Mitsui Toatsu Chemicals, Incorporated

Amdahl Corporation

Katsuaki Iiyama

Akihiro Yamaguchi

Shoji Tamai

Saburo Kawashima

Masahiro Ohta

Hideaki Oikawa

Tadashi Asanuma

Kouji Ohkoshi

Masao Yoshikawa

Hideaki Okikawa

Wataru Yamashita

Yuichi Okawa

Yoshihiro Sakata

A fatigue-resistant polyimide resin composition comprising 100 parts by weight of polyimide having from 0.5 (exclusive) to 1.0 (inclusive) mole ratio of recurring structural units represented by the formula (1) and from 0 (inclusive) to 0.5 (exclusive) mole ratio of recurring structural units represented by the formula (2): ##STR1## wherein X is ##STR2## in the formulas (1) and (2), and having an inherent viscosity of 0.45 dl/g or more; and 5.about.65 parts by weight of a carbon fiber, glass fiber, aromatic polyamide fiber and/or potassium titanate fiber, and an injection molded article having a high fatigue resistance.

Polyimide resin composition having excellent fatigue resistance and

In one aspect, the present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carrying out condensation of 4,4'-bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a different diamine compound and optionally with a different tetracarboxylic acid dianhydride. In a second aspect, the present invention relates to a heat resistant resin composition consisting essentially of an aromatic polyetherimide and a defined polyimide. In a third aspect, the present invention relates to a polyimide resin composition comprised on a defined polyimide and a separate high-temperature engineering polymer. In a fourth aspect, the present invention relates to a resin composition comprised of a defined polyimide and an aromatic polyamideimide.

Polyimides, process for the preparation thereof and polyimide resin

A polyimide-based heat-resistant adhesive having excellent peel strength and heat resistance comprising polyimide composed of 10 to 99% by mole of structural units having the formula (1) and 1 to 90% by mole of structural units having the formula (2) or comprising polyamic acid precursor which corresponds to the polyimide. ##STR1##

Heat-resistant adhesive

The heat resistant adhesive of the invention comprises polyamic acid and/or polyimide which are prepared by using 1,3-bis(3-aminophenoxy)benzene as an aromatic diamine component and 3,3',4,4'-biphenyltetracarboxylic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride and/or 3,3',4,4'-diphenylethertetracarboxylic dianhydride as tetracarboxylic acid dianhydrides, and further by blocking the polymer chain end with dicarboxylic anhydride or a monoamine compound; or comprises a polyimide solution containing the polyimide in a good solvent. The adhesive of the invention is a heat-resistant adhesive capable of adhering under mild temperature/mild pressure conditions. The adhesive of polyimide solution can provide desired adhesion by simple procedures such as applying to the adherend and heating under pressure and exhibits excellent adhesive strength. Consequently, the heat-resistant adhesive of the invention is very useful for the adhesion of structural and electronic materials and other industrial materials.

Heat-resistant adhesive and method of adhesion by using adhesive

The heat resistant adhesive of the invention comprises polyamic acid and/or polyimide which are prepared by using 1,3-bis(3-aminophenoxy)benzene as an aromatic diamine component and 3,3', 4,4'-biphenyltetracarboxylic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride and/or 3,3',4,4'-diphenylethertetracarboxylic dianhydride as tetracarboxylic acid dianhydrides, and further by blocking the polymer chain end with dicarboxylic anhydride or a monoamine compound; or comprises a polyimide solution containing the polyimide in a good solvent. The adhesive of the invention is a heat-resistant adhesive capable of adhering under mild temperature/mild pressure conditions. The adhesive of polyimide solution can provide desired adhesion by simple procedures such as applying to the adherend and heating under pressure and exhibits excellent adhesive strength. Consequently, the heat-resistant adhesive of the invention is very useful for the adhesion of structural and electronic materials and other industrial materials.

This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin compositions of this invention comprises 99.9 to 50.0% by weight of the polyimide and 0.1 to 50.0% by weight of polyphenylene sulfide and/or aromatic polysulfone and/or aromatic polyetherimide high-temperature engineering polymer. The polyimide consists essentially of recurring units of the following formula: ##STR1##

Polyimide resin composition

This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin composition of this invention comprises 99.9 to 50% by weight of the polyimide and 0.1 to 50% by weight of high temperature engineering polymer. The polyimide has recurring units of the following formula: ##STR1## wherein X is a sulfonyl radical or a carbonyl radical and R is a tetravalent radical selected from an aliphatic radical, alicyclic radical, monoaromatic radical, condensed aromatic radical and non-condensed aromatic radical. R is, for example, ##STR2## The high temperature engineering polymer is, for example, polyphenylene sulfide consisting of recurring units of the formula: ##STR3## aromatic polysulfone consisting of recurring units of the formula: ##STR4## or aromatic polyetherimide consisting of recurring units of the formula: ##STR5##

Disclosed is a process for preparing a polyimide by reacting certain reactants. The reactants include an aromatic diamine which is 3,3'-diaminobenzophenone and/or bis(3-aminophenyl)sulfone, a tetrocarboxylic dianhydride and a dicarboxylic anhydride. A thermally stable polyimide can be obtained which displays excellent processability.

Process for preparing polyimide having excellent high temperature

This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin compositions of this invention comprises 99.9 to 50.0% by weight of the polyimide and 0.1 to 50.0% by weight of aromatic polyamideimide. The polyimide consists essentially of recurring units of the following formula: ##STR1## wherein X is ##STR2## and R is, for example, ##STR3##

Polyimide/polyamideimide resin composition

A process for preparing a polyimide by reaction of a diamine and a tetracarboxylic dianhydride to obtain a polyamide acid and subjecting the polyamide acid to conversion into a polyimide thermally or chemically. The reaction in the process is carried out in the presence of at least one dicarboxylic anhydride selected from the group consisting of aliphatic dicarboxylic anhydrides and aromatic dicarboxylic anhydrides, and the amount of the tetracarboxylic dianhydride is in the range of from 0.9 to 1.0 mole per mole of the diamine and the amount of the dicarboxylic anhydride is in the range of from 0.001 to 1.0 mole per mole of the diamine. The resultant polyimides exhibit good thermal stability at high temperatures and good forming processability even at low temperatures.

Process for preparing polyimides

This invention relates to a novel polyimide which is high-temperature resistant and capable of being molded in a fused state. This invention also relates to a high-temperature adhesive using the polyimide. The polyimide consists essentially of recurring units of the formula: ##STR1## where R is a tetra-valent radical selected from the group consisting of an aliphatic radical having 2 or more carbon atoms, alicyclic radical, monoaromatic radical, condensed polyaromatic radical, and non-condensed polyaromatic radical wherein aromatic radicals are linked to one another directly or via a bridge member. The polyimide can be prepared by reacting bis[4-(4-aminophenoxy)phenoxy)phenyl] sulfone with a tetracarboxylic dianhydride in an organic solvent and imidizing the resultant polyamic acid. Various tetracarboxylic dianhydrides can be used and preferred dianhydride are pyromellitic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride, bis(3,4-diarboxyphenyl) ether dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, and 4,4'-(p-phenylenedioxy)diphthalic dianhydride.

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Odawara, Japan

Katsuaki Iiyama