated on at least one surface of an optical film, wherein the pressure sensitive adhesive layer has a value of no more than 5 N/25 mm for a Pwhich is initial 90&#xb0; peel strength at 23&#xb0; C. and by a peeling speed of 300 mm/minute after an autoclave processing under a condition of 50&#xb0; C.&#xd7;5 atm&#xd7;15 minutes, and a ratio (P/P) of a Pto a Pis no less than 2, which Pis 90&#xb0; peel strength after heating by a peeling speed of 300 mm/minute and at 23&#xb0; C. after the pressure sensitive adhesive layer is given the above-mentioned autoclave processing and is furthermore given a heat-treatment at 80&#xb0; C. for 2 hours.

Growing community of inventors

Ibaraki, Japan

Katsuhiko Kamiya