Murata Manufacturing Co., Ltd.

Katsuhiko Fujikawa

Yuichi Ito

Taro Hirai

Nobumitsu Amachi

Kazushige Sato

Shingo Funakawa

Koji Tanaka

Toshifumi Oida

Ken Okada

Akihiro Ochii

Nobuyoshi Okuda

Yoshirou Satou

An antenna-integrated wireless module comprises a substrate having a first surface and including a wireless region and an antenna region. A wireless functional section is in the wireless region and includes an RF circuit on the first surface or in the substrate. An antenna section is in the antenna region and includes an antenna conductor. A resin sealing layer covers at least a part of the first surface. A thickness of the resin sealing layer in a portion overlapping the antenna region may be thinner than a thickness of the resin sealing layer in a portion overlapping the wireless region such that the resin sealing layer may have a step at a location between the wireless region and the antenna region; or the substrate may have a step at a boundary between the wireless region and the antenna region, and the resin sealing layer may not the cover the step.

Antenna-integrated wireless module and method for manufacturing antenna-integrated wireless module

A circuit module () includes a substrate () having a principal surface (), a first component () mounted on the principal surface (), and a sealing resin portion () that covers at least a side surface of the first component () while covering the principal surface (). The first component () includes an empty portion () and a connection portion () exposed to the empty portion (). The sealing resin portion () is arranged to avoid at least a part of a region that is included in an upper surface of the first component () and corresponds to the empty portion ().

Circuit module

A circuit module () includes a first substrate (), a first module (), a sealing resin portion (), and a conductive material film (). The first substrate () has a first principal surface (). The first module () is mounted on the first principal surface (). The sealing resin portion () is formed on the first principal surface () and covers the first module (). The conductive material film () covers a side of the sealing resin portion (). The first module () includes a conductive material portion and a device which may produce heat and which is mounted on the conductive material portion. The conductive material portion connects with the conductive material film () on the side of the sealing resin portion ().

Circuit module and method of manufacturing the same

An antenna-integrated wireless module is provided which does not need a metal case, and which can realize size reduction. A shield layer is formed on an upper surface of a resin sealing layer, which is disposed on one principal surface of a substrate and which covers a wireless region and an antenna region, such that the shield layer does not cover a portion of the resin sealing layer, the portion being positioned directly above the antenna region. Hence the shield layer formed on the upper surface of the resin sealing layer on the side covering the wireless region can serve to suppress electromagnetic waves radiated from a wireless functional section, which is disposed in a region overlapping the wireless region when looking at the module in a plan view, and which includes an RF circuit disposed at least on the one principal surface of the substrate or inside the substrate.

A wiring board module includes a multilayer wiring board. A crystal oscillator and an IC component, for example, are mounted on the mounting surface of the multilayer wiring board. Mounting lands for the IC component, mounting lands for the crystal oscillator, and mounting lands for other surface mount components are provided on the mounting surface. Each mounting land for the crystal oscillator is not a conventional single large-area land but is defined by four adjacent land pieces. The four land pieces are electrically connected via an external terminal of the crystal oscillator, thereby functioning as a mounting land for the external terminal. In other words, each of the plurality of mounting lands provided at locations corresponding to external terminals of the crystal oscillator is divided into four land pieces.

Wiring board and wiring board module

On a mounting surface of a multilayered component as a surface mounting component, an isolated electrode is arranged so as to be isolated from other terminal electrodes on the mounting surface. For solder applied to the isolated electrode, the application range can be securely limited to an area within the isolated electrode.

Growing community of inventors

Kyoto, Japan

Katsuhiko Fujikawa