Denso Corporation

Nippondenso Co., Ltd.

Katsuaki Kojima

Toshihiro Miyake

Koji Kondo

Yoshitaro Yazaki

Makoto Totani

Futoshi Ishikawa

Junji Ishikawa

Nobumasa Ishida

Katuhiko Murakawa

Hiroyasu Iwama

Seiji Amakusa

Tomohiro Yokochi

Takehito Teramae

Tomoyuki Nanami

Kenzo Hirano

An interconnection structure has a first printed circuit board including an insulating substrate made of a thermoplastic resin and a first board conductive pattern with a land, a second printed circuit board overlapped with the first printed circuit board, and including a second board conductive pattern with a land that is electrically interconnected with the land of the first printed circuit board to form an interconnection portion between the first board conductive pattern and the second board conductive pattern. A part of the thermoplastic resin constituting the insulating substrate of the first printed circuit board extends to seal the interconnection portion. The insulating substrate of the first printed circuit board is adhered to an insulating substrate of the second printed circuit through an adhesion enhancing layer in which a material for lowering a modulus of elasticity of the insulating substrate of the first printed circuit board is dispersed therein.

Interconnection structure for interconnecting printed circuit boards

A PEI film to be bonded is disposed on a glass epoxy substrate through an alkane film, and a position to be adhered is heated to a temperature not less than the glass transition point Tg of the PEI film, thereby forming an adhesion-improving layer in which the alkane is dispersed into the PEI film, in the PEI film at the interface with the glass epoxy substrate. That is, the PEI film is bonded to the glass epoxy substrate through the adhesion-improving layer. Therefore, an adhesive strength is improved because the adhesion-improving layer has an elastic modulus lower than that of the PEI film.

Bonding method and bonding structure of thermoplastic resin material

In interconnecting printed circuit boards: preparing a first and second printed circuit board is accomplished with the first having an insulating substrate of thermoplastic resin and a conductive pattern with a land, while the second has a conductive pattern with a land; overlapping the land of the first with the land of the second is done to form an interconnection portion; and heating the interconnection portion at a temperature approximately higher than a glass transition temperature of the thermoplastic resin while applying pressure to the interconnection portion to create an electrical interconnection sealed with a part of the thermoplastic resin constituting the insulating substrate of the first board is accomplished. The insulating substrate of the first board is overlapped with an insulating substrate of the second printed board to interpose a film, the film including material to reduce a modulus of elasticity of the insulating substrate of the first board.

Method for interconnecting printed circuit boards and interconnection structure

Disclosed are an electroless copper plating solution comprising a copper ion, a copper ion-complexing agent, a reducing agent and a pH-adjusting agent, the plating solution comprising a trialkanolmonoamine or a salt thereof as a complexing agent and accelerator in an amount giving a higher copper deposition speed than the copper deposition speed obtained when the trialkanolmonoamine or salt thereof is present in an amount sufficient to complex the copper ion but not enough to function as the accelerator, and 1.2.times.10.sup.-4 to 1.2.times.10.sup.-3 mole/l of an iron ion compound as a reaction initiator and/or 1.92.times.10.sup.-4 to 1.92.times.10.sup.-3 mole/l of at least one compound selected from the group consisting of pyridazine, methylpiperidine, 1,2-di-(2-pyridyl)ethylene, 1,2-di-(pyridyl)ethylene, 2,2'-dipyridylamine, 2,2'-bipyridyl, 2,2'-bipyrimidine, 6,6'-dimethyl-2,2'-dipyridyl, di-2-pyridylketone, N,N,N',N'-tetraethylethylenediamine, napththalene, 1,8-naphthyridine, 1,6-naphthyridine, tetrathiafurvalene, .alpha.,.alpha.,.alpha.-terpyridine, phthalic acid, isophthalic acid and 2,2'-dibenzoic acid as an agent for improving the physical properties of a plating film, and a process for forming an electroless copper deposition film by using this electroless copper plating solution.

Electroless copper plating solution and process for formation of copper

Disclosed are an electroless copper plating solution comprising a copper ion, a copper ion-complexing agent, a reducing agent and a pH-adjusting agent, the plating solution comprising a trialkanolmonoamine or a salt thereof as a complexing agent and accelerator in an amount giving a higher copper deposition speed than the copper deposition speed obtained when the trialkanolmonoamine or salt thereof is present in an amount sufficient to complex the copper ion but not enough to function as the accelerator, and 1.2.times.10.sup.-4 to 1.2.times.10.sup.-3 mole/l of an iron ion compound as a reaction initiator and/or 1.92.times.10.sup.-4 to 1.92.times.10.sup.-3 mole/l of at least one compound selected from the group consisting of pyridazine, methylpiperidine, 1,2-di-(2-pyridyl)ethylene, 1,2-di-(pyridyl)ethylene, 2,2'-dipyridylamine, 2,2'-bipyridyl, 2,2'-bipyrimidine, 6,6'-dimethyl-2,2'-dipyridyl, di-2-pyridylketone, N,N,N',N'-tetraethylethylenediamine, naphthalene, 1,8-naphthyidine, 1,6-naphthyridine, tetrathiafurvalene, .alpha.,.alpha.,.alpha.-terpyridine, phthalic acid, isophthalic acid and 2,2'-dibenzoic acid as an agent for improving the physical properties of a plating film, and a process for forming an electroless copper deposition film by using this electroless copper plating solution.

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Nagoya, Japan

Katsuaki Kojima