Denso Corporation

Toyota Jidosha Kabushiki Kaisha

Mirise Technologies Corporation

Kabushiki Kaisha Toyota Chuo Kenkyusho

Katsuaki Goto

Shota Harada

Yuuki Inagaki

Keitaro Ito

Takahiko Yoshida

Yusuke Kawai

Teruhisa Akashi

Hirofumi Funabashi

Hideaki Nishikawa

Motohiro Fujiyoshi

Takashi Katsumata

Yoshiteru Omura

Keiichi Shimaoka

Tomoya Jomori

Takashi Ozaki

Megumi Suzuki

Norio Fujitsuka

Yoshiyuki Hata

In a method for manufacturing a micro vibration body having a three-dimensional curved surface, a mold defining a recess part is prepared, and a plate-shaped reflow material is arranged on the mold so as to cover the recess part. Pressure of a space defined by the recess part covered with the reflow material is reduced, and the reflow material is deformed by heating from an upper surface side opposite to a lower surface facing the recess part and by means of the pressure reduced. When the reflow material is deformed, a part of the mold is heated and/or cooled. As another example, when the reflow material is deformed, a mold having a different heat capacity portion is used to generate a temperature gradient in the mold.

Micro vibration body having three-dimensional curved surface shape and method for manufacturing the same

A mounting structure includes a micro vibrator and a mounting substrate. The micro vibrator includes a curved surface portion having an annular curved surface and a connecting portion extending from the curved surface portion toward an inner center position of the curved surface portion. The micro vibrator is disposed so that the connecting portion is bonded to the mounting substrate and the curved surface portion is in a hollow state free from other elements. The mounting substrate includes a plurality of electrode portions that are arranged to face and surround a rim of the curved surface portion of the micro vibrator, and spaced apart from each other, the rim being an end of the curved surface portion opposite to the connecting portion. Further, the mounting substrate includes a guard electrode.

Mounting structure of micro vibrator

In a mounting structure, a micro vibrator has: a curved surface portion having a hemispherical curved surface; a connecting portion extending from the curved surface portion toward a center of a hemispherical shape of the curved surface portion; and a surface electrode covering at least a part of the connecting portion and at least a part of the curved surface portion. A mounting substrate has two or more wirings and a part of the micro vibrator is connected to the mounting substrate. The wirings each have an electrode connection portion connected to a portion of the surface electrode covering the connecting portion at an end. The two or more wirings include a voltage application wiring and a voltage detection wiring. The voltage application wiring is spaced away from the voltage detection wiring on the mounting substrate.

A micro vibration body includes a curved surface portion, which has an annular curved surface, and a recessed portion, which is recessed from the curved surface portion. A mounting substrate includes an inner frame portion and electrode portions, which surround an inner frame portion. A joining member is provided in an inner region of the mounting substrate surrounded by the inner frame portion. The recessed portion of the micro vibration body has a bottom surface defining a mounted surface located in the inner region and joined to the mounting substrate via the joining member. The curved surface portion has a rim that includes an end portion of the curved surface portion on an opposite side to the recessed portion. The rim has a rim lower surface located on a same plane as the mounted surface or a tip end portion of the mounted surface.

Inertial sensor and method for manufacturing the same

A molding device may comprise a mold, a plate, and a ring. The mold may comprise: a lower surface; an upper surface parallel to the lower surface; a hole defined in a part of the upper surface; and a through hole extending from a bottom surface of the hole to the lower surface of the mold. The plate may comprise a surface with a gas outlet defined therein. The ring may be arranged between the lower surface of the mold and the surface of the plate and connecting the mold and the plate. The ring may surround the through hole exposed on the lower surface of the mold and the gas outlet exposed on the surface of the plate. In a region where the ring is not arranged, a space may be defined between the lower surface of the mold and the surface of the plate.

Molding device

A controller applies a predetermined voltage to a fixed part detection excitation electrode to vibrate a movable part in a second direction and simultaneously applies a predetermined voltage to a fixed part drive electrode to vibrate the movable part in a first direction. The controller acquires, of the movable part, a first resonance frequency along the first direction and a second resonance frequency along the second direction. The controller controls a drive spring adjustment part to adjust a spring constant of the drive spring, such that the first resonance frequency is maintained constant, and controls a detection spring adjustment part to adjust a spring constant of the detection spring such that the second resonance frequency is maintained constant. The controller detects the angular velocity based on a result of synchronously detecting signal from the fixed part detection electrode with the first resonance frequency.

Angular velocity sensor and angular velocity sensor system

A micro vibration body includes a curved surface portion, a recessed portion recessed from the curved surface portion, a bottom surface protruding portion protruding from a bottom surface of the recessed portion, and a through hole in the bottom surface protruding portion. A mounting substrate has a positioning recess, into which the bottom surface protruding portion is inserted, and electrode portions surrounding the inner frame portion. A joining member is in the positioning recess and joins the bottom surface protruding portion with the mounting substrate. The bottom surface is in contact with a region of the mounting substrate around the positioning recess. The bottom surface protruding portion has a tip end surface that is at a distance from the positioning recess. The joining member at least partially enters the through hole and is electrically connected to the conductive layer.

Inertial sensor

An inertial sensor includes a lower substrate and an upper substrate. The upper substrate includes a micro oscillator, electrodes and a pad, which are independent of each other. The micro oscillator includes a curved surface portion, a joint portion recessed inward from an apex of the curved surface portion and joined to a support portion of the lower substrate, a rim at an end of the curved surface portion and a conductive film covering the micro oscillator. The curved surface portion is in an aerial state. The rim is made of the same material as the electrodes, located on a virtual flat plane formed by the electrodes, and apart from and surrounded by the electrodes. A portion of the conductive film that covers the joint portion is electrically bonded to a lower metal film covering the support portion.

A vibration gyroscope includes: a mass part supported to be displaceable in a first direction and a second direction; an exciter vibrating the mass part in the first direction; and a detector detecting a displacement amount of the mass part in the second direction. The first direction and the second direction are orthogonal to each other. A resonance frequency of the mass part in the first direction coincides with a resonance frequency of the mass part in the second direction. A Q-factor of vibration of the mass part in the second direction is smaller than a Q-factor of vibration of the mass part in the first direction.

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Nisshin, Japan

Katsuaki Goto