Panasonic Intellectual Property Management Co., Ltd.

Katsuhiko Itoh

Kenji Okamoto

Daisuke Nagai

Mitsuo Nakamura

Masanori Ikeda

Nobuo Komiya

Masahiro Kihara

Tadashi Endo

Hiroyuki Fujiwara

Syozo Kadota

Hiroshi Matsumura

Makoto Nakashima

A component supplier of the present disclosure includes a magazine that stores pallets, a table that is provided in front of the magazine and is provided with a standby tables in multiple tiers in an up-and-down direction, a first lift that moves the table up and down, and a pallet supplier that is provided in front of the table and that includes a supply table which holds at least one of the pallets at a component supply position where the component is supplied. The table has a first placing and withdrawing unit that places and withdraws the pallet between the magazine and the standby tables and a second lift that moves the first placing and withdrawing unit up and down. The pallet supplier has a second placing and withdrawing unit that places and withdraws the pallet between the standby tables and the supply table.

Component supplier and component supplying method

An electronic component mounting system includes: a printing apparatus; an electronic component mounting apparatus; and a mounting information storage unit which stores mounting information. The mounting information includes execution mode information in which one of a first mounting mode and a second mounting mode is set for each of electronic components. In the first mounting mode, the electronic component is placed at a mounting position corrected on the basis of a recognition result of a first recognition mark formed on a board. In the second mounting mode, the electronic component is placed at a mounting position corrected on the basis of a recognition result of a second recognition mark formed by paste printed on the board. The electronic components are mounted on the board according to mounting modes set for the respective electronic components by referring to the mounting information.

Electronic component mounting system and electronic component mounting method

A component mounting apparatus includes a mounting unit that mounts an electronic component on a board, at least one component supply unit that supplies chip solder, and a control unit that controls the mounting unit to mount the chip solder, which is supplied from the component supply unit, on the board, based on production data in which a size of chip solder is instructed for each component terminal.

Component mounting method

An electronic component mounting system includes: a printing apparatus; a plurality of electronic component mounting apparatuses; and a mounting information storage unit which stores mounting information. The mounting information includes execution mode information in which one of a first mounting mode and a second mounting mode is set for each of electronic component mounting apparatuses. In the first mounting mode, the electronic component is placed at a mounting position corrected on the basis of a recognition result of a first recognition mark formed on a board. In the second mounting mode, the electronic component is placed at a mounting position corrected on the basis of a recognition result of a second recognition mark formed by paste printed on the board. The electronic components are mounted on the board according to mounting modes set for each of the electronic component mounting apparatuses by referring to the mounting information.

A component mounting apparatus includes a mounting unit that mounts an electronic component on a board, at least one component supply unit that supplies chip solder, and a control unit that controls the mounting unit to mount the chip solder, which is supplied from the component supply unit, on the board, based on production data in which a size of chip solder to be mounted on each electrode of the board is instructed.

An electronic component mounting system includes a screen printing device, an inspection device, an electronic component mounting device, a feedback part that generates, based on inspection data formed by the inspection device, first information about corrections on control parameters pertinent to positioning of a mask to a substrate in the screen printing device, and a feedforward part that generates, based on the inspection data, second information about corrections on electronic component mount coordinates in the electronic component mounting device. The feedback part generates the first information based on the first print displacement value. The feedforward part generates the second information based on the second print displacement value.

In mounting position correction of detecting a position of printed solder, calculating a positional-shift amount between a position of an electrode and the position of the printed solder, and correcting a mounting position based on the calculated positional-shift amount, when a correction amount based on the calculated positional-shift amount exceeds a limit value which indicates an upper limit of the correction amount which is defined and allowed in mounting information, the electronic component is mounted on the mounting position which is corrected by considering the limit value as the correction amount. Accordingly, it is possible to appropriately employ mounting position correction by considering a solder printing position as a reference in accordance with the degree of printing position shift, and to obtain an expected joint quality improvement effect.

An electronic component is mounted on a substrate according to a mounting mode which is set in advance in the following mounting information when component mounting work is performed. In the mounting information, any one of a first mounting mode in which an electronic component is transferred and mounted to a mounting position which is corrected based on a positional-shift amount between a position of printed solder and a position of an electrode and a second mounting mode in which the electronic component is transferred and mounted to the mounting position by considering only the position of the electrode as a reference, is set as a mounting mode for performance for each electronic component.

An electronic component is mounted on a substrate according to a mounting mode which is set in advance in the following mounting information&#x2014;when component mounting work is performed. In the mounting information, any one of a first mounting mode in which an electronic component is transferred and mounted to a mounting position which is corrected based on a positional-shift amount between a position of a printed solder and a position of an electrode and a second mounting mode in which the electronic component is transferred and mounted to the mounting position by considering only the position of the electrode as a reference, is set as a mounting mode for performance for each electronic component mounting device.

Growing community of inventors

Yamanashi, Japan

Katsuhiko Itoh