Matsushita Electric Works, Ltd.

Nakata Manufacturing Co., Ltd.

Katsuhiko Ito

Hidetsugu Motobe

Akinori Hibino

Hiroaki Yabuta

Satoshi Tsuruta

Katsumi Ishigaki

A compact tube clamping device for inspecting an electric resistance welded tube quality. A lifting/lowering base including a tube support body is provided onto a fixed base. Clamp claws sandwich the tube support body. A claw drive body lifting/lowering independently of the lifting/lowering base is provided in the lifting/lowering base. Opposite side portions of the claw drive body are connected to opposite clamp claws by links to turn the opposite clamp claws in closing directions by lowering with respect to the lifting/lowering base. A first drive mechanism for the lifting/lowering base and a second drive body for lifting/lowering the claw drive body are provided to the fixed base. A lowering stroke of the claw drive body necessary for closing operations of the clamp claws is partially born by lifting of the lifting/lowering base in transferring the tube, thereby suppressing the lowering stroke of the claw drive body.

Tube clamping device and hydraulic pressure tester technical field

An epoxy resin composition for use in producing a prepreg for printed wiring boards excellent in appearance, flame retardancy, etc., which comprises an epoxy resin, a phenolic novolak, and a curing accelerator. It is characterized in that the epoxy resin comprises an epoxy (a) and an epoxy (b), wherein the epoxy (a) is a brominated epoxy resin which is obtained by reacting/mixing a bisphenol A epoxy resin with tetrabromobisphenol A and has an epoxy equivalent of 350 to 470 g/eq and an n=0 component content of 20 to 35% in terms of areal percentage in a GPC chart, and the epoxy (b) is at least one bifunctional epoxy resin which is obtained by reacting any one selected from the group consisting of bisphenol A, bisphenol F, and tetrabromobisphenol A with epichlorohydrin and has an n=0 component content as determined from a GPC chart of 60% or higher.

Resin composition for printed wiring board, prepreg, and laminate obtained with the same

An epoxy resin composition for printed wiring boards which comprises an epoxy resin, a phenolic novolak, a curing accelerator, and a silica filler, characterized in that the silica filler has a shape having at least two planes and has an average particle diameter of 0.3 to 10 &#x3bc;m and a specific surface area of 8 to 30 m/g. The epoxy resin composition has a higher apparent viscosity than the resins and can hence be inhibited from sagging in a drying oven. This composition retains the intact property of infiltration into reinforcements because the viscosity of the resins themselves has not increased locally. The composition hence produces the effect of improving the appearance of a prepreg.

Growing community of inventors

Osaka, Japan

Katsuhiko Ito